JPH0328635U - - Google Patents

Info

Publication number
JPH0328635U
JPH0328635U JP8927689U JP8927689U JPH0328635U JP H0328635 U JPH0328635 U JP H0328635U JP 8927689 U JP8927689 U JP 8927689U JP 8927689 U JP8927689 U JP 8927689U JP H0328635 U JPH0328635 U JP H0328635U
Authority
JP
Japan
Prior art keywords
insulating cylinder
metal piece
lead conductor
piece
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8927689U
Other languages
English (en)
Other versions
JP2504294Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989089276U priority Critical patent/JP2504294Y2/ja
Publication of JPH0328635U publication Critical patent/JPH0328635U/ja
Application granted granted Critical
Publication of JP2504294Y2 publication Critical patent/JP2504294Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す縦断面図、第
２図は本考案において使用するスカート状金属片
を示す側面図、第３図は本考案の別実施例を示す
縦断面図、第４図は従来例を示す縦断面図、第５
図は他の従来例の作動状態を示す説明図である。 １……リード導体、２……低融点可溶金属片、
３……フラツクス層、４……スカート状金属片、
５……絶縁筒、６……封止剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一直線状にて互いに対向せるリード導体間に低
    融点可溶金属片を橋設し、該金属片上に絶縁筒を
    挿通し、絶縁筒両端のそれぞれと各リード導体と
    の間を封止剤で封止せる直線型温度ヒユーズにお
    いて、絶縁筒内の各リード導体端部に、外周が絶
    縁筒内面に近接せるスカート状の金属片を取着し
    たことを特徴とする温度ヒユーズ。
JP1989089276U 1989-07-28 1989-07-28 温度ヒュ―ズ Expired - Lifetime JP2504294Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089276U JP2504294Y2 (ja) 1989-07-28 1989-07-28 温度ヒュ―ズ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089276U JP2504294Y2 (ja) 1989-07-28 1989-07-28 温度ヒュ―ズ

Publications (2)

Publication Number Publication Date
JPH0328635U true JPH0328635U (ja) 1991-03-22
JP2504294Y2 JP2504294Y2 (ja) 1996-07-10

Family

ID=31638859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089276U Expired - Lifetime JP2504294Y2 (ja) 1989-07-28 1989-07-28 温度ヒュ―ズ

Country Status (1)

Country Link
JP (1) JP2504294Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141346U (ja) * 1981-02-28 1982-09-04
JPS5941838U (ja) * 1982-09-01 1984-03-17 岡崎　資 温度ヒユ−ズ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141346U (ja) * 1981-02-28 1982-09-04
JPS5941838U (ja) * 1982-09-01 1984-03-17 岡崎　資 温度ヒユ−ズ

Also Published As

Publication number Publication date
JP2504294Y2 (ja) 1996-07-10

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