JPH0328773U - - Google Patents
Info
- Publication number
- JPH0328773U JPH0328773U JP8929389U JP8929389U JPH0328773U JP H0328773 U JPH0328773 U JP H0328773U JP 8929389 U JP8929389 U JP 8929389U JP 8929389 U JP8929389 U JP 8929389U JP H0328773 U JPH0328773 U JP H0328773U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- view
- mounting structure
- board
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図は、本考案に係るチツプ部品の
取付構造の第１実施例を示す図で、第１図はチツ
プ部品の斜視図、第２図はチツプ部品を基板へ取
付けた状態の断面図、第３図、第４図は、本考案
に係るチツプ部品の取付構造の第２実施例を示す
図で、第３図はチツプ部品を基板へ取付ける前の
斜視図、第４図はチツプ部品を基板へ取付けた状
態の斜視図、第５図ａ，ｂは、本考案に係るチツ
プ部品の取付構造の第３実施例を示す図で、第５
図ａはチツプ部品の正面図、第５図ｂはチツプ部
品の側面図、第６図、第７図は従来例を示す図で
、第６図は平面図、第７図は断面図である。
１，１１……基板、２，３，１２，１３……配
線パターン、４，４０……チツプ部品、５，６，
８，９……電極部、１０……挿入部、１１ａ……
孔。
1 and 2 are views showing a first embodiment of the chip component mounting structure according to the present invention, FIG. 1 is a perspective view of the chip component, and FIG. 2 is a state in which the chip component is attached to the board. 3 and 4 are diagrams showing a second embodiment of the chip component mounting structure according to the present invention, and FIG. 3 is a perspective view before mounting the chip component to the board, and FIG. 5 is a perspective view of the chip component attached to the board, and FIGS. 5a and 5b are views showing a third embodiment of the chip component mounting structure according to the present invention.
Figure a is a front view of the chip component, Figure 5 b is a side view of the chip component, Figures 6 and 7 are views showing conventional examples, Figure 6 is a plan view, and Figure 7 is a sectional view. . 1, 11... Board, 2, 3, 12, 13... Wiring pattern, 4, 40... Chip parts, 5, 6,
8, 9... Electrode part, 10... Insertion part, 11a...
Hole.
Claims (1)
切欠いた部分を配線基板に形成された孔に挿着さ
れた構成のチツプ部品の取付構造。 A mounting structure for a chip component, in which a side surface of the chip component is cut out, and the cutout portion is inserted into a hole formed in a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8929389U JPH0328773U (en) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8929389U JPH0328773U (en) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328773U true JPH0328773U (en) | 1991-03-22 |
Family
ID=31638875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8929389U Pending JPH0328773U (en) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006134920A (en) * | 2004-11-02 | 2006-05-25 | Neomax Co Ltd | Laminated parts and laminated structure of laminated parts |
-
1989
- 1989-07-28 JP JP8929389U patent/JPH0328773U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006134920A (en) * | 2004-11-02 | 2006-05-25 | Neomax Co Ltd | Laminated parts and laminated structure of laminated parts |