JPH0328733U - - Google Patents
Info
- Publication number
- JPH0328733U JPH0328733U JP1989089477U JP8947789U JPH0328733U JP H0328733 U JPH0328733 U JP H0328733U JP 1989089477 U JP1989089477 U JP 1989089477U JP 8947789 U JP8947789 U JP 8947789U JP H0328733 U JPH0328733 U JP H0328733U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- sensor
- rotary plate
- wire spool
- slit rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第1図は、本考案に係るワイヤ残量検知装置の
構成概略図、第2図は、従来のワイヤボンデイン
グ装置を示す図、第3図は、ワイヤボンデイング
を説明する概略図である。 1……ワイヤボンデイング装置、2……駆動モ
ータ、2a……回転軸、3……スリツト回転板、
3a……スリツト、4……センサ、5……カウン
タ、30……ワイヤスプール、40……ワイヤ。
構成概略図、第2図は、従来のワイヤボンデイン
グ装置を示す図、第3図は、ワイヤボンデイング
を説明する概略図である。 1……ワイヤボンデイング装置、2……駆動モ
ータ、2a……回転軸、3……スリツト回転板、
3a……スリツト、4……センサ、5……カウン
タ、30……ワイヤスプール、40……ワイヤ。
Claims (1)
- 【実用新案登録請求の範囲】 半導体チツプ上の電極とリードフレームとを、
ワイヤスプールから繰り出したワイヤにて結線す
るワイヤボンデイングにおいて、 上記ワイヤスプールを回転させる駆動モータの
回転軸に取り付けたスリツト回転板と、 上記スリツト回転板のスリツトを検知すること
でスリツト回転板の1回転を読み取るセンサと、 上記センサの読み取り信号でワイヤスプールの
回転数を計量するカウンタとから成るワイヤボン
デイングのワイヤ残量検知装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089477U JPH0328733U (ja) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089477U JPH0328733U (ja) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328733U true JPH0328733U (ja) | 1991-03-22 |
Family
ID=31639053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089477U Pending JPH0328733U (ja) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328733U (ja) |
-
1989
- 1989-07-28 JP JP1989089477U patent/JPH0328733U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0190298U (ja) | ||
| JPS61159871U (ja) | ||
| JPS6024180U (ja) | 電動機の光学式回転検出装置 | |
| JPS6177667U (ja) | ||
| JPS6237295U (ja) | ||
| JPS6013409U (ja) | 操舵角検出装置 | |
| JPH0187860U (ja) | ||
| JPH01121814U (ja) | ||
| JPS6051467U (ja) | 回転体の回転数検出装置 | |
| JPH01132969U (ja) | ||
| JPH02290509A (ja) | ロータリーエンコーダ | |
| JPH02133197U (ja) | ||
| JPS6074060U (ja) | いか釣機の回転検知器 | |
| JPS626879U (ja) | ||
| JPS6117612U (ja) | 操舵角検出装置 | |
| JPS633200U (ja) | ||
| JPH01113566U (ja) | ||
| JPH02122081U (ja) | ||
| JPS6175854U (ja) | ||
| JPS6417713U (ja) | ||
| JPS63158940U (ja) | ||
| JPS6117613U (ja) | 操舵角検出装置 | |
| JPS5880508U (ja) | 回転操作量検出装置 | |
| JPS6099881U (ja) | 偏平形ブラシレスモ−タ | |
| JPS63141461U (ja) |