JPH0326059U - - Google Patents
Info
- Publication number
- JPH0326059U JPH0326059U JP8661489U JP8661489U JPH0326059U JP H0326059 U JPH0326059 U JP H0326059U JP 8661489 U JP8661489 U JP 8661489U JP 8661489 U JP8661489 U JP 8661489U JP H0326059 U JPH0326059 U JP H0326059U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- connecting lead
- solder
- intermediate terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案のプリント配線板の接続リード
の引出し構造の一実施例の断面図、第２図は第１
図の中間端子の一例を示す斜視図、第３図は同中
間端子の構造の別の例を示す斜視図、第４図は従
来の一般的なはんだ接合によるプリント配線板の
接続リードの引出し構造の断面図、第５図は従来
の溶接によるプリント配線板の接続リードの引出
し構造の断面図、第６図は従来の超音波接合によ
るプリント配線板の接続リードの引出し構造の断
面図である。
１……プリント配線板、５……中間端子、６…
…はんだ、８……接続リード。
Fig. 1 is a sectional view of one embodiment of the connecting lead pull-out structure of the printed wiring board of the present invention, and Fig.
FIG. 3 is a perspective view showing another example of the structure of the intermediate terminal, and FIG. 4 is a conventional general solder-jointed connection lead structure for a printed wiring board. FIG. 5 is a cross-sectional view of a conventional welded connection lead structure for a printed wiring board, and FIG. 6 is a cross-sectional view of a conventional printed wiring board connection lead structure formed by ultrasonic bonding. 1...Printed wiring board, 5...Intermediate terminal, 6...
...Solder, 8... Connection lead.
Claims (1)
端部の外面をはんだでプリント配線板に接合し、
他方の端部の外面に接続リードを接合したことを
特徴とするプリント配線板の接続リードの引出し
構造。 The outer surface of one end of the intermediate terminal, which is made of a U-shaped metal flat plate, is joined to the printed wiring board with solder.
A connecting lead drawer structure for a printed wiring board, characterized in that a connecting lead is bonded to the outer surface of the other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8661489U JPH0326059U (en) | 1989-07-24 | 1989-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8661489U JPH0326059U (en) | 1989-07-24 | 1989-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0326059U true JPH0326059U (en) | 1991-03-18 |
Family
ID=31636192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8661489U Pending JPH0326059U (en) | 1989-07-24 | 1989-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0326059U (en) |
-
1989
- 1989-07-24 JP JP8661489U patent/JPH0326059U/ja active Pending
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