JPH0328664U - - Google Patents
Info
- Publication number
- JPH0328664U JPH0328664U JP8935789U JP8935789U JPH0328664U JP H0328664 U JPH0328664 U JP H0328664U JP 8935789 U JP8935789 U JP 8935789U JP 8935789 U JP8935789 U JP 8935789U JP H0328664 U JPH0328664 U JP H0328664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- conductor
- conductor surface
- soldered
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の実施例を示し、第
１図は、本考案の要部拡大縦断側面図、第２図は
、同上の接続例の側面略図である。
１……回路基板、２１，２２……導体、３１，
３２……半田メツキ、４……回路基板、６……異
方性樹脂膜。
1 and 2 show an embodiment of the present invention. FIG. 1 is an enlarged vertical sectional side view of the main part of the present invention, and FIG. 2 is a schematic side view of a connection example of the same. 1... Circuit board, 2 1 , 2 2 ... Conductor, 3 1 ,
3 2 ...Solder plating, 4...Circuit board, 6...Anisotropic resin film.
Claims (1)
に対向する他方の回路の導体面にそれぞれ予め半
田メツキを施し、両導体面上の各半田メツキ間に
異方性導電膜を介して加熱圧着することを特徴と
する回路の接続構造。 The conductor surface of one circuit to be connected and the conductor surface of the opposite circuit are each soldered in advance, and an anisotropic conductive film is placed between each solder plating on both conductor surfaces to bond them by heat and pressure. A circuit connection structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8935789U JPH0328664U (en) | 1989-07-29 | 1989-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8935789U JPH0328664U (en) | 1989-07-29 | 1989-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328664U true JPH0328664U (en) | 1991-03-22 |
Family
ID=31638937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8935789U Pending JPH0328664U (en) | 1989-07-29 | 1989-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328664U (en) |
-
1989
- 1989-07-29 JP JP8935789U patent/JPH0328664U/ja active Pending