JPH0328733U - - Google Patents

Info

Publication number
JPH0328733U
JPH0328733U JP1989089477U JP8947789U JPH0328733U JP H0328733 U JPH0328733 U JP H0328733U JP 1989089477 U JP1989089477 U JP 1989089477U JP 8947789 U JP8947789 U JP 8947789U JP H0328733 U JPH0328733 U JP H0328733U
Authority
JP
Japan
Prior art keywords
wire
sensor
rotary plate
wire spool
slit rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989089477U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989089477U priority Critical patent/JPH0328733U/ja
Publication of JPH0328733U publication Critical patent/JPH0328733U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は、本考案に係るワイヤ残量検知装置の
構成概略図、第2図は、従来のワイヤボンデイン
グ装置を示す図、第3図は、ワイヤボンデイング
を説明する概略図である。 1……ワイヤボンデイング装置、2……駆動モ
ータ、2a……回転軸、3……スリツト回転板、
3a……スリツト、4……センサ、5……カウン
タ、30……ワイヤスプール、40……ワイヤ。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプ上の電極とリードフレームとを、
    ワイヤスプールから繰り出したワイヤにて結線す
    るワイヤボンデイングにおいて、 上記ワイヤスプールを回転させる駆動モータの
    回転軸に取り付けたスリツト回転板と、 上記スリツト回転板のスリツトを検知すること
    でスリツト回転板の1回転を読み取るセンサと、 上記センサの読み取り信号でワイヤスプールの
    回転数を計量するカウンタとから成るワイヤボン
    デイングのワイヤ残量検知装置。
JP1989089477U 1989-07-28 1989-07-28 Pending JPH0328733U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089477U JPH0328733U (ja) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089477U JPH0328733U (ja) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328733U true JPH0328733U (ja) 1991-03-22

Family

ID=31639053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089477U Pending JPH0328733U (ja) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328733U (ja)

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