JPH0326568B2 - - Google Patents
Info
- Publication number
- JPH0326568B2 JPH0326568B2 JP58046808A JP4680883A JPH0326568B2 JP H0326568 B2 JPH0326568 B2 JP H0326568B2 JP 58046808 A JP58046808 A JP 58046808A JP 4680883 A JP4680883 A JP 4680883A JP H0326568 B2 JPH0326568 B2 JP H0326568B2
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- view
- vibrating
- electrodes
- carbon paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
この発明はチツプ型のエネルギーとじこめ型圧
電共振部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a chip-type energy-confining piezoelectric resonant component.
エネルギーとじこめ型圧電共振部品、たとえば
セラミツクフイルタ又はセラミツク発振子は、第
１図に示すようにラジアルリード端子付きが主流
を占めていたが、この構造では、回路基板にとり
つける場合、背が高くて高密度実装に適さないの
と、自動挿入が難かしいという欠点があつた。そ
こで最近第２図に示すような積層コンデンサ、抵
抗器、ミニFETと同様なチツプ構造の圧電共振
部品が要望されてきた。このような構造が実現で
きると、上記欠点が解消されて、高密度実装がで
き、また他の部品（コンデンサ、抵抗器）とのサ
イズが統一されて自動挿入がより容易になる。 Energy confinement type piezoelectric resonant components, such as ceramic filters or ceramic resonators, have mainly been equipped with radial lead terminals, as shown in Figure 1. However, with this structure, when mounted on a circuit board, it is tall and expensive. The disadvantages were that it was not suitable for high-density mounting and that automatic insertion was difficult. Recently, there has been a demand for piezoelectric resonant components with chip structures similar to multilayer capacitors, resistors, and mini-FETs, as shown in Figure 2. If such a structure can be realized, the above-mentioned drawbacks will be eliminated, high-density packaging will be possible, and the sizes of other components (capacitors, resistors) will be unified, making automatic insertion easier.
この発明はこのような要望に答えようとするも
ので、以下にこの発明の実施例を図面を参照しな
がら説明する。 The present invention is intended to meet these demands, and embodiments of the present invention will be described below with reference to the drawings.
第３図以降において、１は圧電体用セラミツク
グリーンシートで焼成後、分極処理すると圧電板
となるものである。グリーンシート１は一枚ある
いは必要膜厚になるまで積層され、その両面中央
に振動電極２，３が設けられる。電極２，３から
は、グリーンシート１の対向する二辺へそれぞれ
リード電極４，５が導出形成されている。電極
２，３，４，５はたとえば印刷方法によつて形成
される。つぎに振動領域にカーボンペーストなど
焼成時に焼失する物質６をたとえば印刷などの方
法で付着させる。その後、グリーンシート１と同
質な複数枚のグリーンシート７で上記グリーンシ
ート１を挾むように積み重ね、圧着後焼成する。
焼成の過程においてカーボンペースト６は酸化反
応によつてCO、CO2等の気体となり、グリーン
シート７を透過して空気中へと飛散する。このよ
うに、振動領域に付着させたカーボンペースト６
が焼失することにより空洞８を有する焼結体９に
なる。なお、両端にはリード電極４，５にそれぞ
れ導通する端子電極１０，１１が焼成時あるいは
焼成後に形成される。あと、端子電極１０，１１
間に直流高電圧を加えて分極する。このようにし
て第７，８図に示すような、チツプ型のエネルギ
ーとじこめ型セラミツク二端子共振子又はセラミ
ツク発振子を製造することができる。尚、振動領
域に付着させる物質は、前記カーボンペーストだ
けに限らず、ポリエチレン、ポリプロピレン、ポ
リスチレン、ポリエチレンテレフタラート、ポリ
カーボネイトなど焼成する過程において加熱さ
れ、熱分解、酸化されて最終的にCO、CO2、
H2Oなどの気体になり飛散、焼失する物質であ
ればよい。これらの物質を直接、グリーンシート
に付着させてもよいし、これらの粉末をペースト
状に混練したものを塗布してもよい。また、エネ
ルギーとじこめ型二重モードフイルタに本発明を
適用することもできる。 In FIG. 3 and subsequent figures, reference numeral 1 denotes a ceramic green sheet for piezoelectric material which becomes a piezoelectric plate by subjecting it to polarization treatment after firing. The green sheet 1 is one sheet or laminated to a required thickness, and vibrating electrodes 2 and 3 are provided at the center of both sides. Lead electrodes 4 and 5 are formed extending from the electrodes 2 and 3 to two opposing sides of the green sheet 1, respectively. The electrodes 2, 3, 4, 5 are formed, for example, by a printing method. Next, a substance 6 such as carbon paste that is burned out during firing is applied to the vibration region by, for example, printing. Thereafter, a plurality of green sheets 7 having the same quality as the green sheet 1 are stacked so as to sandwich the green sheet 1, and after being pressed, they are fired.
During the firing process, the carbon paste 6 undergoes an oxidation reaction and becomes a gas such as CO, CO 2 , etc., which passes through the green sheet 7 and scatters into the air. In this way, the carbon paste 6 attached to the vibration area
By burning out, a sintered body 9 having a cavity 8 is formed. Note that terminal electrodes 10 and 11 electrically connected to lead electrodes 4 and 5, respectively, are formed at both ends during or after firing. Also, terminal electrodes 10 and 11
Polarize by applying a high DC voltage between them. In this way, a chip type energy confinement type ceramic two-terminal resonator or ceramic oscillator as shown in FIGS. 7 and 8 can be manufactured. The substances to be attached to the vibration region are not limited to the carbon paste mentioned above, but also include polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polycarbonate, etc., which are heated during the firing process, thermally decomposed and oxidized, and finally become CO, CO 2 ,
Any substance that turns into a gas such as H 2 O and scatters and burns out may be used. These substances may be directly attached to the green sheet, or a paste obtained by kneading these powders may be applied. Further, the present invention can also be applied to an energy confinement type dual mode filter.
第１図は従来セラミツクフイルタの正面図、第
２図は従来積層セラミツクコンデンサの斜視図、
第３図は本発明一実施例における平面図、第４図
も同じく平面図、第５図は同じく断面図、第６図
は同じく断面図、第７図は同じく斜視図、第８図
は同じく断面図。
１はグリーンシート、２，３は振動電極、４，
５はリード電極、６はカーボンペースト、７はグ
リーンシート、８は空洞、１０，１１は端子電
極。
Figure 1 is a front view of a conventional ceramic filter, Figure 2 is a perspective view of a conventional multilayer ceramic capacitor,
3 is a plan view of an embodiment of the present invention, FIG. 4 is a plan view, FIG. 5 is a sectional view, FIG. 6 is a sectional view, FIG. 7 is a perspective view, and FIG. 8 is a sectional view. Cross-sectional view. 1 is a green sheet, 2 and 3 are vibrating electrodes, 4,
5 is a lead electrode, 6 is a carbon paste, 7 is a green sheet, 8 is a cavity, and 10 and 11 are terminal electrodes.
Claims (1)
それぞれ振動電極とリード電極を設けたのちカー
ボンペーストなど焼成時に焼失する物質を振動領
域に付着させたものの上下にセラミツクグリーン
シートを重ねて焼成するとともにリード電極に導
通する端子電極を両端に設けたことを特徴とする
エネルギー閉じこめチツプ型圧電共振部品の製造
方法。1. After providing a vibrating electrode and a lead electrode on both sides of a piezoelectric ceramic green sheet, a substance that is burnt off during firing, such as carbon paste, is attached to the vibrating area. Ceramic green sheets are stacked on top and bottom of the vibrating area and fired, and the lead electrode is A method for manufacturing an energy-trapping chip-type piezoelectric resonant component, characterized in that conductive terminal electrodes are provided at both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4680883A JPS59172821A (en) | 1983-03-18 | 1983-03-18 | Method for manufacturing chip type piezoelectric resonator component parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4680883A JPS59172821A (en) | 1983-03-18 | 1983-03-18 | Method for manufacturing chip type piezoelectric resonator component parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59172821A JPS59172821A (en) | 1984-09-29 |
| JPH0326568B2 true JPH0326568B2 (en) | 1991-04-11 |
Family
ID=12757626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4680883A Granted JPS59172821A (en) | 1983-03-18 | 1983-03-18 | Method for manufacturing chip type piezoelectric resonator component parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172821A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212908A (en) * | 1985-03-18 | 1986-09-20 | Matsushita Electric Ind Co Ltd | Manufacture of piezoelectric ceramic vibrator |
| JPS62239706A (en) * | 1986-04-11 | 1987-10-20 | Nec Corp | Manufacture of piezoelectric ceramic vibrator |
| JPH0779221B2 (en) * | 1987-04-30 | 1995-08-23 | 株式会社村田製作所 | Chip type piezoelectric element |
| AU2003267835A1 (en) | 2002-09-27 | 2004-04-19 | Hwang, Soon Ha | Piezoelectric vibrator and fabricating method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50115789A (en) * | 1974-02-21 | 1975-09-10 | ||
| JPS57147315A (en) * | 1981-03-06 | 1982-09-11 | Nec Corp | Thickness oscillation piezoelectric ceramic oscillator |
-
1983
- 1983-03-18 JP JP4680883A patent/JPS59172821A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59172821A (en) | 1984-09-29 |
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