JPH03242972A - Solid state image sensor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a solid-state imaging device.

[Conventional technology]

In recent years, improvements in semiconductor process technology have led to miniaturization of forming elements, and there is a trend toward higher integration and higher functionality of LSI chips. In addition, solid-state image sensors, which are imaging devices, have also been developed to increase the light-receiving area by highly integrating light-receiving elements, in order to improve resolution by miniaturizing light-receiving elements and to make video equipment such as video cameras smaller and lighter. The chip size of solid-state image sensors is becoming smaller.

A conventional mounting structure for a solid-state image sensor is mounted using a storage container 21 shown in FIGS. 6 and 7. FIG. 6 shows an external view of a conventional solid-state imaging device, and FIG. 7 shows a cross-sectional structural diagram of the conventional solid-state imaging device.

21 is a storage container, 22 is an electrode lead, and 23 is a transparent glass plate. The storage container 21 is made of ceramic and has the same external shape as a DIP used for mounting general LSI chips.
It is a type. An electrode 122 made of Kovar is provided on the outer periphery of the storage container 21 having a ceramic multilayer structure by Ag brazing. An internal electrode 27 facing the connection electrode 26 of the solid-state image sensor 25 is formed around the die attach part inside the storage container 21.
5 is adhered to a predetermined position of the die attach part of the storage container 21 with a conductive resin 28, and the connection electrode 26 of the solid-state image sensor 25 and the internal electrode 27 of the storage container 21 are connected to a thin metal wire 29.
Electrical connections are made. A transparent glass plate 23 that transmits light to the light receiving area 24 of the solid-state image sensor is used to seal the storage container 21. Then, a predetermined adhesive area 3 is provided around the storage container 21 in order to adhere a transparent glass plate 23.
0, and the transparent glass plate 23 was sealed by resin adhesion or by electric welding with a metal seal ring provided around the transparent glass plate 23.

[Problem to be solved by the invention]

In order to make video/surveillance camera equipment smaller and lighter, it goes without saying that it is better for the storage container 21 in which the solid-state image sensor 25 is mounted to be smaller due to the optical constraints of the camera lens mounting section. .

For this reason, it is particularly preferable that the diagonal length of the storage container 21 be as small as possible. However, in the storage container 21 used for the conventional solid-state image sensor 25, an internal lead area for connecting the internal electrode 27 of the storage container 21 to the connection electrode 26 of the solid-state image sensor 25, and a transparent glass plate 23 are provided in the storage container. 2
An adhesive area 30 for adhesively sealing the light receiving surface of the storage container 21 is required on the outer periphery of the light receiving surface of the storage container 21, and the diagonal length of the storage container 21 is 180 to 400% of the diagonal length of the solid-state image sensor 25.
In the mounting structure of the solid-state image sensor 25 using the conventional storage container 21, there is a limit to reducing the diagonal length of the storage container 21. Therefore, the lens diameter becomes large, and since only the solid-state image sensor 25 is mounted in the storage container 21 and the circuit components that drive it are separate from the storage container 21, the solid-state image sensor 25 is not installed inside the camera equipment. Requires circuit components for driving and an area to mount them, which reduces reliability as the number of components increases and reduces the size and size of camera equipment.
Reducing weight was extremely difficult.

A first object of the present invention is to provide an extremely compact solid-state imaging device that makes it possible to reduce the weight and size of camera equipment.

The second objective is to eliminate the need for circuit components to drive the solid-state image sensor, which were previously indispensable in camera equipment, and the space required to mount them, and to significantly reduce the number of components. An object of the present invention is to provide a solid-state imaging device that makes it possible to realize extremely lightweight, compact, highly reliable, and low-cost camera equipment.

[Means to solve the problem]

In the solid-state imaging device according to claim (1), transparent glass is adhered to one end surface of a cylindrical frame to form a storage container, and the entire surface of the solid-state imaging device is provided with light-transmitting insulation on the inner surface of the transparent glass. The lead member is adhesively fixed with resin and connected to the connection electrode of the solid-state image sensor, then bent along the side of the solid-state image sensor, led out from the storage container, and the inside of the storage container is filled with light-shielding insulating resin. In the solid-state imaging device according to claim (2), a storage container is formed by adhering transparent glass to one end surface of a cylindrical frame, and the entire surface of the solid-state imaging device is transparent to the inner surface of the transparent glass. A circuit board mounted with multiple circuit components bonded and fixed with an insulating resin and inscribed in a storage container is installed on the back side of the solid-state image sensor, and a lead member and circuit are bent along the side of the solid-state image sensor. It is characterized in that it is connected to the connection electrode of the substrate, and the inside of the storage container is filled with a light-shielding insulating resin.

[Effect]

According to the configuration described in claim (1), the leads of the solid-state image sensor are placed inside the storage container in which light-transmitting glass is sealed in one opening of the cylindrical frame, along the side surface of the solid-state image sensor. Then, the solid-state image sensor is bent toward the other surface, and the transparent glass plate provided in one opening of the storage container and the light-receiving area surface formed on the main surface of the solid-state image sensor are adhesively fixed with a translucent insulating resin. By filling the inside of the storage container, which includes the entire other surface of the solid-state image sensor, with an opaque insulating resin, the internal lead area and transparent glass plate are sealed, which was a major problem in sealing conventional storage containers. This eliminates the need for a bonding area for bonding, making it possible to obtain an extremely compact solid-state imaging device, and making it possible to realize compact and lightweight camera equipment.

According to the structure set forth in claim (2), in the structure set forth in claim (1), a structure in which a circuit board on which circuit components for driving the solid-state image sensor are mounted is mounted in the storage container together with the solid-state image sensor, It eliminates the need for circuit components to drive the solid-state image sensor, which were previously indispensable in camera equipment, and the space required to mount them.Furthermore, the number of components is significantly reduced, making it extremely lightweight and compact. This makes it possible to realize highly reliable and low-cost camera equipment with an extremely simple structure.

〔Example〕

A first embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3.

FIG. 1 is a block diagram of a solid-state imaging device according to a first embodiment of the present invention, FIG. 2 is a mounting process diagram of a solid-state imaging device and a film carrier according to the present invention, and FIG.
FIG. 2 is a cross-sectional structural diagram of a solid-state imaging device in an example. 1
is a solid-state image sensor, 2 is a storage container, 3 is a film lead,
4 is an opening, 5 is a transparent glass plate, and 6 is a light receiving area.

The inner diameter of the storage container 2 that houses the solid-state image sensor 1 is equal to the diagonal length of the solid-state image sensor 1, and the solid-state image sensor 1 is mounted inside the container 2 using a film carrier mounting method. The film lead 3 of the solid-state image sensor l is
As shown in FIG. 2(a), the connection electrode (not shown) of the solid-state image sensor l and the film lead 3 of the film carrier 13 are connected by pressure contact (FIG. 2(b)), and then punched out from the film carrier 13. At the same time, film lead 3
is bent along the side surface of the solid-state image sensor 1 toward the other surface of the solid-state image sensor 1 (FIG. 2(C)). film lead 3
The solid-state image sensor 1, which has been bent, is bonded to the transparent glass plate 5 provided in the opening 4 of the storage container 2 with the light-receiving area 6 surface of the solid-state image sensor 1 using a translucent insulating resin 7. The entire other surface of the solid-state image sensor 1 is sealed with a light-shielding insulating resin 8 in order to prevent characteristic deterioration of the solid-state image sensor l due to the external environment and to prevent diffuse reflection of light to the light-receiving area 6 of the solid-state image sensor 1. conduct.

The above embodiment was an example in which only the solid-state image sensor 1 was mounted inside the storage container 2, but in recent years, with the aim of making camera equipment smaller and lighter, and making the equipment more reliable and lower in cost, it has been mounted on equipment. Efforts are being made to reduce the number of parts. In a second embodiment of the present invention, a solid-state image sensor and circuit components for driving the same are mounted together with the solid-state image sensor in a storage container.

Next, a second embodiment of the present invention will be described with reference to FIGS. 4 and 5.

FIG. 4 is a block diagram of a solid-state imaging device according to a second embodiment of the invention, and FIG. 5 is a cross-sectional structural diagram of the solid-state imaging device according to the second embodiment. Similar to the first embodiment, a transparent glass plate 5 is sealed in the opening 4 of the storage container 2a, which has an inner diameter equal to the diagonal length of the solid-state image sensor l, and a film carrier is mounted inside. A solid-state image sensor 1 is mounted.

The film lead 3a connected to the connection electrode (not shown) of the solid-state image sensor 1 is bent toward the other surface of the solid-state image sensor 1 along the side surface of the solid-state image sensor 1, and the opening 4 of the storage container 2 is bent.
A light-receiving area 6 of the solid-state image sensor 1 is formed on a transparent glass plate 5 provided in the
The surfaces are adhered with a translucent insulating resin 7. A circuit component 9 for driving the solid-state image sensor 1 is mounted on a circuit board 11 whose diameter is the diagonal length of the solid-state image sensor 1. The circuit board 11 is formed with a connection hole 10 that faces a film lead 3a connected to a connection electrode (not shown) of the solid-state image sensor l. The tip of the film lead 3a is inserted into the connection hole 10 of the circuit board 11 and connected to the external electrode 12 by soldering. The entire other surface of the solid-state image sensor 1 is used to prevent characteristic deterioration of the solid-state image sensor 1 and the circuit components 9 mounted on the circuit board 11 due to the external environment, and to prevent diffuse reflection of light to the light-receiving area 6 of the solid-state image sensor 1. Therefore, sealing is performed using a light-shielding insulating resin 8.

With the above structure, the solid-state imaging device can be miniaturized to the utmost, and a camera device that is extremely compact and lightweight can be realized.

Further, a circuit board 11 on which a circuit component 9 for driving the solid-state image sensor l is mounted is placed in a storage container 2 together with the solid-state image sensor l.
The structure of mounting on the A eliminates the need for circuit components to drive the solid-state image pickup device, which were previously indispensable in camera equipment, and the space required to mount them, and further reduces the number of components. This reduction makes it possible to realize highly reliable and low-cost camera equipment with an extremely simple structure.

In addition, although the shape of the storage containers 2 and 2a in 4J in the first and second embodiments is circular, the shape is not limited to the circular shape, and similar to the external shape of the solid-state image sensor 1, the storage container can be square. Needless to say, the same effect can be obtained by using .

〔Effect of the invention〕

The solid-state imaging device according to claim (1) makes it possible to downsize the solid-state imaging device, making it possible to realize a compact and lightweight camera device.

The solid-state imaging device according to claim (2) not only makes it possible to miniaturize the solid-state imaging device, making it possible to realize extremely small and lightweight camera equipment, but also allows the camera equipment to incorporate elements that were previously indispensable. The circuit components used to drive the solid-state image sensor and the space required to mount them are no longer required, resulting in a significant reduction in the number of components.
Highly reliable and low-cost camera equipment can be realized with an extremely simple structure.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a solid-state imaging device according to a first embodiment of the present invention, FIG. 2 is a mounting process diagram of a solid-state imaging device and a film carrier according to the present invention, and FIG.
FIG. 4 is a configuration diagram of a solid-state imaging device according to a second embodiment of the present invention, and FIG. 5 is a cross-sectional diagram of a solid-state imaging device according to a second embodiment of the present invention. FIG. 6 is an external view of a conventional solid-state imaging device, and FIG. 7 is a cross-sectional structural diagram of the conventional solid-state imaging device. DESCRIPTION OF SYMBOLS 1... Solid-state image sensor, 2, 2a... Storage container, 3°3a... Film lead, 4... Opening, 5...
Transparent glass plate, 6... Light receiving area, 7... Transparent insulating resin, 88a... Light blocking insulating resin, 9... Circuit component, 10... Connection hole, 11... Circuit board , 12...
External electrode, 13...Film carrier 1 2 Fig. 2 (a) (b) Fig. (C) Fig. 5 Fig. 8 b 1

Claims (2)

[Claims] (1) A storage container is formed by adhering transparent glass to one end surface of a cylindrical frame, one principal surface of a solid-state image sensor is adhesively fixed to the inner surface of the transparent glass with a translucent insulating resin, and the A solid state characterized in that a lead member connected to a connection electrode of a solid-state image sensor is bent along a side surface of the solid-state image sensor, led out from the storage container, and the inside of the storage container is filled with a light-shielding insulating resin. Imaging device. (2) A circuit board equipped with a plurality of circuit components inscribed in a storage container is installed on the back side of the solid-state image sensor, and the lead member bent along the side surface of the solid-state image sensor is connected to the circuit board. Claim (1) characterized in that the electrodes are connected to each other.
) solid-state imaging device.