JPH0325252U - - Google Patents
Info
- Publication number
- JPH0325252U JPH0325252U JP1989085961U JP8596189U JPH0325252U JP H0325252 U JPH0325252 U JP H0325252U JP 1989085961 U JP1989085961 U JP 1989085961U JP 8596189 U JP8596189 U JP 8596189U JP H0325252 U JPH0325252 U JP H0325252U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- view
- lead frame
- showing
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は一実施例を用いて半導体チツプを実装
した状態を示す部分断面図、第２図は同実施例の
部分平面図、第３図は一実施例の製造工程を示す
工程断面図、第４図はインナーリード部がエツチ
ングされた後の金属板を示す図であり、Ａは平面
図、Ｂはその−′線位置での断面図、第５図
は他の実施例を用いて半導体チツプを実装した状
態を示す部分断面図、第６図は従来のリードフレ
ームを用い微細加工された半導体チツプを実装し
た場合を示す平面図、第７図は同従来例の部分断
面図である。
１０……リードフレーム、１２……インナーリ
ード、１４……アイランド、１６……半導体チツ
プ、１８……ワイヤ。
FIG. 1 is a partial sectional view showing a state in which a semiconductor chip is mounted using one embodiment, FIG. 2 is a partial plan view of the same embodiment, and FIG. 3 is a process sectional view showing the manufacturing process of one embodiment. FIG. 4 is a diagram showing the metal plate after the inner lead part has been etched, A is a plan view, B is a cross-sectional view at the -' line position, and FIG. FIG. 6 is a partial sectional view showing a state in which a chip is mounted, FIG. 6 is a plan view showing a case in which a microfabricated semiconductor chip is mounted using a conventional lead frame, and FIG. 7 is a partial sectional view of the same conventional example. 10...Lead frame, 12...Inner lead, 14...Island, 16...Semiconductor chip, 18...Wire.
Claims (1)
プのパツドとの間で接続がなされるインナーリー
ドの板厚がアウターリードの板厚より薄くなつて
いるリードフレーム。 A lead frame in which the inner leads, which are placed facing the semiconductor chip and are connected to the pads of the semiconductor chip, are thinner than the outer leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085961U JPH0325252U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085961U JPH0325252U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325252U true JPH0325252U (en) | 1991-03-15 |
Family
ID=31635352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085961U Pending JPH0325252U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325252U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957439A (en) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | Semiconductor device |
| JPS628545A (en) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | High density lead frame |
| JPS6248053A (en) * | 1985-08-28 | 1987-03-02 | Nec Corp | Manufacture of lead frame for semiconductor device |
| JPS62177953A (en) * | 1986-01-30 | 1987-08-04 | Nec Corp | Lead frame |
-
1989
- 1989-07-21 JP JP1989085961U patent/JPH0325252U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957439A (en) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | Semiconductor device |
| JPS628545A (en) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | High density lead frame |
| JPS6248053A (en) * | 1985-08-28 | 1987-03-02 | Nec Corp | Manufacture of lead frame for semiconductor device |
| JPS62177953A (en) * | 1986-01-30 | 1987-08-04 | Nec Corp | Lead frame |