JPH03291396A - Ni-fe alloy plating method - Google Patents
Ni-fe alloy plating methodInfo
- Publication number
- JPH03291396A JPH03291396A JP9289890A JP9289890A JPH03291396A JP H03291396 A JPH03291396 A JP H03291396A JP 9289890 A JP9289890 A JP 9289890A JP 9289890 A JP9289890 A JP 9289890A JP H03291396 A JPH03291396 A JP H03291396A
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- current density
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- plated
- weight composition
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Abstract
Description
【発明の詳細な説明】
Ll上旦且里旦■
本発明はNi−Fe合金によるめっき方法、より詳細に
は磁性膜として機能するNi−Fe合金めつき方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating method using a Ni--Fe alloy, and more particularly to a method for plating a Ni--Fe alloy that functions as a magnetic film.
来の ・″とその課
従来、この種のNi−Fe合金めっき方法は1例えば磁
気記録ヘッド等のような対象物上に均一な成分比を有す
るNi−Fe合金めっき膜を形成するために用いられて
いた。Previously, this type of Ni-Fe alloy plating method was used to form a Ni-Fe alloy plating film with a uniform component ratio on an object such as a magnetic recording head. It was getting worse.
一般に、磁性薄膜として利用されているNi−Fe合金
めっき膜は、その合金組成の違いによって、磁気特性が
大きく左右される。Ni−Fe合金めっき膜の合金組成
を左右する要因としては、めっき方法、めっき浴及びめ
っき条件等が考えられる。例えば、定電流によるめっき
やめっき電流をパルス化して行なうパルスめっき等の電
気めっきにおいて、同じめっき浴を用いても定電流によ
るめっきとパルスめっきとでは、めっき膜の特性が変わ
ることが知られている。そして、このようにNi −F
e合金めっき膜の合金組成を左右する要因の中で、特に
影響が大きいものがめつき電流密度である。In general, the magnetic properties of Ni--Fe alloy plating films used as magnetic thin films are greatly influenced by the difference in alloy composition. Possible factors that influence the alloy composition of the Ni-Fe alloy plating film include the plating method, plating bath, and plating conditions. For example, in electroplating such as constant current plating and pulse plating performed by pulsing the plating current, it is known that the characteristics of the plated film differ between constant current plating and pulse plating, even if the same plating bath is used. There is. And like this, Ni −F
Among the factors that influence the alloy composition of the e-alloy plating film, the plating current density has a particularly large influence.
第9図は、Ni −Fe合金によるめっきを施した被め
っき体及びめっき膜の断面を示したものである。図中2
0は電気めっきにより形成されたNi −Fe合金めっ
き膜であり、このNi−Fe合金めっき膜20が施され
た被めっき体21は平坦部A、傾斜部B、平坦部Cとい
う段差のある面を有している。FIG. 9 shows a cross section of an object to be plated and a plated film plated with a Ni--Fe alloy. 2 in the diagram
0 is a Ni-Fe alloy plating film formed by electroplating, and the plated object 21 to which this Ni-Fe alloy plating film 20 has been applied has a surface with steps including a flat part A, an inclined part B, and a flat part C. have.
第10図はめっき電流密度とNi−Fe合金めっき膜中
におけるFeの重量組成との関係を示すFe重量組成−
電流密度曲線である。Figure 10 shows the relationship between plating current density and Fe weight composition in the Ni-Fe alloy plating film.
This is a current density curve.
この図で示されるように、めっき電流密度を上げると、
Ni−Fe合金めっき膜中のFe重量組成は上昇し、あ
るめっき電流密度1)0でFe重量組成は極大値Fe+
oとなる。As shown in this figure, increasing the plating current density results in
The Fe weight composition in the Ni-Fe alloy plating film increases, and at a certain plating current density 1) 0, the Fe weight composition reaches its maximum value Fe+
It becomes o.
段差のある面を持つ被めっき体21にNi−Fe合金め
っきを施した場合、傾斜部BにおいてNi−Fe合金組
成にずれが生じてしまい、このことが特に微細パターン
を有する素子では磁気特性劣下の大きな原因となる。均
一な磁気特性を有するNi−Fe合金めっきによる磁性
薄膜を得るためには、めっき電流密度の変動を小さくし
て合金組成のばらつきを小さくすればよいことから、従
来は、めっき電流密度の変動に対するFe重量組成の変
動が最も少ない点、すなわち、Fe重量組成の極大値近
傍におけるめっき電流密度(第10図においては1、。When Ni-Fe alloy plating is applied to the plated object 21 having a stepped surface, a deviation occurs in the Ni-Fe alloy composition at the sloped portion B, and this can lead to poor magnetic properties, especially in elements with fine patterns. This is a major cause of the below. In order to obtain a magnetic thin film by Ni-Fe alloy plating with uniform magnetic properties, it is sufficient to reduce variations in alloy composition by reducing variations in plating current density. The plating current density is 1 in FIG. 10 at the point where the Fe weight composition changes the least, that is, near the maximum value of the Fe weight composition.
)を選択して電気めっきを行なっていた(特開昭55−
82793号公報)、シかしこの方法では、第9図に示
したような、段差のある面を有した被めっき体21に電
気めっきを行なう場合、傾斜部Bの影響によりめっき電
流密度は第10図及び第1)図に示したように、平坦部
A、Cでは工、。となり、傾斜部BではI ++どなっ
て、傾斜部Bのめっき電流密度が平坦部A、Cのめっき
電流密度に比べ、小さくなる。つまり、平坦部A、Cと
傾斜部Bとのめっき電流密度の差Δ工によって、Fe重
量組成は平坦部A、CではFe+。となり、傾斜部Cで
はFe++となって、前記両者の間でFe重量組成にΔ
Fe、、のずれが生じてしまう。そこで、平坦部A、C
と傾斜部BとのFe重量組成のずれを少なくするために
、第12及び第13図に示したように、平坦部A、Cに
おけるめっき電流密度を、Fe重量組成の極大値を与え
る電流密度(第10図中I+a)より大きな電流密度I
rsとし、傾斜部Bにおけるめっき電流密度を、△工
だけずれた、Fe重量組成の極大値を与える電流密度よ
り小さな値I +4として電気めっきを行なう方法が提
案されている(特開平1−180994号公報)。) was selected for electroplating (Unexamined Japanese Patent Publication No. 1983-
However, in this method, when electroplating is performed on the plated object 21 having a stepped surface as shown in FIG. As shown in Figures 1 and 1), the flat parts A and C are flat. Therefore, in the sloped part B, I ++ becomes, and the plating current density in the sloped part B becomes smaller than that in the flat parts A and C. In other words, due to the difference Δ in plating current density between flat areas A and C and sloped area B, the Fe weight composition in flat areas A and C becomes Fe+. In the inclined part C, it becomes Fe++, and the Fe weight composition changes by Δ between the two.
A deviation of Fe, . . . will occur. Therefore, flat parts A and C
In order to reduce the difference in the Fe weight composition between the flat areas A and C, as shown in FIGS. (I+a in Figure 10) Higher current density I
A method has been proposed in which electroplating is carried out by setting the plating current density at the inclined portion B to a value I +4, which is smaller than the current density that gives the maximum value of the Fe weight composition, and which is shifted by Δt (Japanese Patent Application Laid-Open No. 1-180994). Publication No.).
日が ′しようとする課
上記した従来のNi−Fe合金によるめっき方法では、
第12図に示したように、平坦部A、Cと傾斜部Bにお
いて、めっき電流密度は、略同程度のFe+4を得るこ
とが可能であるけれども、平坦部AあるいはCから傾斜
部Bへの遷移領域において第12図に示した電流密度の
ビークFe、、が表れ、傾斜部BのFe重量組成に、局
部的ではあるがΔFe+sのずれを生じ、いずれにして
も平坦部A、Cと傾斜部Bとの間でFe重量組成のずれ
は免れ得ないという課題があった。In the conventional plating method using Ni-Fe alloy mentioned above,
As shown in FIG. 12, although it is possible to obtain approximately the same amount of Fe+4 at the plating current density in the flat areas A and C and the slope area B, the plating current density from the flat areas A or C to the slope area B is In the transition region, the current density peak Fe shown in FIG. There was a problem that a difference in Fe weight composition between the part B and the part B was unavoidable.
本発明は上記した課題に鑑みなされたものであって、段
差のある面を有した被めっき体に対して、平坦部と傾斜
部とにおけるNi−Fe合金の微視的な組成変動のない
、均一なNi−Fe合金めっき膜を形成するためのNi
−Fe合金のめっき方法を提供することを目的としてい
る。The present invention has been made in view of the above-mentioned problems, and it is possible to prevent microscopic compositional fluctuations of the Ni-Fe alloy between flat parts and sloped parts for an object to be plated having a stepped surface. Ni for forming a uniform Ni-Fe alloy plating film
-It is an object of the present invention to provide a method for plating a Fe alloy.
課 を解ゞ るための 1″7
上記した目的を達成するために本発明に係るNi −F
e合金のめっき方法は、段差のある面を有した被めっき
体において、平坦部における電流密度を、Fe重量組成
−電流密度曲線におけるFe重量組成の極大値を与える
電流密度と、該電流密度よりも大きな電流密度との間で
連続的に変化させながらめっきを行なうことを特徴とし
ている。To solve the problem 1″7 In order to achieve the above-mentioned purpose, the Ni-F according to the present invention
The method for plating e-alloy is to set the current density at the flat part of an object to be plated with a stepped surface to the current density that gives the maximum value of the Fe weight composition in the Fe weight composition-current density curve, and the current density from the current density. It is also characterized by performing plating while continuously changing the current density between large current densities.
■
第3図は、第9図に示すような段差のある面を有した被
めっき体に、電気めっきによりNi−Fe合金めっき膜
を形成する場合のFe重量組成−電流密度曲線を示して
いる。■ Figure 3 shows the Fe weight composition vs. current density curve when a Ni-Fe alloy plating film is formed by electroplating on a plated object having a stepped surface as shown in Figure 9. .
図中■4はFe重量組成が極大値となるめっき電流密度
であり、このめっき電流密度■4を用いて平坦部A、C
の電気めっきを行なった場合、第4図に示すようにNi
−Fe合金めっき膜中におけるFe重量組成は、傾斜部
Bの方がFesとなり平坦部A、Cの方のFe4 と比
較して小さくなる。In the figure, ■4 is the plating current density at which the Fe weight composition becomes the maximum value, and using this plating current density ■4, the flat areas A and C
When electroplating is performed, Ni
-The weight composition of Fe in the Fe alloy plating film is Fe in the inclined portion B, and is smaller than that in the flat portions A and C.
一方、めっき電流密度を前記■4よりも、平坦部A、C
と傾斜部Bの電流密度の差、61以上大きな+6として
電気めっきを行なうと、第5図に示すようにNi−Fe
合金めっき膜中におけるFe重量組成は、傾斜部Bの方
がFeeとなり、平坦部A、Cの方のFesと比較して
大きくなる。すなわち、平坦部A、Cのめっき電流密度
をFe重量組成の極大値を与える電流密度I4に設定し
た時と該電流密度よりも大きな電流密度I6に設定した
時とでは、Ni−Fe合金めっき膜中におけるFe重量
組成が平坦部A、Cと傾斜部Bとで逆転する。On the other hand, the plating current density was changed from the above (4) to the flat areas A and C.
When electroplating is performed with the current density difference between the current density and the slope part B being +6, which is larger than 61, Ni-Fe is deposited as shown in Figure 5.
The weight composition of Fe in the alloy plating film is higher in the inclined portion B than in the flat portions A and C. That is, when the plating current density of flat areas A and C is set to a current density I4 that gives the maximum value of Fe weight composition, and when it is set to a current density I6 that is larger than the current density, the Ni-Fe alloy plating film is The weight composition of Fe in the flat portions A and C and the inclined portion B are reversed.
従って、平坦部A、Cのめっき電流密度を14から1.
まで連続的に変化させてめっきを行うことにより、めっ
き電流密度の変化毎に平坦部A、Cと傾斜部BとでNi
−Fe合金めっき膜中におけるFe重量組成の変化が起
こり、めっき膜全体としてはNi−Fe合金めっき膜中
におけるNi−Fe合金組成に差がなくなり、その均質
化が図られる6!鳳」
第2図は本実施例に係るNi−Fe合金のめつき方法で
用いられるめっき装置を模式的に示した構成図である。Therefore, the plating current density for flat areas A and C was changed from 14 to 1.
By performing plating by continuously changing the plating current density to
-The weight composition of Fe in the Fe alloy plating film changes, and the Ni-Fe alloy composition in the Ni-Fe alloy plating film as a whole disappears and becomes homogenized6! FIG. 2 is a block diagram schematically showing a plating apparatus used in the Ni-Fe alloy plating method according to this embodiment.
図中1)はめっき浴10中に載置された段差のある面を
有した被めっき体で、この被めっき体1)は、電源15
の陰極側と接続されている。また、めっき浴10中には
被めっき体1)と対向して、電源15の陽極側と接続さ
れた電極13が設けられており、各電極1).13は、
電流密度を連続的に変化させるための関数発生器14を
介して、電源15と接続されている。In the figure, 1) is an object to be plated having a stepped surface placed in a plating bath 10, and this object 1) is connected to a power source 15.
connected to the cathode side of the Further, in the plating bath 10, an electrode 13 is provided facing the object to be plated 1) and connected to the anode side of the power source 15, and each electrode 1). 13 is
It is connected to a power source 15 via a function generator 14 for continuously changing the current density.
以下、本発明の実施例に係るめっき方法を図面に基づい
て説明する。Hereinafter, a plating method according to an embodiment of the present invention will be explained based on the drawings.
第9図に示したような、段差のある面を有した被めっき
体21にめっきを施す方法において。In a method of plating a body 21 to be plated having a stepped surface as shown in FIG.
Ni−Fe合金めっき膜20中におけるNi−Fe合金
組成の差をなくし、その均質化を図るために、電流密度
を連続的に変化させる。In order to eliminate the difference in the Ni-Fe alloy composition in the Ni-Fe alloy plating film 20 and to make it homogeneous, the current density is continuously changed.
すなわち、第3図において、平坦部A、Cの連続的に変
化させる電流密度の範囲ΔI°を、前記電流密度の差Δ
工よりも大きくとり、Fe重量組成の極大値となる電流
密度■4と電流密度I6との間で電流密度を変化させて
めっきを行なう。このように、Fe重量組成の極大値と
なる電流密度I4と、この工、より平坦部A、Cと傾斜
部Bとの電流密度の差である△Iよりも大きな電流密度
16との間を連続的に変化するように設定すると、めっ
き膜20中のFe重量組成は平坦部A、C及び傾斜部B
の両者ともFe<とFeeとの間で連続的に変化し、す
なわち、第4図及び第5図に示した状態の間を連続的に
変化し、合金めっきM2Oの平坦部A、Cと傾斜部Bの
組成変化の大きさが等しくなり、形成されためっき膜2
0全体の合金組成は均一となる。That is, in FIG. 3, the range ΔI° of the continuously changing current density in the flat parts A and C is expressed as the difference ΔI° in the current density.
Plating is carried out by changing the current density between current density 4 and current density I6, which is the maximum value of the Fe weight composition. In this way, between the current density I4, which is the maximum value of the Fe weight composition, and the current density 16, which is larger than ΔI, which is the difference in current density between the flatter parts A and C and the slope part B, If set to change continuously, the Fe weight composition in the plating film 20 will change in the flat areas A, C and the inclined area B.
Both of them change continuously between Fe< and Fee, that is, they change continuously between the states shown in FIGS. 4 and 5, and the flat parts A and C of alloy plating M2O and the slope The magnitude of the composition change in part B becomes equal, and the formed plating film 2
The alloy composition of the entire 0 becomes uniform.
この際、第6図〜第8図に示したように、連続的に変化
させる電流密度は、直線的な三角波、正弦波あるいは台
形波で変化させても変わらない効果を得ることができる
。さらに、連続的に変化させる電流の周波数を、数m5
ec〜数10 secの範囲で変化させても変わらない
効果を得ることができる。特に段差が100μm以下の
場合は本方法による均一化の効果は大きい。At this time, as shown in FIGS. 6 to 8, the same effect can be obtained even if the current density is changed continuously in a linear triangular wave, sine wave, or trapezoidal wave. Furthermore, the frequency of the current that is continuously changed is set to several m5.
The same effect can be obtained even if the time is varied within the range of ec to several tens of seconds. Particularly when the level difference is 100 μm or less, the uniformity effect of this method is significant.
また、第1図に示したように、Δ■=Δ■° となるよ
うに設定してめっきを行なうと、第4図及び第5図にお
けるFe4とFesとが等しくなり、また、Fe3とF
e6とが等しくなり、より一層その組成が均一化された
めっき膜20を得ることができる。Moreover, as shown in FIG. 1, if plating is performed with the setting Δ■=Δ■°, Fe4 and Fes in FIGS. 4 and 5 become equal, and Fe3 and F
e6 are made equal, and a plated film 20 whose composition is further made uniform can be obtained.
光渥坏と伽里
以上の説明により明らかなように、本発明に係るNi−
Fe合金によるめっき方法にあっては、段差のある面を
有した被めっき体にめっきを施す場合、平坦部における
電流密度を、Fe重量組成−電流密度曲線におけるFe
重量組成の極大値を与える電流密度と、該電流密度より
も大きな電流密度との間で連続的に変化させながらめっ
きを行なうことにより、平坦部と傾斜部との合金組成が
均一となり、磁気特性の均一なNi−Fe合金めっき膜
を得ることができる。As is clear from the above explanations of Mitsuyoshi and Kari, the Ni-
In the plating method using an Fe alloy, when plating a plated object having a stepped surface, the current density in the flat part is changed to the Fe weight composition-current density curve.
By performing plating while continuously changing the current density between the current density that gives the maximum value of the weight composition and the current density larger than the current density, the alloy composition on the flat part and the slope part becomes uniform, and the magnetic properties are improved. A uniform Ni-Fe alloy plating film can be obtained.
第1図は本発明に係るNi −Fe合金めっき方法にお
いて連続的に変化させる電流密度を平坦部と傾斜部との
電流密度の差に等しく設定した時のFe重量組成−電流
密度曲線、第2図は本発明の実施例に係るめっき方法を
実施する際に用いるめっき装置を示す概略構成図、第3
図は平坦部の電流密度なFe重量組成の極大値となる電
流密度と極大値より大きな電流密度との間で変化させて
めっきを施す様子を説明するFe重量組成−電流密度曲
線、第4図は平坦部の電流密度をFe重量組成の極大値
が得られる電流密度に設定してめっき膜を形成したとき
の被めっき体及びめっき膜の断面図、第5図は平坦部の
電流密度なFe重量組成の極大値が得られる電流密度よ
り大きな電流密度に設定してめっき膜を形成したときの
被めっき体及びめっき膜の断面図、第6図〜第8図は連
続的に変化させる電流密度−時間曲線、第9図はNi−
Fe合金めっきを施した段差のある面を有する被めっき
体及びめっき膜の断面図、第10図は平坦部におけるめ
っき電流密度をFe重量組成の極大値に設定してめっき
を施す場合を示すFe重量組成−電流密度曲線、第1)
図は第10図に示した条件でめっき膜を施したときの被
めっき体及びめっき膜の断面図、第12図は平坦部にお
けるめっき電流密度をFe重量組成の極大値より大きな
電流密度に設定してめっきを施す場合を示すFe重量組
成−電流密度曲線。
第13図は第12図に示した条件でめっき膜を施したと
きの被めっき体及びめっき膜の断面図である。
20・・・めっき膜
21・・・被めっき体
特 許 出 願 人 :住友金属工業株式会社代 理
人 :弁理士 井内龍ニ
第1図
第2図
第6図
第8図
第9図
第7図
斡
↓N
+#贋中/Fet量知り吹゛(0ム)
第10図
第12図
(mA/Crrl’ J
第1,1
図Figure 1 shows the Fe weight composition-current density curve when the continuously changing current density is set equal to the difference in current density between the flat part and the slope part in the Ni-Fe alloy plating method according to the present invention. The figure is a schematic configuration diagram showing a plating apparatus used when carrying out a plating method according to an embodiment of the present invention.
The figure shows the Fe weight composition-current density curve, which explains how plating is performed by changing the current density in the flat area between the maximum value of the Fe weight composition and the current density that is larger than the maximum value. Figure 5 is a cross-sectional view of the plated body and the plated film when the plated film is formed by setting the current density in the flat part to the current density that gives the maximum value of Fe weight composition. Cross-sectional views of the plated object and the plated film when the plated film is formed at a current density higher than the current density at which the maximum value of the weight composition is obtained. Figures 6 to 8 show the current density that is continuously changed. -Time curve, Figure 9 shows Ni-
A cross-sectional view of an object to be plated and a plated film having a stepped surface subjected to Fe alloy plating. Weight composition-current density curve, 1st)
The figure shows a cross-sectional view of the plated object and the plating film when the plating film is applied under the conditions shown in Fig. 10. In Fig. 12, the plating current density in the flat area is set to a current density higher than the maximum value of the Fe weight composition. Fe weight composition-current density curve showing the case where plating is performed. FIG. 13 is a cross-sectional view of the body to be plated and the plating film when the plating film is applied under the conditions shown in FIG. 12. 20... Plating film 21... Patent for plated body Applicant: Sumitomo Metal Industries, Ltd. Agent: Patent attorney Ryuji Iuchi Figure 1 Figure 2 Figure 6 Figure 8 Figure 9 Figure 7 Figure ↓N +#Invalid/Fet amount known blow (0m) Figure 10 Figure 12 (mA/Crrl' J Figure 1, 1
Claims (1)
金によるめっきを行なうめっき方法において、平坦部に
おける電流密度を、Fe重量組成−電流密度曲線におけ
るFe重量組成の極大値を与える電流密度と、該電流密
度よりも大きな電流密度との間で連続的に変化させなが
らめっきを行なうことを特徴とするNi−Fe合金によ
るめっき方法。(1) In a plating method in which a plated object having a stepped surface is plated with a Ni-Fe alloy, the current density at a flat part is determined by the current that gives the maximum value of the Fe weight composition in the Fe weight composition-current density curve. A plating method using a Ni-Fe alloy, characterized in that plating is performed while continuously changing the density and a current density higher than the current density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9289890A JPH03291396A (en) | 1990-04-06 | 1990-04-06 | Ni-fe alloy plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9289890A JPH03291396A (en) | 1990-04-06 | 1990-04-06 | Ni-fe alloy plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03291396A true JPH03291396A (en) | 1991-12-20 |
Family
ID=14067286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9289890A Pending JPH03291396A (en) | 1990-04-06 | 1990-04-06 | Ni-fe alloy plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03291396A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7986296B2 (en) | 2004-05-24 | 2011-07-26 | Au Optronics Corporation | Liquid crystal display and its driving method |
| CN102995083A (en) * | 2012-12-07 | 2013-03-27 | 北京大学 | Method for preparing soft-magnetic material iron-nickel alloy array by adopting plating |
| CN103537877A (en) * | 2013-10-31 | 2014-01-29 | 江苏三科安全科技有限公司 | Metal electro-deposition process of barrier anti-explosion aluminum alloy |
| JP2019016737A (en) * | 2017-07-10 | 2019-01-31 | 太陽誘電株式会社 | Electronic component and manufacturing method thereof |
-
1990
- 1990-04-06 JP JP9289890A patent/JPH03291396A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7986296B2 (en) | 2004-05-24 | 2011-07-26 | Au Optronics Corporation | Liquid crystal display and its driving method |
| CN102995083A (en) * | 2012-12-07 | 2013-03-27 | 北京大学 | Method for preparing soft-magnetic material iron-nickel alloy array by adopting plating |
| CN103537877A (en) * | 2013-10-31 | 2014-01-29 | 江苏三科安全科技有限公司 | Metal electro-deposition process of barrier anti-explosion aluminum alloy |
| WO2015062163A1 (en) * | 2013-10-31 | 2015-05-07 | 丁佐军 | Metal electrodeposition process for isolated blast-protection aluminum alloy |
| JP2019016737A (en) * | 2017-07-10 | 2019-01-31 | 太陽誘電株式会社 | Electronic component and manufacturing method thereof |
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