JPH03287797A - Corrosion resistant member - Google Patents

Corrosion resistant member

Info

Publication number
JPH03287797A
JPH03287797A JP8986890A JP8986890A JPH03287797A JP H03287797 A JPH03287797 A JP H03287797A JP 8986890 A JP8986890 A JP 8986890A JP 8986890 A JP8986890 A JP 8986890A JP H03287797 A JPH03287797 A JP H03287797A
Authority
JP
Japan
Prior art keywords
corrosion
resistant member
ions
aluminum
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8986890A
Other languages
Japanese (ja)
Inventor
Shinji Inasawa
信二 稲澤
Kazuo Sawada
澤田 和夫
Koichi Yamada
浩一 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP8986890A priority Critical patent/JPH03287797A/en
Publication of JPH03287797A publication Critical patent/JPH03287797A/en
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 [産業上の利用分野コ この発明は、腐食性ガスを使用する半導体製造装置や真
空プラント等に使用する耐食性の部材および電線などに
関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to corrosion-resistant members and electric wires used in semiconductor manufacturing equipment, vacuum plants, etc. that use corrosive gases.

[従来の技術および発明が解決しようとする課題]アル
ミニウムおよびアルミニウム合金は、比較的耐食性に優
れている。しかし、これらを半導体製造装置中や真空プ
ラント中で、電線や各種の部材として用いると、化学蒸
着法等で使用する低融点金属の腐食性蒸気や腐食性の高
い無機ハロゲン化物ならびに有機金属化合物の原料ガス
等によって、腐食が早期に進行し、クラックが成長する
[Prior art and problems to be solved by the invention] Aluminum and aluminum alloys have relatively excellent corrosion resistance. However, when these are used as electric wires and various parts in semiconductor manufacturing equipment or vacuum plants, corrosive vapors of low-melting point metals used in chemical vapor deposition, highly corrosive inorganic halides, and organometallic compounds are generated. Corrosion progresses quickly and cracks grow due to raw material gas, etc.

このため、電線や各種の部材に陽極酸化処理を施すこと
が試みられている。これは、処理を施すことによって電
線や各種の部材に陽極酸化皮膜を形成させ、この皮膜に
よって腐食の進行を食い止めようとするものである。陽
極酸化では、通常の方法に従い、これらの金属を希硫酸
等の電解質水溶液中に浸漬し、アノード分極する。しか
しながら、このようにして陽極酸化皮膜を形成させた電
線および各種の部材は、耐食性の向上が若干見られるも
のの十分な耐食性を備えたものではなかった。
For this reason, attempts have been made to subject electric wires and various members to anodic oxidation treatment. This process involves forming an anodic oxide film on electric wires and various members, and using this film to prevent corrosion from progressing. In anodic oxidation, these metals are immersed in an aqueous electrolyte solution such as dilute sulfuric acid and anodically polarized according to a conventional method. However, although the electric wires and various members on which the anodic oxide film was formed in this manner showed some improvement in corrosion resistance, they did not have sufficient corrosion resistance.

それゆえに、この発明の目的は、アルミニウムまたはア
ルミニウム合金を用いた電線や各種の部材において、低
融点金属の腐食性蒸気、腐食性の高い無機ハロゲン化物
および有機金属化合物などに対する十分な耐食性を備え
た耐食部材を提供することにある。
Therefore, an object of the present invention is to provide electric wires and various members made of aluminum or aluminum alloy with sufficient corrosion resistance against corrosive vapors of low-melting point metals, highly corrosive inorganic halides, and organic metal compounds. An object of the present invention is to provide a corrosion-resistant member.

[課題を解決するための手段] 請求項1に従う耐食部材は、アルミニウムまたはアルミ
ニウム合金の表面を陽極酸化させて形成した耐食性の酸
化皮膜を有する耐食部材であって、陽極酸化皮膜中に、
クロムイオン、イツトリウム、ジルコニウムイオンおよ
びマグネシウムイオンからなる群より選ばれた少なくと
も一種のイオンを含浸させた後、焼成を行なうことによ
り、陽極酸化皮膜中に含浸させたイオンの酸化物を形成
させたことを特徴としている。
[Means for Solving the Problems] A corrosion-resistant member according to claim 1 is a corrosion-resistant member having a corrosion-resistant oxide film formed by anodizing the surface of aluminum or an aluminum alloy, the anodic oxide film containing:
After impregnating at least one type of ion selected from the group consisting of chromium ions, yttrium, zirconium ions, and magnesium ions, oxides of the impregnated ions are formed in the anodic oxide film by firing. It is characterized by

請求項2に従う耐食部材は、請求項1からなる耐食部材
の外層に、重合性有機金属化合物からなるセラミックス
前駆体の溶液を浸漬もしくは塗布した後、加熱処理する
ことにより、酸化物セラミックスの絶縁膜を形成させた
ことを特徴としている。
The corrosion-resistant member according to claim 2 is obtained by dipping or coating the outer layer of the corrosion-resistant member according to claim 1 with a solution of a ceramic precursor made of a polymerizable organometallic compound, and then heat-treating the outer layer to form an insulating film of oxide ceramics. It is characterized by the formation of

酸化物セラミックスの絶縁膜はほとんどすべての金属酸
化物系セラミックスによって形成できるが、その材質に
ついて例を挙げれば、5i02、A fL2 o3 、
Z r 04 、T t o2およびMgO等がある。
The insulating film of oxide ceramics can be formed from almost all metal oxide ceramics, but examples of the materials include 5i02, A fL2 o3,
Examples include Z r 04 , T t o2 and MgO.

また、重合性有機金属化合物として、金属アルコキシド
または金属のカルボン酸塩を用いることが好ましい。金
属アルコキシドを用いる場合、セラミックス前駆体の溶
液は、アルコール等の有機溶液に金属アルコキシドを添
加したものである。
Moreover, it is preferable to use a metal alkoxide or a metal carboxylate as the polymerizable organometallic compound. When using a metal alkoxide, the ceramic precursor solution is a solution obtained by adding the metal alkoxide to an organic solution such as alcohol.

また、必要に応じてこれに水および触媒を添加する。金
属アルコキシドとしては、たとえば、金属のエトキシド
、プロポキシドおよびブトキシド等がよく用いられる。
Additionally, water and a catalyst are added to this as necessary. As the metal alkoxide, for example, metal ethoxide, propoxide, butoxide, etc. are often used.

一方、金属のカルボン酸塩を用いる場合、セラミックス
前駆体の溶液は、金属のカルボン酸塩を適当な有機溶媒
に溶解したものである。このタイプの前駆体溶液を用い
る方法では、浸漬もしくは塗布後に加熱して熱分解する
ことによりセラミックスを生成させていく。このため、
用いる重合性有機金属化合物の分解温度は、その沸点や
あるいは昇華点よりも低いことが必要である。金属のカ
ルボン酸塩として具体的には、たとえば、ナフテン酸、
カプリル酸、ステアリン酸およびオクチル酸の金属塩が
好ましい。
On the other hand, when using a metal carboxylate, the ceramic precursor solution is a solution of the metal carboxylate in a suitable organic solvent. In a method using this type of precursor solution, ceramics are produced by immersion or coating and then heating and thermal decomposition. For this reason,
The decomposition temperature of the polymerizable organometallic compound used must be lower than its boiling point or sublimation point. Specific examples of metal carboxylates include naphthenic acid,
Metal salts of caprylic acid, stearic acid and octylic acid are preferred.

また、重合性有機金属化合物は、珪素、アルミニウム、
イツトリウム、ジルコニウムおよびマグネシウムからな
る群より選ばれた少なくとも一種の金属を含むものが好
ましい。
In addition, polymerizable organometallic compounds include silicon, aluminum,
Those containing at least one metal selected from the group consisting of yttrium, zirconium and magnesium are preferred.

[作用] 陽極酸化皮膜中にクロムイオン、イツトリウムイオン、
ジルコニウムイオンおよびマグネシウムイオンのうち少
なくとも一種を含浸させ加熱処理すると、被膜中に入り
込んだイオンは、酸化されながら陽極酸化皮膜と良好に
結合し、構造に欠陥の少ない(All、Cr)20s固
溶体を形成する。
[Action] Chromium ions, yttrium ions,
When at least one of zirconium ions and magnesium ions is impregnated and heat-treated, the ions that have entered the film bond well with the anodic oxide film while being oxidized, forming a (All, Cr) 20s solid solution with few structural defects. do.

この欠陥の少ない構造が、耐食性を向上させると考えら
れる。
This structure with fewer defects is thought to improve corrosion resistance.

また、陽極酸化皮膜中に含浸イオンの酸化物を分散させ
た後、セラミックス前駆体の溶液を浸漬もしくは塗布し
て加熱処理することにより酸化物セラミックスの絶縁膜
を形成すれば、耐食部材に高い絶縁性を付与することが
できるほか、元来多孔性である陽極酸化皮膜を緻密化し
耐食性もさらに向上する。
In addition, if an insulating film of oxide ceramics is formed by dispersing the oxide of the impregnated ions in the anodic oxide film, then dipping or applying a ceramic precursor solution and heat-treating it, it is possible to provide high insulation for corrosion-resistant parts. In addition to imparting properties, it also densifies the originally porous anodic oxide film, further improving its corrosion resistance.

[実施例コ 線径2mmφの純アルミニウム線1mを温度を10℃に
保持した15重量%希硫酸中に浸漬しアルミニウム基材
に正の電圧を印加して浴電流密度50A/dm2で2分
間陽極酸化した。この線材には、陽極酸化皮膜が約10
μm程度形成した。
[Example] 1 m of pure aluminum wire with a wire diameter of 2 mmφ is immersed in 15 wt% dilute sulfuric acid kept at a temperature of 10°C, a positive voltage is applied to the aluminum base material, and the anodized wire is anodized for 2 minutes at a bath current density of 50 A/dm2. Oxidized. This wire has an anodized film of about 10
It was formed on the order of μm.

次に、20重量%の三酸化クロムの水溶液中に10分程
度浸漬した後、150℃の熱風で乾燥した。
Next, after being immersed in a 20% by weight aqueous solution of chromium trioxide for about 10 minutes, it was dried with hot air at 150°C.

浸漬および150℃の乾燥の工程を5回行った後、その
線材をさらに酸素気流中500℃で乾燥した。
After performing the steps of dipping and drying at 150°C five times, the wire was further dried at 500°C in an oxygen stream.

この線材の表面をエネルギー分散型螢光X線分光分析装
置で分析したところ表面組成は、AQ−84atom%
、CCr−16ato%であった。
When the surface of this wire was analyzed using an energy dispersive X-ray fluorescence spectrometer, the surface composition was found to be AQ-84 atom%.
, CCr-16ato%.

この線材を、10mmTo r rのガリウム分圧で制
御された容器内に30時間放置した後、線材表面に存在
する腐食孔の深さを横断面観察より求めたところ、平均
値で2μmであった。また比較のため、陽極酸化を行な
う前の純アルミニウム基材と、クロム酸含浸前の陽極酸
化したアルミニウム基材を同様の腐食環境下に30時間
放置したところ、純アルミニウム基材に関しては腐食孔
の深さは10μm程度であり、陽極酸化アルミニウムに
関しては陽極酸化皮膜中に5μmの腐食孔が観測された
。このようにこの発明の耐食アルミニウム線は、良好な
耐食性を有していた。
After this wire was left in a container controlled at a gallium partial pressure of 10 mm Torr for 30 hours, the depth of the corrosion holes existing on the wire surface was determined by cross-sectional observation, and the average value was 2 μm. . For comparison, a pure aluminum base material before anodizing and an anodized aluminum base material before chromic acid impregnation were left in a similar corrosive environment for 30 hours. The depth was approximately 10 μm, and for the anodized aluminum, 5 μm corrosion holes were observed in the anodic oxide film. Thus, the corrosion-resistant aluminum wire of the present invention had good corrosion resistance.

また、陽極酸化皮膜中に酸化クロムを形成させた耐食電
線を、テトラブチルオルトシリケイト8モル%、水32
モル%、エタノール60モル%混合した溶液に、1.2
Nの濃硝酸をテトラブチルオルトシリケイトに対し10
0分の1モル添加し70℃で2時間加熱攪拌することに
より得た液に浸漬した後、400℃で10分間加熱する
工程を10回繰返し、最後に500℃酸素気流中で10
分間加熱を行なった。
In addition, a corrosion-resistant electric wire with chromium oxide formed in the anodic oxide film was prepared by adding 8 mol% of tetrabutyl orthosilicate and 32% of water.
mol%, ethanol 60 mol% mixed solution, 1.2
N concentrated nitric acid to tetrabutylorthosilicate 10
After adding 1/0 mole and heating and stirring at 70°C for 2 hours, the process of heating at 400°C for 10 minutes was repeated 10 times, and finally at 500°C in an oxygen stream for 10 minutes.
Heating was performed for a minute.

このようにして耐食電線上に酸化珪素の絶縁膜が5μm
程度形成された。以上のようにして得られた耐食電線は
絶縁破壊電圧が600vであり、さらに直径5cmの円
筒にこの絶縁被覆電線を巻きつけても被覆に何ら亀裂が
発生しないものであった。この線材を、10mmTor
rのガリウム分圧で制御された容器内に30時間放置し
たが、線材表面に存在する腐食孔はほとんど観測されな
かった。
In this way, a silicon oxide insulating film with a thickness of 5 μm was formed on the corrosion-resistant wire.
degree formed. The corrosion-resistant wire thus obtained had a dielectric breakdown voltage of 600 V, and even when the insulated wire was wound around a cylinder with a diameter of 5 cm, no cracks were generated in the coating. This wire rod is heated to 10mm Tor.
Although the wire was left in a container controlled at a gallium partial pressure of r for 30 hours, almost no corrosion holes were observed on the wire surface.

[発明の効果コ 以上説明したように、この発明は耐食性に非常に優れた
ものである。したがって、この発明を、半導体製造装置
中や真空プラント中で低融点金属の腐食性蒸気や腐食性
の高い無機ハロゲン化物ならびに有機金属化合物等にさ
らされる部材に使用すれば有効である。
[Effects of the Invention] As explained above, the present invention has excellent corrosion resistance. Therefore, the present invention is effective when applied to members exposed to corrosive vapors of low melting point metals, highly corrosive inorganic halides, organometallic compounds, etc. in semiconductor manufacturing equipment or vacuum plants.

5555

Claims (4)

【特許請求の範囲】[Claims] (1)アルミニウムまたはアルミニウム合金の表面を陽
極酸化させて形成した耐食性の酸化皮膜を有する耐食部
材であって、前記陽極酸化皮膜中に、クロムイオン、イ
ットリウムイオン、ジルコニウムイオンおよびマグネシ
ウムイオンからなる群より選ばれた少なくとも一種のイ
オンを含浸させた後、焼成を行なうことにより、前記陽
極酸化皮膜中に含浸させたイオンの酸化物を形成させた
ことを特徴とする耐食部材。
(1) A corrosion-resistant member having a corrosion-resistant oxide film formed by anodizing the surface of aluminum or an aluminum alloy, wherein the anodic oxide film contains a group consisting of chromium ions, yttrium ions, zirconium ions, and magnesium ions. A corrosion-resistant member characterized in that the anodic oxide film is impregnated with at least one selected ion and then fired to form an oxide of the impregnated ion.
(2)請求項1からなる耐食部材の外層に、重合性有機
金属化合物からなるセラミックス前駆体の溶液を浸漬も
しくは塗布した後、加熱処理することにより、酸化物セ
ラミックスの絶縁膜を形成させたことを特徴とする耐食
部材。
(2) An insulating film of oxide ceramics is formed on the outer layer of the corrosion-resistant member according to claim 1 by dipping or applying a solution of a ceramics precursor made of a polymerizable organometallic compound and then heat-treating it. A corrosion-resistant member characterized by:
(3)前記重合性有機金属化合物が、金属アルコキシド
または金属のカルボン酸塩である請求項2に記載の耐食
部材。
(3) The corrosion-resistant member according to claim 2, wherein the polymerizable organometallic compound is a metal alkoxide or a metal carboxylate.
(4)前記重合性有機金属化合物が、珪素、アルミニウ
ム、イットリウム、ジルコニウムおよびマグネシウムか
らなる群より選ばれた少なくとも一種の金属を含むこと
を特徴とする請求項2に記載の耐食部材。
(4) The corrosion-resistant member according to claim 2, wherein the polymerizable organometallic compound contains at least one metal selected from the group consisting of silicon, aluminum, yttrium, zirconium, and magnesium.
JP8986890A 1990-04-03 1990-04-03 Corrosion resistant member Pending JPH03287797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8986890A JPH03287797A (en) 1990-04-03 1990-04-03 Corrosion resistant member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8986890A JPH03287797A (en) 1990-04-03 1990-04-03 Corrosion resistant member

Publications (1)

Publication Number Publication Date
JPH03287797A true JPH03287797A (en) 1991-12-18

Family

ID=13982750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8986890A Pending JPH03287797A (en) 1990-04-03 1990-04-03 Corrosion resistant member

Country Status (1)

Country Link
JP (1) JPH03287797A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0648866A1 (en) * 1993-10-15 1995-04-19 Applied Materials, Inc. Alumina coatings
US5580800A (en) * 1993-03-22 1996-12-03 Semiconductor Energy Laboratory Co., Ltd. Method of patterning aluminum containing group IIIb Element
US5830786A (en) * 1993-02-22 1998-11-03 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating electronic circuits with anodically oxidized scandium doped aluminum wiring
US6776873B1 (en) * 2002-02-14 2004-08-17 Jennifer Y Sun Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers
US7311797B2 (en) * 2002-06-27 2007-12-25 Lam Research Corporation Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
US7479304B2 (en) 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US8016948B2 (en) 2002-02-14 2011-09-13 Applied Materials, Inc. Method of removing contaminants from a coating surface comprising an oxide or fluoride of a group IIIB metal
US8129029B2 (en) 2007-12-21 2012-03-06 Applied Materials, Inc. Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating
US8367227B2 (en) 2007-08-02 2013-02-05 Applied Materials, Inc. Plasma-resistant ceramics with controlled electrical resistivity
JP2017526127A (en) * 2014-08-07 2017-09-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA High temperature insulated aluminum conductor
US10622194B2 (en) 2007-04-27 2020-04-14 Applied Materials, Inc. Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance
US10840113B2 (en) 2007-04-27 2020-11-17 Applied Materials, Inc. Method of forming a coated article and semiconductor chamber apparatus from yttrium oxide and zirconium oxide

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5830786A (en) * 1993-02-22 1998-11-03 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating electronic circuits with anodically oxidized scandium doped aluminum wiring
US5580800A (en) * 1993-03-22 1996-12-03 Semiconductor Energy Laboratory Co., Ltd. Method of patterning aluminum containing group IIIb Element
EP0648866A1 (en) * 1993-10-15 1995-04-19 Applied Materials, Inc. Alumina coatings
US5705225A (en) * 1993-10-15 1998-01-06 Applied Materials, Inc. Method of filling pores in anodized aluminum parts
US6776873B1 (en) * 2002-02-14 2004-08-17 Jennifer Y Sun Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers
US7479304B2 (en) 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US7846264B2 (en) 2002-02-14 2010-12-07 Applied Materials, Inc. Cleaning method used in removing contaminants from a solid yttrium oxide-containing substrate
US8016948B2 (en) 2002-02-14 2011-09-13 Applied Materials, Inc. Method of removing contaminants from a coating surface comprising an oxide or fluoride of a group IIIB metal
US8067067B2 (en) 2002-02-14 2011-11-29 Applied Materials, Inc. Clean, dense yttrium oxide coating protecting semiconductor processing apparatus
US7311797B2 (en) * 2002-06-27 2007-12-25 Lam Research Corporation Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
US10622194B2 (en) 2007-04-27 2020-04-14 Applied Materials, Inc. Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance
US10840113B2 (en) 2007-04-27 2020-11-17 Applied Materials, Inc. Method of forming a coated article and semiconductor chamber apparatus from yttrium oxide and zirconium oxide
US10840112B2 (en) 2007-04-27 2020-11-17 Applied Materials, Inc. Coated article and semiconductor chamber apparatus formed from yttrium oxide and zirconium oxide
US10847386B2 (en) 2007-04-27 2020-11-24 Applied Materials, Inc. Method of forming a bulk article and semiconductor chamber apparatus from yttrium oxide and zirconium oxide
US11373882B2 (en) 2007-04-27 2022-06-28 Applied Materials, Inc. Coated article and semiconductor chamber apparatus formed from yttrium oxide and zirconium oxide
US8367227B2 (en) 2007-08-02 2013-02-05 Applied Materials, Inc. Plasma-resistant ceramics with controlled electrical resistivity
US8871312B2 (en) 2007-08-02 2014-10-28 Applied Materials, Inc. Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber
US8758858B2 (en) 2007-12-21 2014-06-24 Applied Materials, Inc. Method of producing a plasma-resistant thermal oxide coating
US8129029B2 (en) 2007-12-21 2012-03-06 Applied Materials, Inc. Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating
JP2017526127A (en) * 2014-08-07 2017-09-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA High temperature insulated aluminum conductor

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