JPH03290217A - Mold device for sealing resin - Google Patents

Abstract

PURPOSE:To prevent a molded product from running short of the filling quantity or generating voids by providing dummy cavities for respective cavities and making the filling time of resin almost equal. CONSTITUTION:Totally eight cavities 1a-1h are provided at equal intervals on both sides of four runner 8. There is the difference of resin filling time between cavities 1a and 1b which are closest to a cull 7 and cavities 1g and 1h furthest therefrom. In the case that four cavities 1 are disposed in parallel, the filling quantity in the same length of time gets less and less as the distance between the respective cavities and a cull 7 gets longer, and the filling quantity is reduced by the unit of 1/4 of the volume of cavity 1 for respective cavities, which results in the longer filling time corresponding to said reduction ratio. In order to make the filling time to that of cavities 1g and 1h, which requires the longest filling time, therefore, dummy cavities 21a and 21b having the volume of 3/4 of that of the cavity 1 are annexed to the cavities 1a and 1b, dummy cavities 21c and 21d having the volume of 1/2 of that of the cavity are annexed to the cavities 1c and 1d, and dummy cavities 21e and 21f having the volume of 1/4 of that of the cavity are annexed to the cavities 1e and 1f. The shortage of filling or the generation of voids is eliminated by said arrangement.

Description

[Detailed Description of the Invention] [Table of Contents] Overview Industrial Field of Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems --- 15 Effects ---
---1------
7 Examples −:−−−−−−−−−−−−−−−−−
-------------20 Perspective view of the first embodiment of the present invention (Fig. 1) Plan view of Fig. 1 (Fig. 2) Partially enlarged perspective view of Fig. 1 (Fig. 3) A perspective view of the second embodiment of the present invention (Fig. 4) An explanatory diagram of the third embodiment of the invention (Fig. 5) A perspective view of the fourth embodiment of the invention (Fig. Figure 6) Perspective view of the fifth embodiment of the present invention (Figure 7) Perspective view of the sixth embodiment of the present invention (Figure 8) Effects of the invention −−−−−−−−−−−−
-30 [Summary] Regarding mold equipment for resin sealing, the purpose is to make the filling time of resin for each cavity the same and to prevent insufficient filling amount or the formation of cavities in the molded product. , a dummy cavity is provided for forming a resin-sealed molded product, and a plurality of cavities are provided on the abutment surface of at least one of the upper mold and the lower mold, and The type is
It has a pot on the upper surface and a sprue inside that is connected to the pot and penetrates the abutting surface, and at least one of the upper mold or the lower mold has a cull that is continuous to the sprue and a cull that is continuous to the cull on the abutting surface. The dummy cavity has a plurality of runners and a plurality of gates connected to each of the runners, each of the cavities is connected to a gate, and the dummy cavity has a dummy gate on a side wall of the cavity facing the gate. It is attached through
The dummy cavities are configured to have volumes determined so that the filling time of the resin flowing into each cavity from the cull is approximately equal.

Moreover, it has the above-mentioned cavity and a shared dummy cavity, and the shared dummy cavity includes a plurality of cavities.
The structure is such that it is commonly attached to each side wall facing the gate via a dummy gate.

[Industrial application field]

The present invention relates to a mold device for resin sealing, and in particular, it is possible to provide a dummy cavity for each of a plurality of cavities so that the resin filling time for each cavity is equal, or to provide a shared dummy cavity to fill all the cavities. To provide a mold device for resin sealing that prevents the flow of resin from stopping until the cavity is completely filled with resin, and prevents insufficient resin filling and voids in the cavity near the cull.

In recent years, the progress of semiconductor integrated circuits (IC) has been remarkable.
With the introduction of IC in various fields,
The production volume of C is also increasing dramatically.

As a result, the importance of IC manufacturing technology, that is, the manufacturing technology of a series of manufacturing processes from the wafer stage to the finished product as a semiconductor device, is increasing.

The IC manufacturing process can be divided into a pre-process from the wafer stage to the formation of a large number of fine elements, and a post-process from cutting the wafer into chips to finishing the product. The post-process is divided into an assembly process and an inspection process.

The assembly process involves cutting the wafer into chips, mounting them, bonding them, sealing them, and marking them.As devices become smaller, more dense, and larger in capacity, the manufacturing cost of ICs increases. It has become an important process that has the greatest impact on

Among them, the sealing process is a so-called punching process to protect the element and take out the lead-out terminals, and various forms and methods are adopted, but the one that is highly efficient in manufacturing and low in cost. Because they are cheap, resin-sealed packages using molding technology are often used.

It is said that the manufacturing cost of a TC is determined by the sealing process including the package, and it is important to improve the efficiency of resin sealing technology and the sealing equipment used to carry out the process.

[Conventional technology]

For resin encapsulation of semiconductor devices, for example, a lead frame is set in a sealing mold, with the chip fixed to a mounting part called a header and wire-bonded with gold wire to terminal parts called inner leads. This is done by pouring a sealing resin.

FIG. 9 is a perspective view of an example of a conventional mold apparatus for resin sealing, and FIG. 10 is a partially enlarged perspective view of FIG. 9.

In the figure, l is the cavity, 3 is the upper mold, 4 is the lower mold, 5 is the pot, 6 is the sprue, 7 is the cull, 8 is the runner, 9 is the gate, 11 is the cavity block, 12 is the lead frame,
20 is a mold device.

Resin encapsulation of semiconductor devices, like other electronic components, must be molded with precision and low molding pressure. For example, a type of transfer molding method using thermosetting resin such as epoxy resin is used. This is generally done by a certain low-pressure encapsulation molding method.

Therefore, the mold apparatus 20 shown in FIG. 9 is an example of a mold for transfer molding, and an upper mold 3 and a lower mold 4 that abut
It is composed of.

For example, in the case of a semiconductor device, a lead frame 12 on which a chip is mounted is carried by a holder called a loading frame (not shown), and placed between two molds 3.
．． 4 and resin sealing is performed.

The upper mold 3 is provided with a pot 5 (material chamber) in which resin is charged and heated to melt, soften, and plasticize the resin, and then press the resin into the mold.

In the case of resin sealing of semiconductor devices and the like, so-called multi-piece molding is generally used in which a plurality of molded products can be obtained by one molding. In this case, a cull 7 is connected to the pot 5 via an injection hole called a sprue 6.

The recesses (cavities in a broad sense) and protrusions (cores) that are drilled from this cull 7 first are drilled in the upper mold 3 and lower mold 4 depending on the shape of the molded product, and the two Type 3.4
The structure is such that a desired molded product can be obtained when the two are collided.

From this cull 7, a plurality of runners 8 (runners) are provided that radiate out in all directions.

The cavity l that gives the shape of the molded product may be carved directly into the upper and lower molds 3.4 depending on the shape of the molded product.

However, in a so-called multi-cavity mold device 20 that can perform a large number of resin seals in a single molding process, as shown in FIG. In some cases.

In such a multi-cavity configuration, each cavity 1 is connected to the in-block runner 8a via the gate 9.
It is connected to

The cavity block 1 is nested (
When the cavity block 11 is inserted, the in-block runner 8a is connected to the runner 8 coming out of the cull 7 at the runner joint part 8b.

The resin heated and melted in pot 5, softened and plasticized,
First, it is pushed out through the sprue 6 into the cull 7. Next, from the cull 7, it passes through the runner 8, and if the cavity I constitutes a cavity block 11, it passes through the intra-block runner 8a, and finally, it is filled into each cavity 1 from the branched gate 9.

By the way, the molding process of thermosetting resin includes plasticization, shaping,
Curing takes place in three stages. Therefore, in the transfer molding method, the first stage resin is heated and plasticized in the pot 5 to reduce its viscosity and become more fluid, and is filled into the cavity 1 through the runner 8. It is in the first stage of plasticization. Then, in the second stage, the resin is sufficiently filled to every corner of the cavity 1 to reach a predetermined molding pressure, and a desired shape is imparted. After this, in the case of a thermosetting resin, a third stage of curing is performed, for example, by a chemical reaction such as condensation polymerization or addition polymerization.

In transfer molding, the third stage of curing begins after the second stage is completed when the resin is spread to every corner of all the multiple cavities 1 and the molding pressure is uniformly applied to all the cavities I. is desirable.

1. However, as the number of molded products obtained in one molding process for mass production of ICs has increased, the scale of mold equipment has also become larger, the runners 8 have become longer, and the number of cavities 1 has also increased. .

Therefore, there is a time difference between the cavity 1 located in the center near the cull 7 and the cavity l located in the peripheral part away from the cull 7 until every corner is filled with resin.

In the case of the mold device 20 in which the cavity block 11 is nested, there is a tendency for a difference in filling time to occur between the cavity 1 near the runner joint 8b and the cavity 1 distant from the runner joint 8b. But it appears.

Then, the flow of the resin in the cavity l near the cull 7, which is filled quickly, stops before a predetermined molding pressure is sufficiently applied. Then, due to the nature of the thermosetting resin, curing begins quickly.

As a result, insufficient filling of the resin, so-called dead ends, or cavities (voids) often occur.

To deal with this, there are conventional multi-pot mold devices in which the number of pots 5 is increased in proportion to the number of cavities 1, but there is a limit to the number of molded products that can be obtained in one molding, and the efficiency is It was not a practical solution.

[Problem to be solved by the invention]

As described above, as the scale of the mold becomes larger and the number of cavities increases, the time required to fill the mold with resin differs between cavities.

Therefore, although sufficient molding pressure is not yet applied to the cavity in the peripheral area away from the cull because it is still being filled with resin, the flow of resin has already stopped in the cavity in the center near the cull and curing has begun. A situation like this occurs.

Therefore, in the central cavity near the cull,
There were problems in that curing progressed under insufficient molding pressure, resulting in insufficient resin filling and the formation of cavities in the molded product because there was no place for air to escape.

Therefore, in the present invention, a dummy cavity is attached to each cavity so that the resin filling time for each cavity is equal to X, and the resin continues to flow until each cavity is filled with resin. It is an object of the present invention to provide a mold for resin sealing in which a common shared dummy cavity is attached to each cavity so that the dummy cavity does not stop.

[Means to solve the problem]

The above-mentioned problem has a cavity and a dark cavity, the cavity is for shaping a resin-sealed molded product, and a plurality of molds are formed on the abutting surface of at least one of the upper mold and the lower mold. The upper mold has a pot on the upper surface and a sprue inside that is connected to the pot and penetrates the abutment surface, and at least one of the upper mold or the lower mold has: The abutting surface has a cull connected to the sprue, a plurality of runners connected to the cull, and a plurality of gates connected to each of the runners, each of the cavities connected to the gate, and the dummy. The cavity is attached to the side wall of the cavity opposite to the gate via a dummy gate, and the dummy cavity is designed so that the filling time of the resin flowing from the cull into each cavity is equal. This problem is solved by a resin sealing mold device configured to have a predetermined volume.

Further, the cavity includes the above-mentioned cavity and a shared dummy cavity, and the shared dummy cavity is configured to be commonly attached to each side wall of the plurality of cavities facing the gate via a dummy gate. The problem is solved by a mold device for resin sealing.

5 [Function] As mentioned above, in the mold device for resin sealing, when the resin flowing out from the cull is filled into the cavity via the runner and the gate, the length of the path the resin takes is Due to the difference, there is a difference in the filling time, and all the cavities are filled with enough resin to be partitioned. Therefore, the molding pressure is not applied enough, and curing starts in the cavity near the cull, resulting in insufficient resin filling. However, in the present invention, the filling time is the same for all cavities.

In other words, in the central cavity near the cull, the resin starts to flow immediately, whereas in the peripheral cavities separated from the cull, the resin starts to flow by the length of the runner as they move away from the cull. Because time is late,
In the present invention, this time delay is corrected by a dowel cavity.

This dummy cavity is provided through a dummy gate on the side wall of the cavity facing the gate 6. The volume of the dummy cavity at the center is increased, and the volume gradually decreases toward the periphery, so that a volume gradient is created.

In this case, it will take a longer time for the cavity in the center to be filled with resin, and it is possible to buy time until the cavities in the peripheral part are filled with resin.

On the other hand, if the cavities are bored in a cavity block and nested, the volume of the dummy cavities attached to each cavity should be made smaller sequentially starting from the cavity closest to the runner coupling part of the runner in the block. ing.

In this way, the resin filling time in each cavity can be made approximately equal for each cavity block, which is effective for molds with many cavities in which a large number of molded products can be obtained from one bottom shape.

Further, by raising the bottom of the dummy cavity by supporting short plates of various thicknesses on the bottom wall of the dummy cavity, the volume of the dummy cavity can be arbitrarily varied.

In this case, the dummy cavities do not have to be drilled in advance with varying volumes, but can be drilled with the same volume. In particular, when the cavity is provided in a cavity block, the capacity of the dummy cavity can be appropriately selected depending on the fitting position of the insert, which is convenient.

In this way, if the resin filling times of a large number of cavities are made equal, the time during which the flow of resin stops in each cavity can be made equal. As a result, when a predetermined molding pressure is equally applied to all cavities, curing starts at the same time, so that insufficient filling and the formation of cavities can be avoided.

On the other hand, instead of attaching a dummy cavity to each individual cavity via a dummy gate, a shared dummy cavity is attached in common.

Even in the central cavity where the resin filling time is short, the resin is allowed to flow into the shared dummy cavity through the dowel gate, so that the flow of the resin does not stop inside the cavity and the resin does not harden. There is.

In this way, when all the cavities, both the central cavity and the peripheral cavity, are uniformly filled with resin and the same predetermined molding pressure is applied, curing will start at the same time, so there will be no shortage of filling. and cavitation can be avoided.

Furthermore, it is even more effective to adjust the flow rate of each dummy gate using a throttle member.

[Embodiment] Fig. 1 is a perspective view of the first embodiment of the present invention, and Fig. 2 is a perspective view of the first embodiment of the present invention.
In the plan view of the figure, (A) is the upper mold, (B) is the lower mold,
FIG. 3 is a partially enlarged perspective view of FIG. 1, FIG. 4 is a perspective view of a second embodiment of the present invention, FIG. 5 is an explanatory diagram of a third embodiment of the present invention, and FIG. Fig. 7 is a perspective view of the fifth embodiment of the present invention, and Fig. 8 is a perspective view of the main parts of the sixth embodiment of the present invention. be.

In the figure, 1 is a cavity, 2 is a dummy cavity, 2a is a dummy gate, 2b is a single plate, 2e is a diaphragm member, 2f
is a channel hole, 3 is an upper mold, 4 is a lower mold, 5 is a bot, 6 is a sprue, 7 is a cull, 8 is a runner, 8a is a runner in the block, 9 is a gate, 10 is a shared duck cavity, 11 2 is a cavity block, and 20 is a mold device.

Example = 1 In Figs. 1 to 3, the cavity l is formed when a lead frame (not shown) is held between an upper die 3 and a lower die 4 and molded, and the resin-sealed package is placed inside the lead frame. Because of the upper and lower protrusions, the dummy cavity 2 is bored in both the upper mold 3 and the lower mold 4 in the Kogitsune, and therefore the dummy cavity 2 is also bored in the upper and lower molds 3.4.

The bot 5 and the sprue 6 connected thereto are provided on the upper mold 3.

0 The cull 7 connected to this sprue 6 and the four runners 8 extending in all directions from the cull 7 are installed on the lower mold 4, and the ceiling of the cull 7 partially protrudes into the upper mold 3. There is.

On both sides of each of the four runners 8, a total of eight cavities la, lb...1h are provided, four cavities at equal intervals.

The volume of cavity 1 is determined by the size of the molded product, but the volume of each cavity 1 is 3.6 cm.
3. Then, for example, 60 kg /
There is a difference of 4 seconds in the resin filling time between the cavities la, lb closest to the cull 7 and the cavities Ig, 1h furthest from the cull 7 when pressed with a molding pressure of "cm".

On the other hand, if we check the amount of resin filled in each cavity 1 by sealing any gate 9 of cavity 1 or stopping the flow of resin at various times during molding, we find that The amount of resin filled is gradually reduced by one for the number of cavities 1 provided. That is, when there are four cavities in a row, the filling amount decreases by 1/4 of the volume of the cavity 1 as the distance from the cull 7 increases, and the filling time increases accordingly.

Therefore, the cavities that require the longest filling time are 1g and 1h.
In order to make the filling time equal to the filling time, cavities la and lb are filled with dummy cavities 21a and 21b having a volume of 3/4 of cavity 1, cavities lc and ld are filled with dummy cavities 21a and 21b having a volume of 3/4 of cavity 1, and cavities lc and ld have a volume of 1/2 of cavity l. It is sufficient to attach dummy cavities 21c and 21d having a volume of , and dummy cavities 21e and 21f having a volume of 1/4 of the cavity 1 to the cavities le and If, respectively.

Therefore, the dummy cavities 421a and 21b attached to the cavities 1a and 1b are each 2.7 cm3, and the dummy cavity 21C1 attached to the cavity 1cXld is 2.7 cm3.
21d is 1.8cm", and dummy cavities 21e and 21f attached to cavities le and if are 0.9cm'.
It has a volume gradient such that

The volume of each of the dummy cavities 2 is obtained by keeping the depth constant and varying the area of the opening. Further, it is attached to each cavity 1 via a dummy gate 2a provided on a side wall facing the gate 9 of each cavity 1.

Using the thus completed mold device 20, the amount of resin filled in a blank state was examined, and it was confirmed that all cavities l were filled with resin in the same amount of time.

In addition, when we tried the bottom shape of a flat back package semiconductor device, we found that the cavity la, which is particularly close to cull 7,
There was no lack of resin filling or formation of cavities, which tend to occur with 1b.

Embodiment: 2 In FIG. 4, four runners 8 connected to the cull 7 branch into two branches in the middle to form eight runners 8.

On the other hand, eight cavities 1 are connected to each block runner 8a to form a cavity block 11.

The in-block runners 8a are multi-cavity molds W20 that are connected to each runner 8 via the runner joints 38b.

In this mold assembly w20, the first group of cavity blocks lla are fitted at equal distances when viewed from cull 7.
, 11b, 11c, and 11d, and a second group of cavity blocks lie, Ilf, l1g, and llb, and the time required for the resin to reach the runner joint portion 8b is different between the first group and the second group. The time difference is 0.7 seconds.

Now, in the same way as in Example 1, each cavity block 11 is used as a unit, and each cavity 1 is
I installed a dummy cavity 2 and tried resin sealing.

As a result, the first group of cavity blocks lla~lid, which tended to be insufficiently filled with resin and the formation of cavities due to their distance from Cull 7, were found to have the same problem as the second group of cavity blocks lie~llb. There was no lack of resin filling or formation of cavities.

Example: 3 4 In FIG. 5, a plurality of dummy cavities 2 are provided, all of which have the same opening, the same depth, and the same volume, which improves mold manufacturing efficiency. A screw hole 2c is cut in the bottom wall of the dummy cavity 2.

On the other hand, the dummy plate 2b is a metal plate of various thicknesses that fits loosely into the dummy cavity 2, and is provided with a slotted hole 2d opposite the slotted hole 2C, so that it can be screwed into the slotted cavity 2. It looks like this.

Then, when the molding conditions change and the volume of the dummy cavity 2 needs to be changed, the volume of the dummy cavity 2 can be changed as appropriate by selecting the dummy plate 2b.

Example=4 In FIG. 6, the arrangement of the cavity 1 and the dummy cavity 2 is opposite to that of the first example.

That is, a dummy cavity 2 is connected to the gate 9, and each cavity 1 is attached to the dummy cavity 2 via a dummy gate 2a.

The concept of the volume of the dummy cavity 2 is as follows in Example 1.
It is similar to

In this example as well, there was no insufficient resin filling or no cavities.

Embodiment 5 In FIG. 7, a shared dummy cavity 10 is commonly attached to the side wall of the cavity 1 facing the gate 9 via a dummy gate 2a.

Then, the resin flows in the direction of the arrow from cavity 1 to dowel gate 2a to common dame 5 to cavity 10 until all cavities 1 and common dummy cavities 10 are filled with resin.

As a result, curing of the resin starts early in the central cavity 1, and problems such as insufficient resin filling and the formation of cavities can be prevented.

Embodiment 6 In FIG. 8, a diaphragm member 2e can be fitted into a dummy gate 2a. This throttle member 2e has a flow passage hole 2f in the center through which the resin passes, and depending on the size of this flow passage hole 2f, the cavity 1=-+dummy gate 2a→shared ξ−follows the arrow direction of the cavity 10. It is designed to adjust the flow rate of resin.

In other words, the cavity 1 in the center is the cavity l in the peripheral part.
The amount of resin inflow is larger than that of the previous model. Therefore, dummy game) 2a
Adjust the flow rate of the resin by squeezing it appropriately, and move the central cavity 1 → daku-gate 2a [phase] shared da ξ-cavity 10.
→Prevents resin from flowing back into cavity 1 at the periphery.

Therefore, the size of the flow passage hole 2f is the same as that of the cavity 1 in the center.
A flow rate gradient is provided so that the flow rate of the dummy gate 2a is smaller (and the flow rate of the dummy gate 2a of the peripheral cavity 1 is larger).

In this way, it is possible to prevent the flow of resin from stopping until all the cavities 1 are filled with resin, and it is possible to prevent problems such as insufficient filling of resin and the formation of cavities.

How to set the volume of the dummy cavity depends on various factors such as molding conditions, molding pressure, molding temperature, resin flowability due to viscosity and friction with the mold, mold temperature, and the shape and dimensions of each part. Deformation is possible.

Also, to create a volume gradient in the dummy cavity, here the depth was kept constant and the area of the opening was changed, but it is also possible to keep the area of the opening constant and change the depth, using a dummy plate. If necessary, the support of the single plate is not limited to screwing, and various modifications are possible.

Furthermore, in this review, the cavity that is farthest from the cull and takes the longest time to fill with resin was used as the standard, and no dummy cavities were provided for that cavity, but dummy cavities were provided for all cavities and the filling time could be set as desired. It can also be set to , and various modifications are possible.

Furthermore, in this case, a throttle member was fitted to create a resin flow rate gradient at the Yukui gate, but if the conditions are clear, for example, when manufacturing the mold device, The dummy gate can also be processed to have a flow rate gradient, and various modifications are possible.

8. Furthermore, instead of fitting the individual aperture members to the individual dummy gates, they may be fitted to the dummy gates arranged in a row all at once.

〔Effect of the invention〕

As described above, the number of cavities disposed in a mold is increasing more and more so that a larger number of molded products can be obtained by one molding. Therefore, there is a difference in the time required for filling each cavity with resin. Conventionally, there have been problems such as insufficient filling of resin or the formation of cavities, especially in cavities near the cull.

On the other hand, in the present invention, a dummy cavity is provided for each cavity, and the time required to fill the resin is determined!
``Equal cavities, or provide a common shared dummy cavity for each cavity so that the flow of resin does not stop until the resin is filled.
This prevents such failures from occurring.

As a result, the yield in the sealing process, particularly for resin-sealed semiconductor devices, is improved, and the present invention greatly contributes to improving the productivity of products that are resin-sealed.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a perspective view of the first embodiment of the present invention.
3 is a partially enlarged perspective view of FIG. 1, FIG. 4 is a perspective view of the second embodiment of the present invention, and FIG. 5 is an explanatory diagram of the third embodiment of the present invention. , FIG. 6 is a perspective view of the fourth embodiment of the invention, FIG. 7 is a perspective view of the fifth embodiment of the invention, and FIG. 8 is a perspective view of the sixth embodiment of the invention. FIG. 9 is a perspective view of an example of a conventional mold device for resin sealing, and FIG. 1O is a partially enlarged perspective view of FIG. 9. 2a is a short gate, 2b is a 5-plate, 2e is a throttle member, 2r is a channel groove, 3 is an upper mold,
4 is the lower mold, 5 is the pot, 6 is the sprue, 7 is the cull,
8 is a runner, 8a is a runner in the block, 8b
is a runner coupling part, 9 is a gate, 10 is a shared dummy cavity, and 11 is a cavity block. In the figure, ■ is the cavity, 2 is the dummy cavity, 1 2 (A) Upper mold JP-A-290217 (10)

Claims (1)

[Claims] 1) It has a cavity (1) and a dummy cavity (2), the cavity (1) is for shaping a resin-sealed molded product, and the cavity (1) is for shaping a resin-sealed molded product, and the cavity (1) is for shaping a resin-sealed molded product, A plurality of pots are provided on at least one abutting surface of the lower die (4), and the upper die (1) has a pot (5) on the upper surface and an abutting hole connected to the pot (5) inside. Sprue that passes through the mating surface (6)
At least one of the upper mold (3) and the lower mold (4) has a cull (7) connected to the sprue (6) on the abutting surface.
, a plurality of runners (8) connected to the cull (7), and a plurality of gates (9) connected to each of the runners (8).
The cavities (1) each have a gate (9).
The dummy cavity (2) is connected to the cavity (1).
A dummy gate (
2a), and the dummy cavity (2) is connected from the cull (7) to the cavity (
1) A mold device for resin sealing, characterized in that the volumes are determined so that the filling time of the resin flowing into each of the molds is approximately equal. 2) It has a cavity block (11), and the cavity block (11) forms a nest that can fit into the abutment surface of at least one of the upper mold (3) and the lower mold (4). An in-block runner (8a) is connected to the runner (8) via a runner joint (8b).
and a plurality of gates (9) reaching the intra-block runner (8a), the cavity (1) each having a plurality of gates (9)
The dummy cavity (2) is connected to the cavity (1).
A dummy gate (
2a), and the dummy cavities (2) are arranged so that the filling time of the resin flowing into each of the cavities (1) from the runner joint part (8a) is approximately equal. The mold device for resin sealing according to claim 1, wherein the volume is determined. 3) It has a dummy plate (2b), and the dummy plate (2b) is connected to the dummy cavity (2).
2. The mold device for resin sealing according to claim 1, wherein the dummy cavity (2) is supported on a bottom wall thereof so that the volume of the dummy cavity (2) can be changed. 4) Each of the dummy cavities (2) is connected to the gate (9), and the cavity (1) is connected to the dummy cavity (1).
A dummy gate (
3. The mold device for resin sealing according to claim 1 or 2, wherein the mold device is attached via the mold device 2a). 5) It has the cavity (1) according to claim 1 and a shared dummy cavity (10), the shared dummy cavity (10) facing the gate (9) of the plurality of cavities (1). A mold device for resin sealing, characterized in that it is commonly attached to each side wall via a dummy gate (2a). 6) It has a throttle member (2e), and the throttle member (2e) controls the flow rate of the resin flowing from each of the cavities (1) into the shared dummy cavity (10) via the dummy gate (2a). 6. The mold device for resin sealing according to claim 5, wherein the mold device has a channel groove (2f) in the center of which the resin passes, and is fitted into the dummy gate (2a). .