JPH03243736A - Copper alloy material for lead frame having excellent workability in pressing - Google Patents
Copper alloy material for lead frame having excellent workability in pressingInfo
- Publication number
- JPH03243736A JPH03243736A JP4056790A JP4056790A JPH03243736A JP H03243736 A JPH03243736 A JP H03243736A JP 4056790 A JP4056790 A JP 4056790A JP 4056790 A JP4056790 A JP 4056790A JP H03243736 A JPH03243736 A JP H03243736A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- plate thickness
- lead frame
- press
- alloy material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 20
- 239000000956 alloy Substances 0.000 title claims description 16
- 238000003825 pressing Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 25
- 230000009467 reduction Effects 0.000 claims description 25
- 238000009864 tensile test Methods 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910017985 Cu—Zr Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000270730 Alligator mississippiensis Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明は、特にリードフレームを高速精密プレスで打抜
いて製造する所謂スタンピング製法において極めて優れ
た打抜き成形性を発揮し得るリードフレーム用銅合金材
料に関するものである。Detailed Description of the Invention [Industrial Application Field 1] The present invention is directed to a copper alloy for lead frames that can exhibit extremely excellent stamping formability, particularly in the so-called stamping manufacturing method in which lead frames are manufactured by punching them with a high-speed precision press. It's about materials.
［従来の技術］
近年、半導体装置は高機能化、大容量化、高信頼性化へ
の要求が高まり、例えばＩＣにおいても高集積化あるい
は高密度実装化が進められつつある。[Background Art] In recent years, there has been an increasing demand for semiconductor devices to have higher functionality, larger capacity, and higher reliability, and for example, higher integration or higher density packaging is being promoted in ICs.
このような半導体装置においてリード素子となるリード
フレームが極めて重要な部品となりつつあることはいう
までもない、半導体用リードフレームとしては、導電性
が良好でなければならないことは勿論であるが、機械的
強度も同時に必要であり、しかも適当な延性を保持する
上、耐熱性をも要求されるなど、様々な特性を満足する
ことが求められている。It goes without saying that lead frames, which serve as lead elements in such semiconductor devices, are becoming extremely important components.As a lead frame for semiconductors, it goes without saying that they must have good electrical conductivity, but they must also have good electrical conductivity. Materials are required to satisfy various properties, such as physical strength, heat resistance, and appropriate ductility.
このような背景から、銅系リードフレーム用として種々
な銅合金が開発され、実用に供されている。Against this background, various copper alloys have been developed and put into practical use for copper-based lead frames.
［発明が解決しようとする課題］
従来より提案されてきているリードフレーム用銅合金は
、銅の優れた導電性やその比較的良好な機械的性質に着
目するものであり、専電率の低下を小さくシシかも機械
的強度を向上させるために、固溶度の小さい元素を合金
として添加し、溶体化加熱処理及びその後の時効析出処
理を行なう種類の銅合金が主流を占めている。そして、
そのための添加元素の選定や加工技術など数多くの提案
がなされてきた。[Problems to be Solved by the Invention] Copper alloys for lead frames that have been proposed in the past focus on the excellent conductivity of copper and its relatively good mechanical properties, and are In order to reduce the size and improve the mechanical strength, copper alloys in which elements with low solid solubility are added as an alloy and subjected to solution heat treatment and subsequent aging precipitation treatment are the mainstream. and,
Many proposals have been made for this purpose, including the selection of additive elements and processing techniques.
そのような銅合金をリードフレームに成形するには、一
部にエツチング法などの提案もなされてはいるものの、
量産性とコスト低減の上からすれば、高速精密プレスに
よる打抜き成形すなわちスタンピングが主体となる。こ
のため、昨今では金型の製造にもＣＡＤやＣＡＭを導入
し、微細形状の成形に対応しようとする試みも行なわれ
るようになった。Although some methods such as etching have been proposed to form such copper alloys into lead frames,
From the viewpoint of mass production and cost reduction, punching using a high-speed precision press, that is, stamping, is the main method. For this reason, in recent years, attempts have been made to introduce CAD and CAM into the manufacturing of molds to cope with molding of fine shapes.
しかし、そのような金型の製造技術の向上もさることな
がら、リードフレームの多ビン化への志向は非常に強く
、しかもパッケージ化するに当り、素子自体が大型化し
つつあるにも拘らず外形からの全体形状を小型化するこ
とが求められるといった実情にあり、微細なパターンの
リードフレームを上記スタンピングによって製造するこ
とが要望されるようになった。However, in addition to improvements in mold manufacturing technology, there is a strong desire to increase the number of lead frames with multiple bins, and when it comes to packaging, even though the devices themselves are becoming larger, Due to the current situation where it is required to downsize the overall shape of a lead frame, it has become desirable to manufacture a lead frame with a fine pattern by the stamping method described above.
しかし、このような現状にも拘らず、リードフレーム材
料自体の打抜き性に着目した提案は未だ見られず、プレ
ス時の打抜精度の向上やそのための金型の寿命確保につ
いては、専らプレス機械の調整に依存しようとしている
のが実情である。However, despite this current situation, there are still no proposals that focus on the punchability of the lead frame material itself, and improvements in punching accuracy during pressing and ensuring the lifespan of molds for this purpose are focused solely on press machines. The reality is that we are trying to rely on the adjustment of
本発明の目的は、上記したような状況にかんがみ、金型
やプレス機械の面からのアプローチによる代りに、プレ
スされる材料そのものに着目し、リードフレームのパタ
ーンが微細化しても、優れた打抜き成形性を発揮し、精
度よいプレス性を保持することにより金型の寿命をも格
段に伸ばし得るプレス成形性に優れた新規なリードフレ
ーム用銅合金材料を提供しようとするものである。In view of the above-mentioned situation, the purpose of the present invention is to focus on the material itself to be pressed instead of approaching from the perspective of molds and press machines, and to achieve excellent punching even when the pattern of the lead frame becomes finer. The present invention aims to provide a novel copper alloy material for lead frames that exhibits excellent press formability and can significantly extend the life of a mold by maintaining precise pressability.
［課題を解決するための手段］
本発明は、高速精密プレスにより打抜成形して使用する
銅合金材料自体の特性に着目するものであって、材料を
板状としこれを引張試験により引張破断させた際に、引
張り前の板厚をＴ、引張りにより破断部が絞られて破断
した後の絞り破断端部の板厚をｔとしたとき、その板厚
絞りすなわち（Ｔ−ｔ）／Ｔが８０％以下である特性を
保有させるようにしたものであり、そのための具体的な
合金として、Ｚｒを０．０１〜０．２重量％含有し、残
部が不可避なる不純物よりなる銅合金からなり、引張試
験における破断強度が
４５ｈｇｆ／ｃｍ”以上、伸びが６％以上であって、か
つ破断時の板厚絞りが８０％以下であるような特性を保
有させた銅合金材料を提供するものである。[Means for Solving the Problems] The present invention focuses on the characteristics of the copper alloy material itself, which is punched and formed using a high-speed precision press. When the thickness of the plate before tension is T, and the thickness of the plate at the drawn fracture end after the rupture is narrowed and broken by tension is t, the plate thickness reduction, that is, (T-t)/T A specific alloy for this purpose is a copper alloy containing 0.01 to 0.2% by weight of Zr, with the remainder being unavoidable impurities. To provide a copper alloy material having properties such that the breaking strength in a tensile test is 45 hgf/cm" or more, the elongation is 6% or more, and the plate thickness reduction at break is 80% or less. be.
［作用］
発明者らは、微細精密プレスを可能にすることを検討す
るに当り、従来かえりみられなかった材料そのものの有
する特性に着目した。そして、試行錯誤の実験を繰返す
間に、引張試験における破断時の板厚絞りと材料のプレ
ス成形性の間に密接な関係のあることを見出した。[Function] When considering making micro-precision press possible, the inventors focused on the characteristics of the material itself, which had not been considered before. Through repeated trial and error experiments, we discovered that there is a close relationship between the thickness reduction at break in a tensile test and the press formability of the material.
種々な実験の結果、板厚絞りが小さいほど優れたプレス
性を示すことが判明し、リードフレーム用として精密微
細なプレスを可能にする臨界的板厚絞りが８０％にあり
、それ以下の板厚絞りを保有させることで、効率よくし
かも金型の寿命を大巾に伸ばしてブレス底形し得ること
を見出したのである。As a result of various experiments, it has been found that the smaller the plate thickness reduction, the better the pressability is.The critical plate thickness reduction that enables precision and fine pressing for lead frames is at 80%, and plates with lower thickness They discovered that by having a thick draw, it is possible to form a press bottom shape efficiently and greatly extend the life of the mold.
［実施例］ 以下に、本発明について実施例を参照し説明する。[Example] The present invention will be described below with reference to Examples.
第２図は、本発明にいう板厚絞りを定義するための説明
図である。FIG. 2 is an explanatory diagram for defining plate thickness reduction according to the present invention.
引張り前の板厚がＴである板材１０より引張試験片を作
製し、これを引張試験機で引張れば、破断部にネッキン
グが生じ、やがてその部分が絞られて行き、ついに破断
に至る。このときの絞り破断部１１の厚さをｔとする。A tensile test piece is prepared from the plate material 10 having a thickness of T before tensioning, and when this is pulled with a tensile tester, necking occurs at the fractured part, and the part is eventually squeezed, eventually leading to fracture. The thickness of the drawn fracture portion 11 at this time is assumed to be t.
板厚絞りとはこのときの板厚差（Ｔ−ｔ）の引張り前の
厚さＴに対する百分率すなわち（Ｔ−ｔ）／Ｔを％で表
したものである。The plate thickness reduction is the percentage of the plate thickness difference (T-t) at this time with respect to the thickness T before tension, that is, (T-t)/T expressed in %.
また、第１図は、リードフレーム用銅合金をプレス成形
した場合のプレス破面１の様子を示した説明見取図であ
る。Moreover, FIG. 1 is an explanatory sketch showing the appearance of a press fracture surface 1 when a copper alloy for a lead frame is press-formed.
プレスは、図中上方より行なわれ下方に打抜かれている
。プレスの初期から所定の厚さまでは材料の剪断すべり
による変形がもっばら先行し、外観において特有の模様
を示す剪断面１ａが形成されるが、全部が剪断変形のみ
で終るのではなく、プレスの後半の所定厚さ部分からは
破断荷重をもって破断せしめられ、いわば機械的に切り
裂かれた状態の破断面１ｂが形成される。この剪断面１
ａとＭＩ７ｉ面ｌｂとでは、外観的に明らかな差異があ
り、両者の境界は肉眼によっても一見明確に区別するこ
とができる。The press is performed from the top in the figure, and punching is performed from the bottom. From the initial stage of pressing up to a predetermined thickness, deformation due to shear slipping of the material takes precedence, forming a sheared surface 1a with a unique pattern in appearance, but it does not end entirely with shear deformation; From the latter half of the predetermined thickness portion, the material is broken by a breaking load, and a broken surface 1b is formed which is mechanically torn apart. This shear plane 1
There is a clear difference in appearance between a and MI7i surface lb, and the boundary between the two can be clearly distinguished even with the naked eye.
プレス成形性の良否とこの剪断面１ａおよび破断面１ｂ
の形成割合との間には密接な関係があり、発明者らの研
究によれば、優れたプレス製品を得るには、プレス破面
１に占める剪断面１ａが少なく、破断面１ｂを多く形成
し得る材料を入手する必要のあることがわかった。The quality of press formability and the sheared surface 1a and fractured surface 1b
There is a close relationship between the formation ratio of It was found that it was necessary to obtain materials that could be used.
発明者らは、この破断面１ｂの増大ひいては剪断面１ａ
の減少と、前述した板厚絞りとの間の密接な関係を見出
し本発明に到ったものである。The inventors discovered that the increase in the fracture surface 1b and the shear surface 1a
The present invention was achieved by discovering a close relationship between the reduction in the above-mentioned plate thickness and the aforementioned plate thickness reduction.
すなわち、板厚絞りが９０％以上といった大きな値を示
すような材料をプレス成形すると、剪断面１ａがプレス
破面１の大半を占めるようになり、プレス後のパリの発
生を生じ、プレス金型の摩耗が大きくなって、金型の寿
命を低下させる結果となる。In other words, when a material with a large plate thickness reduction of 90% or more is press-formed, the sheared surface 1a occupies most of the press fracture surface 1, causing the occurrence of cracks after pressing, and the press mold This results in increased wear and decreases the life of the mold.
しかし、板厚絞りの値が次第に小さくなるような段階的
な試料を作製し、各板厚絞りと破断面１ｂの形成割合と
を詳細に調査したところ、板厚絞りが８０％以下になる
と、破断面１ｂの形成が増大するようになり、プレスバ
リの発生のない良好なプレス成形が可能となることが判
明した。However, when samples were prepared in stages in which the value of plate thickness reduction gradually decreased, and the formation rate of fracture surface 1b was investigated in detail for each plate thickness reduction, it was found that when plate thickness reduction decreased to 80% or less, It was found that the formation of the fractured surface 1b increased, making it possible to perform good press forming without press burrs.
このような良好なプレス成形の可能となる臨界条件が板
厚絞りにおいて８０％程度のところにあり、優れたプレ
ス成形性を得るには板厚絞りが８０％以下となるような
材料特性を持たせる必要のあることも、数々の実験によ
り確認することができた。The critical condition that makes such good press forming possible is around 80% of the plate thickness reduction, and in order to obtain excellent press formability, the material properties must be such that the plate thickness reduction is 80% or less. We were able to confirm through a number of experiments that this was necessary.
一方、リードフレーム材料としての銅合金の応用は、そ
の高導電性を生かし、トランジスタ用から各種ＩＣへと
その適用が拡大しており、半導体の前述したような高集
積化、高密度化、高信頼性化、コスト低減などの動向か
ら、リードフレーム用銅合金に要求される機能は高強度
、高導電率及び樹脂や半田などの異種材料との高接合性
が重要視されてきている。On the other hand, the application of copper alloy as a lead frame material is expanding from transistors to various ICs by taking advantage of its high conductivity. Due to trends in reliability and cost reduction, the functions required of copper alloys for lead frames are high strength, high conductivity, and high bondability with dissimilar materials such as resins and solders.
銅合金の強度を上げるためには、添加元素及びそれらの
濃度の調整で対応するのが一般的であるが、添加元素濃
度を上げると、導電率さらには異種材料との接合性が低
下する傾向にある。これら相反するニーズを満足する銅
合金の具体的組成として、出願人は先にＣｕ−Ｚｒ系合
金を市場に提供し、その優れた特性について高い評価を
得るに至った。In order to increase the strength of copper alloys, it is common to adjust the additive elements and their concentrations, but increasing the concentration of additive elements tends to decrease the electrical conductivity and bondability with dissimilar materials. It is in. As a specific composition of a copper alloy that satisfies these conflicting needs, the applicant first provided a Cu-Zr based alloy on the market, and has received high praise for its excellent properties.
Ｚ「は少量の添加で銅の耐熱性を向上させる効果があり
、反面添加によって銅の導電率の低下が少ない添加元素
でもあるため、Ｃｕ−Ｚｒ合金は高い導電率を維持しな
がら十分な耐熱性を保持させることができる。また、２
「は鋼中に添加すると、Ｃｕｓ ｚｒとして微細に析出
分布するため、強度の改善効果も有する。リードフレー
ム用として使用するためには、２「の添加量として０．
０１％以下では耐熱性や強度の向上に効果が少なく、０
．２％以上添加したのでは導電率の低下が大きく好まし
くない。Z is an additive element that has the effect of improving the heat resistance of copper when added in small amounts, but on the other hand, it is also an additive element that causes little decrease in the electrical conductivity of copper, so the Cu-Zr alloy has sufficient heat resistance while maintaining high electrical conductivity. It is possible to maintain the gender.Also, 2
When added to steel, Cus zr is finely precipitated and distributed, so it also has the effect of improving strength. In order to use it for lead frames, it is necessary to add 2" in an amount of 0.
If it is less than 0.01%, it will have little effect on improving heat resistance and strength;
．． If it is added in an amount of 2% or more, the electrical conductivity will decrease significantly, which is not preferable.
また、引張特性としてはプレス打抜きによりリードフレ
ームに成形された後半導体部品の実装工程においてリー
ドの曲がり変形を防止するため一定の強度が必要であり
、実用上におけるＣｕ−Ｚｒ合金では４５１ｑｒｆ／ｍ
”以上の強度を有することが必要である。また、伸びに
関しては、実装後のリードの折り曲げ成形時に曲げ部で
の折れ、割れが発生しない十分な伸びが必要とされ、６
％以上の沖びを持つ材料であればこの種の曲げ成形に十
分耐え得ることが確認された。In addition, in terms of tensile properties, a certain level of strength is required to prevent leads from bending and deforming during the mounting process of semiconductor components after being formed into a lead frame by press punching.
In addition, with regard to elongation, sufficient elongation is required to prevent bending or cracking at the bending part when the lead is bent and formed after mounting.
It has been confirmed that materials with a roughness of % or more can withstand this type of bending.
上記の如き特性を有するＣｕ−Ｚｒ合金において、本発
明においては、さらに板厚絞りが８０％以下となる特性
を付与させる。このような特性の付与については、後述
するように加工度や熱処理条件などを選択するすること
によりかなりの自在性をもって付与することが可能であ
る。しかして、Ｃｕ−Ｚｒ合金の場合には板厚絞りの下
限を４０％程度のところに置くようにすることが好まし
く、これ以下にまで板厚絞り特性を低下させると、前記
した別な必要特性である伸び６％を確保することが困難
となる。In the present invention, the Cu-Zr alloy having the above-mentioned properties is further provided with the property that the plate thickness reduction is 80% or less. It is possible to impart such properties with considerable flexibility by selecting the degree of processing, heat treatment conditions, etc., as will be described later. Therefore, in the case of Cu-Zr alloys, it is preferable to set the lower limit of sheet thickness reduction at about 40%, and if the sheet thickness reduction characteristics are lowered below this, the other necessary characteristics mentioned above will be reduced. It becomes difficult to secure a growth rate of 6%.
なお、本発明に係る具体的合金として上記したＣｕ−Ｚ
ｒ合金を挙げたが、それにのみ限定されないことは勿論
である。In addition, the Cu-Z mentioned above as a specific alloy according to the present invention
Although the r-alloy is mentioned above, it is needless to say that the present invention is not limited thereto.
添加元素としては２「以外にＦｅ 、Ｓｎ 、 Ｎｓ＊
、ｚｎ 、ｃｒなどを添加した銅合金でも８０％以下
の板厚絞りを持つものであれば本発明の対象となり得る
ものである。In addition to 2, the additive elements include Fe, Sn, and Ns*
Copper alloys to which , zn, cr, etc. are added can also be covered by the present invention as long as they have a plate thickness reduction of 80% or less.
実施例
酸素含有量がｌ０ｐＩ）ｌ以下の銅に０．０７％の２「
を添加したＣｕ−Ｚｒ合金のゲータを２１０閣厚におい
て連続鋳造法にて鋳造し、これを約８００℃に加熱し熱
間圧延により１０ｍｍ厚に圧延した。さらに両面面ｔｌ
’Ｊ ｆ＆、中間焼鈍を入れずに冷間圧延にて０．２５
ｍ厚に圧延し４００’ＣＸ ３０分熱処理して試験片と
した。この試験片を引彊試験により特性を評価したとこ
ろ、引張強さ５ ｏｋｇｒ ／ｍＩｇ 、伸び８％、板
厚絞り７５％であった。Example 0.07% of 2' in copper with an oxygen content of less than 10 pI)
A gator of a Cu-Zr alloy to which was added was cast by a continuous casting method at a thickness of 210 mm, heated to about 800° C., and hot-rolled to a thickness of 10 mm. Furthermore, both sides tl
'J f&, 0.25 by cold rolling without intermediate annealing
It was rolled to a thickness of m and heat treated at 400'CX for 30 minutes to obtain a test piece. When the characteristics of this test piece were evaluated by a tensile test, the tensile strength was 5 okgr/mlg, the elongation was 8%, and the plate thickness was 75%.
この材料をプレス打抜成形し、その破面を調査したとこ
ろ、全破面に対する破断面の割合は３１％と全体の約１
／３を古め、プレスバリも殆んど発生せず優れたプレス
性を示した。When this material was press punched and the fracture surface was investigated, the ratio of the fracture surface to the total fracture surface was 31%, which was about 1% of the total fracture surface.
/3 was aged, and exhibited excellent pressability with almost no press burrs.
比較例
実施例に用いた１０−厚の熱間圧延材の両面面削後、冷
間圧延にて中間焼鈍を加え乍ら１．Ｏｍｎ厚に圧延し、
さらに焼鈍を加え０．２５−厚まで圧延し供試片とした
。この材料での破断時の板厚絞りは９０％であり、プレ
ス成形後の破断面の割合は１５％程度と小さく、若干の
プレスバリも発生し実施例の材料に較べ明らかにプレス
性は低下した。Comparative Example After facing both sides of the 10-thick hot-rolled material used in the example, intermediate annealing was performed by cold rolling. Rolled to Omn thickness,
The sample was further annealed and rolled to a thickness of 0.25 mm. The thickness reduction of this material at breakage is 90%, the percentage of the fractured surface after press forming is small at about 15%, some press burrs occur, and the pressability is clearly lower than that of the material of the example. did.
上記実施例及び比較例は、途中まで同じ組成及び製造条
件であるが、その後の加工条件を変化させることにより
、板厚絞りに変化が生じ、プレス性が向上したり低下し
たりするようになることが、この実施例と比較例の対比
からよくわかる。これによって、本発明の有する本質を
よく理解し得るであろう。The above Examples and Comparative Examples have the same composition and manufacturing conditions up to the middle, but by changing the processing conditions after that, the plate thickness reduction will change, and the pressability will improve or decrease. This can be clearly seen from the comparison between this example and the comparative example. This will help you better understand the essence of the invention.
［発明の効果］
以上詳記の通り、本発明によれば、今後ますますリード
フレームのパターンの微細化が進み、リードフレーム材
としての緒特性を十分に保有しつつしかもプレス性に優
れたリードフレーム用材料の開発への期待が大きい折柄
、かかる要望に十分応え得る材料を市場に提供し得るこ
ととなるものであり、その工業上における価値は極めて
大きなものがある。[Effects of the Invention] As detailed above, according to the present invention, lead frame patterns will become increasingly finer in the future, and a lead that has sufficient properties as a lead frame material and has excellent pressability can be produced. Given that there are high expectations for the development of frame materials, it will be possible to provide the market with a material that can fully meet these demands, and its industrial value is extremely large.
第１図はプレス破面の外観見取図、第２図は板厚絞りを
定義するための説明図である。
１ニブレス破面、
１ａ：剪断面、
１ｂ＝破断面、
１０：板材、
１１：絞り破断部。FIG. 1 is an external sketch of a press fracture surface, and FIG. 2 is an explanatory diagram for defining plate thickness reduction. 1 niblets fracture surface, 1a: shear surface, 1b = fracture surface, 10: plate material, 11: drawing fracture section.
Claims (2)
金材料であって、当該材料を板状としこれを引張試験に
より引張破断させた際に、引張り前の板厚をＴ、引張り
により破断部が絞られて破断した後の絞り破断端部の板
厚をｔとしたとき、その板厚絞りすなわち （Ｔ−ｔ）／Ｔが８０％以下である特性を保有させてな
るプレス性の優れたリードフレーム用銅合金材料。(1) A copper alloy material that is punched and formed using a high-speed precision press, and when the material is made into a plate and subjected to a tensile test to be tensile ruptured, the plate thickness before tension is T, and the rupture is caused by tension. Excellent pressability, which has the characteristic that, where the plate thickness at the drawn and broken end after the part is squeezed and fractured is t, the plate thickness, that is, (T-t)/T, is 80% or less. Copper alloy material for lead frame.
可避なる不純物よりなる銅合金からなり、引張試験にお
ける破断強度が ４５ｋｇ／ｍｍ＾２以上、伸びが６％以上であって、か
つ破断時の板厚絞りが８０％以下である特性を保有せし
めてなるプレス性の優れたリードフレーム用銅合金材料
。(2) It is made of a copper alloy containing 0.01 to 0.2% by weight of Zr, with the remainder being unavoidable impurities, and has a breaking strength of 45 kg/mm^2 or more in a tensile test and an elongation of 6% or more. A copper alloy material for a lead frame having excellent pressability, and having the property that the plate thickness reduction at breakage is 80% or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2040567A JP2606397B2 (en) | 1990-02-21 | 1990-02-21 | Copper alloy material for lead frames with excellent pressability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2040567A JP2606397B2 (en) | 1990-02-21 | 1990-02-21 | Copper alloy material for lead frames with excellent pressability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03243736A true JPH03243736A (en) | 1991-10-30 |
| JP2606397B2 JP2606397B2 (en) | 1997-04-30 |
Family
ID=12584051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2040567A Expired - Lifetime JP2606397B2 (en) | 1990-02-21 | 1990-02-21 | Copper alloy material for lead frames with excellent pressability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2606397B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004240409A (en) * | 2003-01-14 | 2004-08-26 | Natoko Kk | Electrophoretic color particle and display element |
| US7338631B2 (en) | 2004-04-14 | 2008-03-04 | Mitsubishi Shindoh Co., Ltd. | Copper alloy and method of manufacturing the same |
| CN108015175A (en) * | 2017-12-01 | 2018-05-11 | 苏州金逸康自动化设备有限公司 | A kind of automatic riveting thread press of perforating bullet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62164843A (en) * | 1986-01-16 | 1987-07-21 | Mitsubishi Shindo Kk | Cu-alloy lead material for semiconductor device |
-
1990
- 1990-02-21 JP JP2040567A patent/JP2606397B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62164843A (en) * | 1986-01-16 | 1987-07-21 | Mitsubishi Shindo Kk | Cu-alloy lead material for semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004240409A (en) * | 2003-01-14 | 2004-08-26 | Natoko Kk | Electrophoretic color particle and display element |
| US7338631B2 (en) | 2004-04-14 | 2008-03-04 | Mitsubishi Shindoh Co., Ltd. | Copper alloy and method of manufacturing the same |
| US7485200B2 (en) | 2004-04-14 | 2009-02-03 | Mitsubishi Shindoh Co., Ltd. | Copper alloy and method of manufacturing the same |
| CN108015175A (en) * | 2017-12-01 | 2018-05-11 | 苏州金逸康自动化设备有限公司 | A kind of automatic riveting thread press of perforating bullet |
| CN108015175B (en) * | 2017-12-01 | 2023-12-15 | 苏州金逸康自动化设备有限公司 | Automatic riveting and wire pressing machine for perforating charges |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2606397B2 (en) | 1997-04-30 |
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