JPH0325419Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improvement in a signal processing device that processes signals using an electronic circuit that operates at room temperature and an electronic circuit that operates at extremely low temperature. .

BACKGROUND ART Conventionally, as such a signal processing device, one having the configuration described below with reference to FIG. 3 has been proposed.

That is, it has a vacuum chamber 1 having an exhaust pipe 2.

It also has a cryogenic refrigerant container 3 that accommodates a cryogenic refrigerant 5, which is disposed within the vacuum chamber 1, but has a refrigerant lead-in/output pipe 4 extending outside the vacuum chamber 1.

Further, the exhaust pipe 7 is disposed inside the cryogenic refrigerant container 3, and the exhaust pipe 7 is disposed inside the cryogenic refrigerant container 3.
and a vacuum container 6 extending outside the vacuum chamber 1.

Further, on the main surface 9, there is provided a normal temperature operation electronic circuit configuration chip 10 which constitutes a room temperature operation electronic circuit which operates at room temperature, and a cryogenic operation electronic circuit which operates at a cryogenic temperature and is constituted by, for example, a Josephson element. In addition, the heater 12 is mounted in the vicinity of the room-temperature operation electronic circuit chip 10, and the cold-operation electronic circuit chip 10 is mounted at a different position from the cryogenic electronic circuit chip 11. The electronic circuit board 8 has a thin film line 13 extending between the electronic circuit chip 10 and the cryogenically operated electronic circuit chip 11 and including at least a thin film line for power supply, signal, etc.

Thus, the electronic circuit board 8 has a normal temperature operating electronic circuit chip 10 and a heater 12 located in the vacuum container 6, a cryogenic operating electronic circuit chip 11 located in the cryogenic refrigerant container 3, and It is held in a vacuum container 6 while being immersed in a cryogenic refrigerant 5.

In this case, power supply conductors, signal input and output conductors for the normal temperature operation electronic circuit chip 10 and the cryogenic operation electronic circuit chip 11, and power supply conductors for the heater 11 (none of which are shown)
is led out from the position inside the vacuum container 6 to the outside of the cryogenic refrigerant container 3 and the vacuum chamber 1.

The above is the configuration of a conventionally proposed signal processing device.

According to the signal processing device having such a configuration, the power source and the processed chip for the normal temperature operation electronic circuit chip 10 and the cryogenic operation electronic circuit chip 11 are connected from outside the vacuum chamber 1 to the power supply conductor and the signal input conductor. By supplying the signals respectively,
The signal to be processed can be processed in the vacuum chamber 1 using both the normal temperature electronic circuit of the normal temperature electronic circuit component 10 and the cryogenic electronic circuit of the cryogenic electronic circuit component chip 11. Furthermore, the processed signal can be led out of the vacuum chamber 1 via the signal lead wire.

In this case, a vacuum container 6 is disposed within the cryogenic refrigerant container 3 that accommodates the cryogenic refrigerant 5, and
Since the electronic circuit component chip 10 operating at room temperature and mounted on the electronic circuit board 8 is located in the vacuum container 6, the electronic circuit component chip 10 operating at room temperature is indirectly affected by the cryogenic refrigerant 5. cooled down. However, since the heater 12 is mounted on the electronic circuit board 8 in the vicinity of the electronic circuit component chip 10 that operates at room temperature, if the heater 12 is energized via the power supply wire, the heater 12 can be activated. As a result, the cold-operating electronic circuitry chip 10 is heated. Therefore, the room temperature electronic circuitry chip 10 can be maintained at room temperature, and therefore the room temperature electronic circuitry of the room temperature electronic circuitry chip 10 can be operated at room temperature. Further, the cryogenically operating electronic circuit component chip 11 mounted on the electronic circuit board 8 is immersed in the cryogenic refrigerant 5 in the cryogenic refrigerant container 3 that accommodates the cryogenic refrigerant 5. Since it is located, cryogenic operation electronic circuit configuration chip 1
1 can be kept at a cryogenic temperature, and thus the cryogenic electronic circuitry of the cryogenic electronic circuitry chip 11 can be operated at cryogenic temperatures.

As described above, according to the conventional signal processing device shown in FIG. Signals can be processed at higher speed and with less power consumption than when signals are processed using only room-temperature electronic circuitry chips without using cryogenic electronic circuitry chips.

Moreover, in this case, since the cryogenic refrigerant container 3 is disposed within the vacuum chamber 1, the cryogenic refrigerant container 3 is insulated from the outside. Therefore, the cryogenic refrigerant 5 contained in the cryogenic refrigerant container 3 is hardly vaporized and lost due to external heat.

Further, the electronic circuit component chip 10 operating at room temperature is disposed within the vacuum container 6, and since the inside of the vacuum container 6 is a vacuum, even if heat is generated within the vacuum container 6, most of the heat is No convection.
Therefore, the heater 1 mounted on the electronic circuit board 8
2 and the convection heat from the electronic circuitry chip 10 operating at room temperature, the vacuum container 6 is hardly heated, and therefore the cryogenic refrigerant contained in the cryogenic refrigerant container 3 is heated. 5, there is little risk of vaporization loss due to convection heat from the heater 12 and the electronic circuit component chip 10 operating at room temperature.

Problems to be Solved by the Invention However, in the case of the conventional signal processing device shown in FIG.
It is necessary to hold the electronic circuit board 8 in an airtight and liquid-tight manner, and it is also necessary to mount the heater 12 on the electronic circuit board 8.
The signal processing device as a whole has the drawbacks of being large, complicated, and expensive.

In addition, since the electronic circuit board 8 on which the heater 12 is mounted extends between the inside of the vacuum container 6 and the inside of the cryogenic refrigerant container 3 across the wall of the vacuum container 6, extending into the refrigerant container 3, and
Since it is immersed in the cryogenic refrigerant 5, the heater 12
Another drawback is that the heat conducted from the electronic circuit component chip 10 operating at room temperature to the electronic circuit board 8 causes a non-negligible vaporization loss in the cryogenic refrigerant 5.

Furthermore, since the electronic circuit board 8 extends across the wall of the vacuum container 6, it is necessary to maintain both airtightness and liquid tightness between the electronic circuit board 8 and the vacuum container 6. , Also, for this reason, the electronic circuit board 8
If it is necessary to replace the electronic circuit board 8 with a new electronic circuit board, it is difficult to do so, and furthermore, due to the difference in thermal expansion coefficient between the electronic circuit board 8 and the vacuum container 6, the electronic circuit board 8 and the vacuum container 6 This has the disadvantage that there is a risk of deterioration in the airtightness and liquidtightness between the two.

Means for Solving the Problems The present invention therefore seeks to propose a novel signal processing device that does not have the above-mentioned drawbacks.

The signal processing device according to the present invention has the following configuration.

In other words, a vacuum chamber, a cryogenic refrigerant container disposed within the vacuum chamber and provided with a heat sink on its outer surface, and a normal-temperature-operating electronic circuit component chip that constitutes a normal-temperature-operating electronic circuit on its main surface. , mounting the cryogenically operating electronic circuit component chips constituting the cryogenically operating electronic circuit at different positions, and extending between the room temperature operating electronic circuit component chip and the cryogenically operating electronic circuit component chip; and an electronic circuit board forming a thin film line including at least a thin film line.

Accordingly, the electronic circuit board has the electronic circuit component chip operating at room temperature located outside the vacuum chamber, and the electronic circuit component chip operating at a cryogenic temperature located within the vacuum chamber and in pressure contact with the heat sink. , is held in the vacuum chamber.

The above is the configuration of the signal processing device according to the present invention.

Effects/Effects According to the signal processing device according to the present invention having such a configuration, the electronic circuit board on which the normal temperature operation electronic circuit configuration chip and the cryogenic operation electronic circuit configuration chip are mounted has a normal temperature operation electronic circuit configuration chip. Since the chip is located outside the vacuum chamber and held in the vacuum chamber, power and processed signals can be easily supplied to the electronic circuit component chip operating at room temperature and the electronic circuit component chip operating at cryogenic temperature outside the vacuum chamber. I can do it.

In addition, by supplying power and signals to be processed to the electronic circuit configuration chip operating at room temperature and the electronic circuit configuration chip operating at cryogenic temperature, the signal to be processed can be processed in the same manner as in the case of the conventional signal processing device described above in FIG. ,
Simultaneously using both a normal temperature operating electronic circuit of a normal temperature operating electronic circuit component chip mounted on an electronic circuit board and a cryogenic operating electronic circuit of a cryogenic operating electronic circuit component chip mounted on the same electronic circuit board. The processed signal can be easily obtained from an electronic circuit board outside the vacuum chamber.

In this case, since the electronic circuit component chip mounted on the electronic circuit board and operating at room temperature is located outside the vacuum chamber, there is no need to use a heater as in the case of the conventional signal processing device described above in FIG. In addition, the ambient temperature electronic circuit can be operated at ambient temperature.

In addition, the cryogenically operating electronic circuit component chip mounted on the electronic circuit board is in pressure contact with the heat sink provided on the outer surface of the cryogenic refrigerant container that accommodates the cryogenic refrigerant. Cryogenic Operation of the Operating Electronics Chip The electronic circuitry can be operated at cryogenic temperatures.

In this way, even with the signal processing device according to the present invention, the signal to be processed can also be processed using the cryogenically operated electronic circuit of the cryogenically operated electronic circuit component chip. As in the case of conventional signal processing devices, the processed signals are processed at higher speeds and with lower consumption than when processing signals using only room-temperature electronic circuitry chips without using cryogenically operated electronic circuitry chips. It can be processed using electricity.

In addition, in this case, the cryogenic refrigerant container is in the third
As in the case of the conventional signal processing device described above in the figure, the cryogenic refrigerant container is insulated from the vacuum chamber because it is disposed within the vacuum chamber. For this reason, the cryogenic refrigerant contained in the cryogenic refrigerant container is
Similar to the conventional signal processing device described above in FIG. 3, there is almost no vaporization loss due to external heat.

Furthermore, since the interior of the vacuum chamber in which the cryogenically operated electronic circuit component chip is placed is a vacuum, even if heat is generated within the vacuum chamber, that heat hardly circulates; An electronic circuit component chip is pressed into contact with a heat sink provided on the outer surface of the cryogenic refrigerant container. Therefore, the cryogenic electronic circuitry chip is stably maintained at the desired cryogenic temperature, and therefore the cryogenic electronic circuitry of the cryogenic electronic circuitry chip operates stably.

Furthermore, unlike the conventional signal processing device shown in FIG. Since there is no need to maintain and maintain both of the above and furthermore, there is no need to mount a heater on the electronic circuit board, the signal processing device as a whole can be improved compared to the conventional signal processing device described above in Fig. 3. However, it can be provided in a much smaller, simpler and cheaper manner.

In addition, since the electronic circuit board is not equipped with a heater, the electronic circuit board will not be heated unnecessarily, and the electronic circuit board must not be in direct contact with the cryogenic refrigerant container. For example, since the cryogenic refrigerant contained in the cryogenic refrigerant container is not even touched, the cryogenic refrigerant will not be unnecessarily vaporized and lost.

Furthermore, even if there is a difference in thermal expansion coefficient between the cryogenic refrigerant container and the electronic circuit board, there will be no problem because the electronic circuit board is not in direct contact with the cryogenic refrigerant container. will not occur.

Embodiment FIG. 1 shows an example of a signal processing device according to the present invention.

In FIG. 1, parts corresponding to those in FIG. 3 are designated by the same reference numerals, and detailed description thereof will be omitted.

The signal processing device according to the present invention shown in FIG. 1 has the following configuration.

That is, a vacuum chamber 1, a cryogenic refrigerant container 3 disposed within the vacuum chamber 1 and provided with a heat sink 21 on its outer surface, and a normal temperature refrigerant container 3 which constitutes a normal temperature operating electronic circuit on the main surface 9. The electronic circuit configuration chip 10 and the cryogenic operation electronic circuit configuration chip 11 constituting the cryogenic operation electronic circuit are mounted in different positions, and the room temperature operation electronic circuit configuration chip 10 is mounted at different positions.
and an electronic circuit board 8 forming a thin film line 13 including at least a thin film line extending between cryogenically operated electronic circuit chips 11.

Thus, the electronic circuit board 8 has the electronic circuit component chip 10 operating at room temperature located outside the vacuum chamber 1 and the electronic circuit component chip 11 operating at a cryogenic temperature located within the vacuum chamber 1 and in pressure contact with the heat sink 21. , is held in a vacuum chamber 1.

In this case, the vacuum chamber 1 consists of an outer vacuum chamber 1a having an exhaust pipe 2a and an inner vacuum chamber 1b having an exhaust pipe 2b extending outside across the wall of the outer vacuum chamber 1a. An electronic circuit board 8 extends across the outer vacuum chamber 1a and the inner vacuum chamber 1b. In this case, the electronic circuit board 8 maintains airtightness with the outer vacuum chamber 1a by the airtight sealing means 30 located at room temperature, but such airtightness is maintained between the electronic circuit board 8 and the inner vacuum chamber 1b. Rather, the electronic circuit board 8
Loosely insert it into the window 31 provided in the inner vacuum chamber 1b,
On the other hand, the inner vacuum chamber 1b is connected to the outer vacuum chamber 1a at the position of the window 31 via a bellows-like flange 23 having a large thermal resistance.

Further, the cryogenic operation electronic circuit configuration chip 11 is
The electronic circuit board is electromechanically connected to the thin film line 13 using a solder 24 made of, for example, lead or a tin-lead alloy, which exhibits a significantly lower thermal conductivity in the superconducting state than in the normal conducting state. The electronic circuit board 8, on which the cryogenically operated electronic circuit component chip 11 is mounted in this way, is connected to the back surface of the electronic circuit board 8 using the screw 26 that is screwed into the heat sink 21. The pressure-welding piece 29, which has a plate-shaped spring 25 inserted therebetween and a winding spring 27 inserted between the head of the screw 26 and the head of the screw 26, is pressed against the heat sink 21, thereby being pressure-welded to the heat sink 21. . In this case, as shown in the figure, adhesive grease 2 is applied between the heat sink 21 and the electronic circuit board 8.
8 may be inserted.

The above is the configuration of the signal processing device according to the present invention.

According to the signal processing device according to the present invention having such a configuration, the electronic circuit configuration chip 10 operates at room temperature.
The electronic circuit board 8 on which the cryogenically operating electronic circuit chip 11 is mounted is held in the vacuum chamber 1 with the room temperature operating electronic circuit chip 10 located outside the vacuum chamber 1. Outside the bath 1, power and signals to be processed can be easily supplied to the electronic circuitry chip 10 operating at normal temperature and the electronic circuitry chip 11 operating at cryogenic temperature.

Furthermore, by supplying power and signals to be processed to the electronic circuit configuration chip 10 operating at room temperature and the electronic circuit configuration chip 11 operating at cryogenic temperatures, the signals to be processed can be processed in the same way as in the conventional signal processing device described above in FIG. Similarly, the normal temperature operating electronic circuit of the ambient temperature operating electronic circuit component chip 10 mounted on the electronic circuit board 8 and the cryogenic operating electronic circuit of the cryogenic operating electronic circuit component chip 11 mounted on the same electronic circuit board 8. Both circuits can be processed simultaneously, and the processed signals can be sent outside the vacuum chamber 1.
It can be easily obtained from the electronic circuit board 8.

In this case, since the electronic circuit component chip 10 that operates at room temperature and is mounted on the electronic circuit board 8 is located outside the vacuum chamber 1, a heater such as that used in the conventional signal processing device described above in FIG. without using
The ambient temperature operating electronic circuit can be operated at ambient temperature.

Further, the cryogenically operating electronic circuit component chip 11 mounted on the electronic circuit board 8 is in pressure contact with the heat sink 21 provided on the outer surface of the cryogenic refrigerant container 3 that accommodates the cryogenic refrigerant 5. Therefore, the cryogenic electronic circuit of the cryogenic electronic circuit configuration chip 11 can be operated at a cryogenic temperature.

As described above, even with the signal processing device according to the present invention shown in FIG. 1, the signal to be processed can also be processed using the cryogenically operated electronic circuit of the cryogenically operated electronic circuit chip 11. As in the case of the conventional signal processing device described above in FIG. However, processing can be performed at high speed and with low power consumption.

In addition, in this case, the cryogenic refrigerant container 3 is arranged in the vacuum chamber 1 as in the case of the conventional signal processing device described above in FIG. It is insulated from tank 1. Therefore, the cryogenic refrigerant 5 contained in the cryogenic refrigerant container 3 is not subject to vaporization loss due to external heat, as in the case of the conventional signal processing device described above in FIG. rare.

Furthermore, since the interior of the vacuum chamber 1 in which the cryogenically operated electronic circuit component chip 11 is placed is a vacuum, even if heat is generated within the vacuum chamber 1, the heat hardly convects; A cryogenic electronic circuitry chip 11 is pressed against a heat sink 21 provided on the outer surface of the cryogenic refrigerant container 3. Therefore, the cryogenic electronic circuitry chip 11 is stably maintained at the desired cryogenic temperature, and therefore the cryogenic electronic circuitry of the cryogenic electronic circuitry chip 11 operates stably.

This is even more true when the vacuum chamber 1 has a dual structure of an outer vacuum chamber 1a and an inner vacuum chamber 1b as shown in the figure.

Furthermore, there is no need for the vacuum container 6 disposed inside the cryogenic refrigerant container 3 as in the conventional signal processing device described above in FIG. Since it is not necessary to maintain and maintain both liquid-tightness and liquid-tightness, and there is no need to mount a heater on the electronic circuit board 8, the signal processing device as a whole can be used as a conventional signal processing device as described above in FIG. Compared to the case of a device, it can be provided in a much smaller, simpler, and cheaper manner.

Further, since the electronic circuit board 8 is not equipped with a heater, the electronic circuit board 8 is not heated unnecessarily, and the electronic circuit board 8 is not directly connected to the cryogenic refrigerant container 3. Since the cryogenic refrigerant 5 is neither in contact nor touched by the cryogenic refrigerant 5 housed in the cryogenic refrigerant container 3, the cryogenic refrigerant 5 is not unnecessarily vaporized and lost.

This means that even though the electronic circuit board 8 is indirectly thermally coupled to the heat sink 21 via the cryogenic electronic circuitry chip 11, the cryogenic electronic circuitry chip 11 is ,
This is especially true when the electronic circuit board 8 is mounted via the solder 24 described above.

Furthermore, even if there is a difference in thermal expansion coefficient between the cryogenic refrigerant container 3 and the electronic circuit board 8, the electronic circuit board 8 is not in direct contact with the cryogenic refrigerant container 3. , no problems arise.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing an embodiment of a signal processing device according to the present invention. FIG. 2 is a schematic cross-sectional view of the waist. FIG. 3 is a schematic cross-sectional view showing a conventional signal processing device. 1... Vacuum chamber, 2... Exhaust pipe, 3... Container for cryogenic refrigerant, 4... Refrigerant inlet/output pipe, 5... Refrigerant for cryogenic temperature, 6... Vacuum container, 7... Exhaust pipe , 8
. . . Electronic circuit board, 9 .

Claims (1)

[Scope of Claim for Utility Model Registration] A vacuum chamber, a cryogenic refrigerant container disposed within the vacuum chamber and provided with a heat sink on its outer surface, and a room-temperature refrigerant container on its main surface constituting a room-temperature operating electronic circuit. An operational electronic circuit configuration chip and a cryogenic operation electronic circuit configuration chip constituting the cryogenic operation electronic circuit are mounted at different positions, and the above-mentioned normal temperature operation electronic circuit configuration chip and the above cryogenic operation electronic circuit are mounted. an electronic circuit board forming a thin film line including at least a thin film line extending between constituent chips, the electronic circuit board having the normal temperature operating electronic circuit constituent chip located outside the vacuum chamber; and a signal processing device held in the vacuum chamber with the cryogenically operating electronic circuit chip positioned within the vacuum chamber and pressed against the heat sink.