JPH03293669A - Photosensitive lithographic printing plate that does not require dampening water - Google Patents
Photosensitive lithographic printing plate that does not require dampening waterInfo
- Publication number
- JPH03293669A JPH03293669A JP9567990A JP9567990A JPH03293669A JP H03293669 A JPH03293669 A JP H03293669A JP 9567990 A JP9567990 A JP 9567990A JP 9567990 A JP9567990 A JP 9567990A JP H03293669 A JPH03293669 A JP H03293669A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- resin
- acid
- vinyl
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title description 44
- -1 sulfonic acid ester compound Chemical class 0.000 claims description 37
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 34
- 229920000642 polymer Polymers 0.000 claims description 30
- 229920002379 silicone rubber Polymers 0.000 claims description 21
- 239000004945 silicone rubber Substances 0.000 claims description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 54
- 229920005989 resin Polymers 0.000 description 52
- 239000011347 resin Substances 0.000 description 52
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 30
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- 229920001296 polysiloxane Polymers 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 17
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 16
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 13
- 239000000975 dye Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000009833 condensation Methods 0.000 description 9
- 230000005494 condensation Effects 0.000 description 9
- 238000011161 development Methods 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 239000012954 diazonium Substances 0.000 description 5
- 238000004043 dyeing Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- TUXAJHDLJHMOQB-UHFFFAOYSA-N 2-diazonio-4-sulfonaphthalen-1-olate Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC([N+]#N)=C([O-])C2=C1 TUXAJHDLJHMOQB-UHFFFAOYSA-N 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 4
- 229940118056 cresol / formaldehyde Drugs 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229940079877 pyrogallol Drugs 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000004115 Sodium Silicate Substances 0.000 description 3
- 230000001476 alcoholic effect Effects 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 description 3
- 229910052913 potassium silicate Inorganic materials 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 229910052911 sodium silicate Inorganic materials 0.000 description 3
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- BTLXPCBPYBNQNR-UHFFFAOYSA-N 1-hydroxyanthraquinone Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2O BTLXPCBPYBNQNR-UHFFFAOYSA-N 0.000 description 2
- JLIDVCMBCGBIEY-UHFFFAOYSA-N 1-penten-3-one Chemical compound CCC(=O)C=C JLIDVCMBCGBIEY-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004111 Potassium silicate Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- JTHNLKXLWOXOQK-UHFFFAOYSA-N hex-1-en-3-one Chemical compound CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 2
- 229910052912 lithium silicate Inorganic materials 0.000 description 2
- 229940107698 malachite green Drugs 0.000 description 2
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 2
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 2
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 2
- 235000019252 potassium sulphite Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
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- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- NHOGGUYTANYCGQ-UHFFFAOYSA-N ethenoxybenzene Chemical compound C=COC1=CC=CC=C1 NHOGGUYTANYCGQ-UHFFFAOYSA-N 0.000 description 1
- XJELOQYISYPGDX-UHFFFAOYSA-N ethenyl 2-chloroacetate Chemical compound ClCC(=O)OC=C XJELOQYISYPGDX-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- OUGJKAQEYOUGKG-UHFFFAOYSA-N ethyl 2-methylidenebutanoate Chemical compound CCOC(=O)C(=C)CC OUGJKAQEYOUGKG-UHFFFAOYSA-N 0.000 description 1
- JVICFMRAVNKDOE-UHFFFAOYSA-M ethyl violet Chemical compound [Cl-].C1=CC(N(CC)CC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 JVICFMRAVNKDOE-UHFFFAOYSA-M 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- WYXXLXHHWYNKJF-UHFFFAOYSA-N isocarvacrol Natural products CC(C)C1=CC=C(O)C(C)=C1 WYXXLXHHWYNKJF-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- JESHZQPNPCJVNG-UHFFFAOYSA-L magnesium;sulfite Chemical compound [Mg+2].[O-]S([O-])=O JESHZQPNPCJVNG-UHFFFAOYSA-L 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005608 naphthenic acid group Chemical group 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000004866 oxadiazoles Chemical class 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- PCYCKXJRAKEYSM-UHFFFAOYSA-N phenyl-(1,5,6-trihydroxycyclohexa-2,4-dien-1-yl)methanone Chemical compound OC1C(O)=CC=CC1(O)C(=O)C1=CC=CC=C1 PCYCKXJRAKEYSM-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- 229940062627 tribasic potassium phosphate Drugs 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000004385 trihaloalkyl group Chemical group 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はネガ型湿し水不要感光性平版印刷版に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a negative type photosensitive lithographic printing plate that does not require dampening water.
(従来の技術)
感光層がキノンジアジド化合物であり、インキ反発層が
シリコーンゴムであるネガ型湿し水不要感光性平版印刷
版は多数提案されている。例えば、特開昭55−594
66号公報、特開昭55−110249号公報等に記載
されている。(Prior Art) Many negative type photosensitive lithographic printing plates that do not require dampening water have been proposed, in which the photosensitive layer is made of a quinone diazide compound and the ink repellent layer is made of silicone rubber. For example, JP-A-55-594
It is described in Japanese Patent Application Laid-Open No. 110249/1986, etc.
しかしこれらの湿し水不要感光性平版印刷版は、すべて
有機溶剤主体の現像液または現像前処理液を必要として
いる。有機溶剤主体の処理液では消防法上、あまり好ま
しくない上、労働及び環境衛生上も好ましくない。また
湿し水を用いる平版印刷版との処理液の共使用も不可能
である。これらの理由により、アルカリ水溶液主体また
はアルカリ水溶液で現像できる湿し水不要感光性平版印
刷版が望まれている。However, all of these photosensitive lithographic printing plates that do not require dampening water require a developer or a pre-development treatment solution containing an organic solvent. Treatment liquids based on organic solvents are not very desirable in terms of the Fire Service Act, and are also not desirable in terms of labor and environmental hygiene. It is also impossible to use the processing liquid together with a lithographic printing plate that uses dampening water. For these reasons, there is a desire for a photosensitive lithographic printing plate that does not require dampening water and can be developed mainly with an alkaline aqueous solution or with an alkaline aqueous solution.
更に、従来のキノンジアジド化合物を用いたネガ型の湿
し水不要感光性平版印刷版は、白色蛍光灯下で扱うと光
カブリを被って、次に現像処理されると非画像部のシリ
コーンゴム層下の感光層が浸食されシリコーンゴム層に
ダメージをあたえてしまいインキ反発性を損ねてしまう
。このため光カブリに対する抵抗性(以下「セーフライ
ト性」と呼ぶ)が改善された感光層を有するネガ型の湿
し水不要感光性平版印刷版が望まれている。Furthermore, conventional negative-working photosensitive lithographic printing plates that do not require dampening water using quinonediazide compounds suffer from light fog when handled under white fluorescent light, and the silicone rubber layer in the non-image areas is exposed when the next development process is carried out. The underlying photosensitive layer erodes, damaging the silicone rubber layer and impairing ink repulsion. Therefore, there is a need for a negative-working photosensitive lithographic printing plate that does not require dampening water and has a photosensitive layer with improved resistance to light fog (hereinafter referred to as "safelight property").
(発明の目的)
上記課題を改良しアルカリ水溶液主体またはアルカリ水
溶液の現像液で現像できかつセーフライト性に優れたネ
ガ型の湿し水不要感光性平版印刷版の提供が本発明の目
的である。(Object of the Invention) It is an object of the present invention to improve the above-mentioned problems and provide a negative-working photosensitive lithographic printing plate that does not require dampening water and can be developed with a developer mainly containing an alkaline aqueous solution or an alkaline aqueous solution and has excellent safelight properties. .
(問題解決のための手段)
本発明者らは、鋭意研究を重ねた結果、感光層が、少な
くとも
(A)1.2−ナフトキノン−2−ジアジド−4スルホ
ン酸エステル化合物及び
(B)フェノール性水酸基を有する構造単位を分子構造
中に有する重合体
を有することにより上記目的を達成した。(Means for Solving the Problem) As a result of extensive research, the present inventors have found that the photosensitive layer contains at least (A) a 1,2-naphthoquinone-2-diazide-4 sulfonic acid ester compound and (B) a phenolic compound. The above object was achieved by having a polymer having a structural unit having a hydroxyl group in its molecular structure.
以下に本発明の詳細な説明する。The present invention will be explained in detail below.
本発明において用いられる基板としては、通常の平板印
刷機にセットできるたわみ性を有し、印刷時にかかる荷
重に耐えうるちのであればいかなるものも用いることが
でき、層構成も含めて特に制限されない。例えば、コー
ト紙などの紙類、アルミニウム板などの金属板、あるい
は、ポリエチレンテレフタレートなどのプラスチックフ
ィルムを例として挙げることができる。As the substrate used in the present invention, any substrate can be used as long as it has the flexibility to be set in a normal lithographic printing machine and can withstand the load applied during printing, and there are no particular restrictions on the substrate including the layer structure. . Examples include papers such as coated paper, metal plates such as aluminum plates, and plastic films such as polyethylene terephthalate.
本発明に用いられる基板としては、アルミニウム板、又
は、アルミニウム箔と他の複合材が好ましく、耐剛性の
点から、アルミニウム板が特に好ましい。The substrate used in the present invention is preferably an aluminum plate or a composite material of aluminum foil and other materials, and from the viewpoint of rigidity, an aluminum plate is particularly preferable.
本発明に用いられるプライマー層としては公知の種々の
プライマー層をいずれも適用できるが、例えばエポキシ
樹脂、ポリウレタン樹脂等を適当な硬化剤を用いて加熱
硬化させたもの等特公昭61−54219号公報に記載
のプライマー層、又は光二重体型硬化性樹脂等からなる
層を光硬化させたもの等の特開昭60−229031号
公報に記載のプライマー層等が使用できる。更に、主と
してジアゾ樹脂及び水酸基含有ポリマーから成る層を光
硬化させたプライマー層も好ましく用いられる。このよ
うなジアゾ樹脂は例えば、フォトグラフィック・サイエ
ンス・アンド・エンジニアリング(Photo、Sci
、Eng、)第17巻、第33頁(1973)、米国特
許第2,063゜631号、同第2,679,498号
、同第3゜050.502号各明細書、特開昭59−7
8340号公報等にその製造方法が記載されているジア
ゾ化合物と活性カルボニル化合物(例えばホルムアルデ
ヒド、アセトアルデヒドあるいはベンズアルデヒド等)
とを、硫酸、リン酸、塩酸等の酸性媒体中で縮合させて
得られたジアゾ樹脂、特公昭49−4001号公報にそ
の製造方法が記載されているジアゾ化合物とジフェニル
エーテル誘導体とを縮合反応させて得られるジアゾ樹脂
等を使用することができる。特に、パラジアゾジフェニ
ルアミンとホルマリンの縮合体が好ましい。As the primer layer used in the present invention, any of various known primer layers can be applied, but for example, those made by heating and curing epoxy resin, polyurethane resin, etc. using an appropriate curing agent, etc. The primer layer described in JP-A No. 60-229031, such as the primer layer described in JP-A-60-229031, such as the one obtained by photocuring a layer made of a photoduplex type curable resin, etc., can be used. Furthermore, a primer layer obtained by photocuring a layer mainly composed of a diazo resin and a hydroxyl group-containing polymer is also preferably used. Such diazo resins are used, for example, in Photographic Science and Engineering (Photo, Sci).
, Eng.) Volume 17, Page 33 (1973), U.S. Pat. -7
Diazo compounds and active carbonyl compounds (for example, formaldehyde, acetaldehyde, benzaldehyde, etc.) whose production methods are described in Publication No. 8340, etc.
A diazo resin obtained by condensing the above in an acidic medium such as sulfuric acid, phosphoric acid, or hydrochloric acid, and a diazo compound whose manufacturing method is described in Japanese Patent Publication No. 49-4001, and a diphenyl ether derivative are subjected to a condensation reaction. A diazo resin obtained by the above method can be used. Particularly preferred is a condensate of paradiazodiphenylamine and formalin.
本発明において使用されるジアゾ樹脂の対アニオンは、
該ジアゾ樹脂と安定な塩を形成し、且つ該樹脂を有機溶
媒に可溶となすアニオンを含む。The counter anion of the diazo resin used in the present invention is
It contains an anion that forms a stable salt with the diazo resin and makes the resin soluble in organic solvents.
これらは、デカン酸及び安息香酸等の有機カルボン酸、
フェニルリン酸等の有機リン酸及びスルホン酸を含み、
典型的な例としては、メタンスルホン酸、クロロエタン
スルホン酸、ドデカンスルホン酸、ベンゼンスルホン酸
、トルエンスルホン酸、メシチレンスルホン酸及びアン
トラキノンスルホン酸、2−ヒドロキシ−4−メトキシ
ヘンシフエノン−5−スルホン酸、ヒドロキノンスルホ
ン酸、4−アセチルベンゼンスルホン酸、ジメチル−5
スルホンソフタレート等の脂肪族並びに芳香族スルホン
酸2.2’、4.4’ −テトラヒドロキシベンゾフェ
ノン、1,2.3−トリヒドロキシベンゾフェノン、2
.2’、4−トリヒドロキシヘンシフエノン等の水酸基
含有芳香族化合物、ヘキサフルオロリン酸、テトラフル
オロホウ酸等のハロゲン化ルイス酸、CfO,、IO4
等の過ハロゲン酸等が挙げられる。このうちハロゲン化
ルイス酸、ヘキサフルオロリン酸が好ましく特にヘキサ
フルオロリン酸が好ましい。β−ナフトールとのカップ
リング体をゲルパーミェーションクロマトグラフィー法
(cpc)で測定した重量平均分子量は200〜100
00 (スチレン換算)の範囲が好ましく、500〜5
000の範囲がより好ましい。These include organic carboxylic acids such as decanoic acid and benzoic acid;
Contains organic phosphoric acids and sulfonic acids such as phenyl phosphoric acid,
Typical examples include methanesulfonic acid, chloroethanesulfonic acid, dodecanesulfonic acid, benzenesulfonic acid, toluenesulfonic acid, mesitylenesulfonic acid and anthraquinonesulfonic acid, 2-hydroxy-4-methoxyhensiphenone-5-sulfonic acid. , hydroquinone sulfonic acid, 4-acetylbenzenesulfonic acid, dimethyl-5
Aliphatic and aromatic sulfonic acids such as sulfonesophthalate 2.2',4.4'-tetrahydroxybenzophenone, 1,2.3-trihydroxybenzophenone, 2
.. Aromatic compounds containing hydroxyl groups such as 2',4-trihydroxyhensiphenone, halogenated Lewis acids such as hexafluorophosphoric acid and tetrafluoroboric acid, CfO, IO4
Examples include perhalogen acids such as . Among these, halogenated Lewis acids and hexafluorophosphoric acid are preferred, and hexafluorophosphoric acid is particularly preferred. The weight average molecular weight of the coupled product with β-naphthol measured by gel permeation chromatography (CPC) is 200 to 100.
00 (in terms of styrene) is preferable, and the range is 500 to 5
A range of 000 is more preferred.
本発明における上記ジアゾ樹脂のプライマー層中に占め
る割合は通常1〜90重量%で、3〜60重量%が好ま
しい。In the present invention, the proportion of the diazo resin in the primer layer is usually 1 to 90% by weight, preferably 3 to 60% by weight.
また、ジアゾ樹脂と共に用いられる水酸含有ポリマーと
してはアルコール性水酸基含有ポリ(メタ)アクリル酸
(以下、同様にアクリル系とメタクリル系の両者を併称
して・・・(メタ)アクリル・・・・・・と記載する。In addition, as a hydroxyl-containing polymer used with diazo resin, alcoholic hydroxyl group-containing poly(meth)acrylic acid (hereinafter, both acrylic and methacrylic are collectively referred to as (meth)acrylic... ... is written.
)のエステル又はアミドが好ましく用いられる。) are preferably used.
アルコール性水酸基を有するモノマーとしては、例えば
2−ヒドロキシエチル(メタ)アクリレート、N−(4
−ヒドロキシエチルフェニル)(メタ)アクリルアミド
、ヒドロキシ−メチルジアセトン(メタ)アクリルアミ
ド等が挙げられる。特に2−ヒドロキシエチル(メタ)
アクリレートが好ましい。Examples of monomers having alcoholic hydroxyl groups include 2-hydroxyethyl (meth)acrylate, N-(4
-hydroxyethylphenyl) (meth)acrylamide, hydroxy-methyldiacetone (meth)acrylamide, and the like. Especially 2-hydroxyethyl (meth)
Acrylates are preferred.
上記水酸基含有上ツマ−と共重合可能な七ツマ−として
は、
(1)芳香族水酸基を有する七ツマ−1例えばN−(4
−ヒドロキシフェニル)(メタ)アクリルアミド、o−
、m−、p−ヒドロキシスチレン、o−、m−、p−ヒ
ドロキシフェニル−(メタ)アクリレート
(2)(メタ)アクリル酸、無水マレイン酸等のα、β
−不飽和カルボン酸、
(3)(メタ)アクリル酸メチル、(メタ)アクリル酸
エチル、(メタ)アクリル酸プロピル、(メタ)アクリ
ル酸ブチル、(メタ)アクリル酸アミル、(メタ)アク
リル酸ヘキシル、(メタ)アクリル酸シクロヘキシル、
(メタ)アクリル酸オクチル、(メタ)アクリル酸−2
−クロロエチル、2−ヒドロキシエチル(メタ)アジリ
レート、(メタ)アクリル酸4−ひドロキシブチル、グ
リシジル(メタ)アクリレート、N−ジメチルアミノエ
チル(メタ)アクリレート等の(置換)アルキル(メタ
)アクリレート、
(4)(メタ)アクリルアミド、N−トチロール(メタ
)アクリルアミド、N−エチル(メタ)アクリルアミド
、N−ヘキシル(メタ)アクリルアミド、N−シクロヘ
キシル(メタ)アクリルアミド、N−ヒドロキシエチル
(メタ)アクリルアミド、フェニル(メタ)アクリルア
ミド、N−ニトロフェニル(メタ)アクリルアミド、N
−エチル−N−フェニル(メタ)アクリルアミド等の(
メタ)アクリルアミド類、
(5)エチルビニルエーテル、2−クロロエチルビニル
エーテル、ヒドロキシエチルビニルエーテル、プロピル
ビニルエーテル、ブチルビニルエーテル、オクチルビニ
ルエーテル、フェニルビニルエーテル等のビニルエーテ
ル類、
(6)ビニルアセテート、ビニルクロロアセテートぐビ
ニルブチレート、安息香酸ビニル等のビニルエステル類
、
(7)スチレン、α−メチルスチレン、メチルスチレン
、クロロメチルスチレン等のスチレン類、(8)メチル
ビニルケトン、エチルビニルケトン、プロピルビニルケ
トン、フェニルビニルケトン等のビニルケトン類、
(9)エチレン、プロピレン、イソブチレン、ブタジェ
ン、イソプレン等のオレフィン類、(10)N−ビニル
ピロリドン、N−ビニルカルバゾール、4−ビニルピリ
ジン、(メタ)アクリロニトリル等、
等が挙げられる。特に上記の群(1)〜(3)が好まし
い。 上記水酸基含有ポリマー中における水酸基含有モ
ノマー量は特に限定されないが、好ましくは5〜100
重量%、特に好ましくは20〜100重量%である。Examples of heptamers copolymerizable with the above-mentioned hydroxyl group-containing heptamers include (1) heptamers having an aromatic hydroxyl group, such as N-(4
-Hydroxyphenyl)(meth)acrylamide, o-
, m-, p-hydroxystyrene, o-, m-, p-hydroxyphenyl-(meth)acrylate (2) α, β of (meth)acrylic acid, maleic anhydride, etc.
-Unsaturated carboxylic acid, (3) methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate , cyclohexyl (meth)acrylate,
(meth)octyl acrylate, (meth)acrylic acid-2
- (Substituted) alkyl (meth)acrylates such as chloroethyl, 2-hydroxyethyl (meth)azilylate, 4-hydroxybutyl (meth)acrylate, glycidyl (meth)acrylate, N-dimethylaminoethyl (meth)acrylate, (4 )(meth)acrylamide, N-totyrol(meth)acrylamide, N-ethyl(meth)acrylamide, N-hexyl(meth)acrylamide, N-cyclohexyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide, phenyl(meth)acrylamide ) acrylamide, N-nitrophenyl (meth)acrylamide, N
-ethyl-N-phenyl (meth)acrylamide etc. (
(meth)acrylamides, (5) Vinyl ethers such as ethyl vinyl ether, 2-chloroethyl vinyl ether, hydroxyethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, octyl vinyl ether, phenyl vinyl ether, (6) vinyl acetate, vinyl chloroacetate, vinyl butyrate , vinyl esters such as vinyl benzoate, (7) styrenes such as styrene, α-methylstyrene, methylstyrene, chloromethylstyrene, (8) methyl vinyl ketone, ethyl vinyl ketone, propyl vinyl ketone, phenyl vinyl ketone, etc. (9) olefins such as ethylene, propylene, isobutylene, butadiene, isoprene, (10) N-vinylpyrrolidone, N-vinylcarbazole, 4-vinylpyridine, (meth)acrylonitrile, etc. Particularly preferred are the above groups (1) to (3). The amount of hydroxyl group-containing monomer in the hydroxyl group-containing polymer is not particularly limited, but preferably 5 to 100
% by weight, particularly preferably from 20 to 100% by weight.
本発明の水酸基含有ポリマーのGPC法で測定重量平均
分子量は5000〜1000000 (スチレン換算)
が好ましい。5000より低い値だと光硬化後も感光層
の塗布溶剤あるいは現像液にやられる場合があり、10
00000より大きい値だと塗布溶剤の選択が難しい。The weight average molecular weight of the hydroxyl group-containing polymer of the present invention measured by GPC method is 5,000 to 1,000,000 (in terms of styrene)
is preferred. If the value is lower than 5,000, it may be damaged by the coating solvent or developer of the photosensitive layer even after photocuring, and 10
If the value is larger than 00000, it is difficult to select a coating solvent.
上記水酸基含有ポリマーのプライマー層中に占める割合
は通常10〜99重量%で、好ましくは40〜97重量
%である。The proportion of the hydroxyl group-containing polymer in the primer layer is usually 10 to 99% by weight, preferably 40 to 97% by weight.
本発明においてはプライマー層には上記の如き成分に加
えて必要に応じて酸化チタンや酸化亜鉛等の充填剤ある
いはハレーション防止剤、染料、顔料等の着色剤、塗布
性改良剤、可塑剤、安定剤、感脂化剤等を50重景%を
越えない範囲で含んでも良い。In the present invention, the primer layer contains, in addition to the above-mentioned components, fillers such as titanium oxide and zinc oxide, or antihalation agents, coloring agents such as dyes and pigments, coating properties improvers, plasticizers, stabilizers, etc. It may also contain agents, oil-sensitizing agents, etc. in an amount not exceeding 50% by weight.
上記染料及び塗布性改良剤としては各々前記感光層に含
有されるものと同様のものが用いられる。As the above-mentioned dye and coatability improving agent, the same ones as those contained in the above-mentioned photosensitive layer are used.
塗膜の柔軟性、耐磨耗性を付与するための可塑剤として
は、例えばブチルフタリル、ポリエチレングリコール、
クエン酸トリブチル、フタル酸ジエチル、フタル酸ジブ
チル、フタル酸ジヘキシル、フタル酸ジオクチル、リン
酸トリクレジル、リン酸トリブチル、リン酸トリオクチ
ル、オレイン酸テトラヒドラフルフリル、アクリル酸ま
たはメタクリル酸のオリゴマー等が挙げられる。Examples of plasticizers for imparting flexibility and abrasion resistance to coating films include butylphthalyl, polyethylene glycol,
Examples include tributyl citrate, diethyl phthalate, dibutyl phthalate, dihexyl phthalate, dioctyl phthalate, tricresyl phosphate, tributyl phosphate, trioctyl phosphate, tetrahydrafurfuryl oleate, oligomers of acrylic acid or methacrylic acid, etc. .
また、画像の印刷インキ着肉性を高めるために、疎水性
基を有する各種添加剤、例えばp−オクチルフェノール
・ホルマリンノボラック樹脂、Pt−ブチルフェノール
・ホルマリンノボラック樹脂、p−t−ブチルフェノー
ル・ベンズアルデヒド樹脂、ロジン変性ノボラック樹脂
等の変性ノボラック樹脂また、更にこれら変性ノボラッ
ク樹脂の0−ナフトキノンジアジドスルホン酸エステル
(OH基のエステル化率20〜70モル%)を添加して
用いることができる。In addition, in order to improve the printing ink adhesion of images, various additives having hydrophobic groups, such as p-octylphenol/formalin novolak resin, Pt-butylphenol/formalin novolak resin, p-t-butylphenol/benzaldehyde resin, rosin, etc. Modified novolak resins such as modified novolak resins can also be used by adding 0-naphthoquinonediazide sulfonic acid esters (esterification rate of OH group: 20 to 70 mol %) of these modified novolak resins.
上述のような、光硬化性ジアゾ樹脂またはこれを含む組
成物及び水酸基含有ポリマーは、必要に応じて添加され
る他の添加剤と共に適当な有機溶剤に熔解されて支持体
上に塗布・乾燥された後、露光され、完全にジアゾ樹脂
を分解させ、硬化させる事によりプライマー層が形成さ
れる。The above-mentioned photocurable diazo resin or a composition containing the same and a hydroxyl group-containing polymer are dissolved in an appropriate organic solvent together with other additives added as necessary, and then applied onto a support and dried. After that, it is exposed to light to completely decompose the diazo resin and harden it, thereby forming a primer layer.
プライマー層の厚さはIIIIg/dI112〜200
mg/dI112であることが好ましく、より好ましく
は3mg/dm2〜100 mg/dm”である。Primer layer thickness is IIIg/dI112-200
It is preferably 112 mg/dI, more preferably 3 mg/dm2 to 100 mg/dm''.
(感光層)
本発明において感光層に含有される1、 2−ナフト
キノン−2−ジアジド−4−スルホン酸エステル化合物
(以下、単に「ジアジド化合物」と称す)としては公知
の種々の化合物が使用できるが、特に1.2−ナフトキ
ノン−2−ジアジド−4−スルホン酸と、フェノール類
及びアルデヒド又はケトンの重縮合樹脂とのエステル化
合物が好ましく用いられる。(Photosensitive layer) In the present invention, various known compounds can be used as the 1,2-naphthoquinone-2-diazide-4-sulfonic acid ester compound (hereinafter simply referred to as "diazide compound") contained in the photosensitive layer. However, ester compounds of 1,2-naphthoquinone-2-diazide-4-sulfonic acid and polycondensation resins of phenols and aldehydes or ketones are particularly preferably used.
前記フェノール類としては、例えば、フェノール、0−
クレゾール、m−クレゾール、p−クレゾール、3,5
−キシレンノール、カルバクロール、チモール等の一価
フエノール、カテコール、レゾルシン、ヒドロキノン等
の二価フェノール、ピロガロール、フロログルシン等の
三価フェノール等が挙げられる。前記アルデヒドとして
はホルムアルデヒド、ベンズアルデヒド、アセトアルデ
ヒド、クロトンアルデヒド、フルフラール等が挙げられ
る。これらのうち好ましいものはホルムアルデヒド及び
ベンズアルデヒドである。また、前記ケトンとしてはア
セトン、メチルエチルケトン等が挙げられる。Examples of the phenols include phenol, 0-
Cresol, m-cresol, p-cresol, 3,5
- Monohydric phenols such as xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and phloroglucin. Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde, and furfural. Preferred among these are formaldehyde and benzaldehyde. Further, examples of the ketone include acetone, methyl ethyl ketone, and the like.
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、P−クレゾール・ホルムアルデヒド樹脂、m−
、p−混合クレゾール・ホルムアルデヒド樹脂、レゾル
シン・ベンズアルデヒド樹脂、ピロガロール・アセトン
樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol/formaldehyde resin, m-cresol/formaldehyde resin, P-cresol/formaldehyde resin, and m-cresol/formaldehyde resin.
, p-mixed cresol/formaldehyde resin, resorcinol/benzaldehyde resin, pyrogallol/acetone resin, and the like.
前記ジアジド化合物のフェノール類のOH基に対する1
、2−ナフトキノン−2−ジアジド−4−スルホン酸の
縮合率(OH基1個に対する反応率)は、15〜80%
が好ましく、より好ましくは20〜60%である。1 for the OH group of the phenol of the diazide compound
, the condensation rate (reaction rate for one OH group) of 2-naphthoquinone-2-diazide-4-sulfonic acid is 15 to 80%.
is preferable, and more preferably 20 to 60%.
更にジアジド化合物としてはポリヒドロキシ化合物の1
.2−ナフトキノン−2−ジアジド−4−スルホン酸エ
ステル化合物が挙げられ、このような化合物としては、
例えば、1,2−ナフトキノンジアジド−4−スルホン
酸シクロヘキシルエステル、l(1,2−ナフトキノン
シアシト4−スルホニル)−3,5−ジメチルピラゾー
ル、1.2−ナフトキノンジアジド−4−スルホン酸−
4”−ヒドロキシジフェニル−4#−アゾ−β−ナフト
ールエステル、2’−(1,2−ナフトキノンジアジド
−4−スルホニルオキシ)−1=ヒドロキシ−アントラ
キノン、1.2ナフトキノンジアジド−4−スルホン酸
−2,4−ジヒドロキシベンゾフェノンエステル、1,
2−ナフトキノンジアジド−4−スルホン酸−2,3,
4−トリヒドロキシベンゾフェノンエステル、1,2ナ
フトキノンジアジド−4−スルホン酸−2,3゜4′
4′−テトラヒドロキシベンゾフェノンエステル、1
.2−ナフトキノンジアジド−4−スルホン酸クロリド
2モルと4,4′−ジヒドロキシ−1,1′−ジフェニ
ルスルホン1モルの縮合物、1.2−ナフトキノンジア
ジド−4−スルホン酸クロリド1モルとプル10597
1モルの縮合物等が挙げられる。Furthermore, as a diazide compound, polyhydroxy compound 1
.. Examples of such compounds include 2-naphthoquinone-2-diazide-4-sulfonic acid ester compounds;
For example, 1,2-naphthoquinonediazide-4-sulfonic acid cyclohexyl ester, l(1,2-naphthoquinonediazide-4-sulfonyl)-3,5-dimethylpyrazole, 1,2-naphthoquinonediazide-4-sulfonic acid-
4''-hydroxydiphenyl-4#-azo-β-naphthol ester, 2'-(1,2-naphthoquinonediazide-4-sulfonyloxy)-1=hydroxy-anthraquinone, 1.2naphthoquinonediazide-4-sulfonic acid- 2,4-dihydroxybenzophenone ester, 1,
2-naphthoquinonediazide-4-sulfonic acid-2,3,
4-trihydroxybenzophenone ester, 1,2 naphthoquinonediazide-4-sulfonic acid-2,3°4'
4'-tetrahydroxybenzophenone ester, 1
.. Condensate of 2 moles of 2-naphthoquinonediazide-4-sulfonic acid chloride and 1 mole of 4,4'-dihydroxy-1,1'-diphenylsulfone, 1 mole of 1,2-naphthoquinonediazide-4-sulfonic acid chloride and Puru 10597
Examples include 1 mol of condensate.
また、更に下記に示すようなポリウレタン樹脂の1,2
−ナフトキノン−2−ジアジド−4−スルホン酸エステ
ル化合物も使用しうる。Furthermore, polyurethane resins such as 1 and 2 as shown below can be used.
-Naphthoquinone-2-diazide-4-sulfonic acid ester compounds may also be used.
CN。C.N.
(但し、 nは2〜30 0の整数を表わす。(however, n is 2 to 30 Represents an integer of 0.
)
また、ジアジド化合物としてはフェノール性水酸基を有
するビニル重合体と1.2−ナフトキノン−2−ジアジ
ド−4−スルホン酸とのエステル化合物も使用すること
ができる。このようなエステル化合物を形成するフェノ
ール性水酸基を有するビニル重合体としてはフェノール
性水酸基を有する単位を分子構造中に有する重合体であ
り、好ましくは、後述するフェノール性水酸基を有する
構造単位を分子構造中に有するビニル系重合体と同様の
ものが用いられる。) Furthermore, as the diazide compound, an ester compound of a vinyl polymer having a phenolic hydroxyl group and 1,2-naphthoquinone-2-diazide-4-sulfonic acid can also be used. The vinyl polymer having a phenolic hydroxyl group that forms such an ester compound is a polymer having a unit having a phenolic hydroxyl group in its molecular structure, and preferably the structural unit having a phenolic hydroxyl group described below is incorporated into the molecular structure. The same vinyl polymer as that contained therein is used.
本発明の化合物としては上記化合物を各々単独で用いて
もよいし、2種以上組合わせて用いてもよい。本発明の
感光性組成物中における本発明の化合物の占める割合は
、5〜60重量%が好ましく、特に好ましくは、10〜
50重量%である。As the compound of the present invention, each of the above compounds may be used alone or in combination of two or more. The proportion of the compound of the present invention in the photosensitive composition of the present invention is preferably 5 to 60% by weight, particularly preferably 10 to 60% by weight.
It is 50% by weight.
次に本発明でジアジド化合物と共に感光層中に含有され
る(B)フェノール性水酸基を有する構造単位を分子構
造中に有する重合体としては、好ましくは下記−数式(
a)〜〔d〕の少くとも1つの構造単位を含む重合体が
挙げられる。Next, in the present invention, the polymer (B) having a structural unit having a phenolic hydroxyl group in its molecular structure, which is contained in the photosensitive layer together with the diazide compound, preferably has the following formula (
Examples include polymers containing at least one structural unit of a) to [d].
CON R,−(−Aテ1
−OH
OO
−〇A−)−i
−0H
B−○H
H
式中、R4およびR3はそれぞれ水素原子、アルキル基
またはカルボキシル基を表わし、好ましくは水素原子で
ある。R6は水素原子、ハロゲン原子またはアルキル基
を表わし、好ましくは水素原子またはメチル基、エチル
基等のアルキル基である。R7は水素原子、アルキル基
、アリキール基またはアラルキル基を表わし、好ましく
はアルール基である。Aは窒素原子または酸素原子と芳
香族炭素原子とを連結する、置換基を有してもよいアル
キレン基を表わし、mはO〜10の整数を表わし、Bは
置換基を有してもよいフェニレン基または置換基を有し
てもよいナフチレン基を表わす。CON R, -(-Ate1 -OH OO -〇A-)-i -0H B-○H H In the formula, R4 and R3 each represent a hydrogen atom, an alkyl group or a carboxyl group, preferably a hydrogen atom. be. R6 represents a hydrogen atom, a halogen atom, or an alkyl group, preferably a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R7 represents a hydrogen atom, an alkyl group, an alkyl group, or an aralkyl group, preferably an allyl group. A represents an alkylene group which may have a substituent and which connects a nitrogen atom or an oxygen atom and an aromatic carbon atom, m represents an integer of O to 10, and B may have a substituent. Represents a phenylene group or a naphthylene group which may have a substituent.
本発明において用いられる重合体(B)としては共重合
体型の構造を有するものが好ましく、前記−数式(a)
〜(d)でそれぞれ示される構造単位と組み合わせて用
いることができる単量体単位としては、エチレン、プロ
ピレン、イソブチレン、ブタジェン、イソプレン等のエ
チレン系不飽和オレフィン類;スチレン、α−メチルス
チレン、p−メチルスチレン、p−クロロスチレン等の
スチレン類;(メタ)アクリル酸等のアクリル酸類;イ
タコン酸、マレイン酸、無水マレイン酸等の不飽和脂肪
族ジカルボン酸類; (メタ)アクリル酸メチル、(メ
タ)アクリル酸エチル、(メタ)アクリル酸n−ブチル
、(メタ)アクリル酸イソブチル、(メタ)アクリル酸
ドデシル、(メタ)アクリル酸2−クロロエチル、(メ
タ)アクリル酸フェニル、α−クロロアクリル酸メチル
、エタクリル酸エチル等のα−メチレン脂肪族モノカル
ボン酸のエステル類、2−ヒドロキシエチルアクリレー
ト、2−ヒドロキシエチル(メタ)アクリレート、N−
(4−ヒドロキシエチルフェニル)(メタ)アクリルア
ミド、ヒドロキシ−メチルジアセトン(メタ)アクリル
アミド等のアルコール性水酸基含有の(メタ)アクリル
酸のエステル又はアミド類(メタ)アクリレートル等の
ニトリル類; (メタ)アクリルアミド等のアミド類;
(メタ)アクリル酸アミド、p−クロロ(メタ)アク
リル酸アニリド、m−二トロ(メタ)アクリルアニリド
、m−メトキシ(メタ)アクリルアニリド等のアニリド
類;酢酸ビニル、プロピオン酸ビニル、ベンジェ酸ビニ
ル、酪酸ビニル等のビニルエステル類;メチルビニルエ
ーテル、エチルビニルエーテル、イソブチルビニルエー
テル、β−クロロエチルビニルエーテル等のビニルエー
テル類;塩化ビニル;ビニリデンクロライド:ビニリデ
ンシアナイド;1−メチル−1−メトキシエチレン、1
.1−ジメトキシエチレン、1.2−ジメトキシエチレ
ン、1.1−ジメトキシカルボニルエチレン、1−メチ
ル−1−ニトロエチレン等のエチレン誘導体類;N−ビ
ニルピロール、N−ビニルカルバゾール、N−ビニルイ
ンドール、N−ビニルピロールン、N−ビニルピロリド
ン等のN−ビニル化合物;その他のビニル系単量体が挙
げられる。これらのビニル系単量体は不飽和二重結合が
開裂した構造で高分子化合物中に存在する。The polymer (B) used in the present invention preferably has a copolymer type structure, and the above-mentioned formula (a)
Examples of monomer units that can be used in combination with the structural units represented by (d) are ethylenically unsaturated olefins such as ethylene, propylene, isobutylene, butadiene, and isoprene; styrene, α-methylstyrene, p - Styrenes such as methylstyrene and p-chlorostyrene; Acrylic acids such as (meth)acrylic acid; Unsaturated aliphatic dicarboxylic acids such as itaconic acid, maleic acid, and maleic anhydride; Methyl (meth)acrylate, (meth) ) Ethyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, dodecyl (meth)acrylate, 2-chloroethyl (meth)acrylate, phenyl (meth)acrylate, methyl α-chloroacrylate , esters of α-methylene aliphatic monocarboxylic acids such as ethyl ethacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl (meth)acrylate, N-
Nitriles such as esters or amides of (meth)acrylic acid containing an alcoholic hydroxyl group such as (4-hydroxyethylphenyl) (meth)acrylamide, hydroxy-methyldiacetone (meth)acrylamide, etc. (meth)acrylate; ) Amides such as acrylamide;
Anilides such as (meth)acrylamide, p-chloro(meth)acrylanilide, m-nitro(meth)acrylanilide, m-methoxy(meth)acrylanilide; vinyl acetate, vinyl propionate, vinyl benzoate , vinyl esters such as vinyl butyrate; vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, β-chloroethyl vinyl ether; vinyl chloride; vinylidene chloride: vinylidene cyanide; 1-methyl-1-methoxyethylene, 1
.. Ethylene derivatives such as 1-dimethoxyethylene, 1.2-dimethoxyethylene, 1.1-dimethoxycarbonylethylene, 1-methyl-1-nitroethylene; N-vinylpyrrole, N-vinylcarbazole, N-vinylindole, N -N-vinyl compounds such as vinylpyrrolone and N-vinylpyrrolidone; and other vinyl monomers. These vinyl monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
これら単量体は本発明の重合体中にブロック。These monomers are blocks in the polymers of this invention.
グラフト又はランダムのいずれの状態で結合していても
よい
以下に本発明で用いられる重合体(B)の代表的な具体
例をあげる。なお、下記に表示の化合物においてs、に
、12.mおよびnは、単にそれぞれ構造単位のモル%
を表すものであって、各構成単位が集合して存在するこ
とを意味しない。)例示化合物
(a)
CH。Typical specific examples of the polymer (B) used in the present invention, which may be bonded in either a grafted or random state, are listed below. In addition, in the compounds shown below, s, 12. m and n are simply the mole percent of the structural unit, respectively.
It does not mean that each constituent unit exists collectively. ) Exemplary compound (a) CH.
II CH3 (Mw=3 00゜ M w / M n = 2.5 。II CH3 (Mw=3 00° Mw/Mn=2.5.
m:n:ji!=30:40:30) (b) CHl CH3 *(CH2−CCHz CH)−k COOCR。m:n:ji! =30:40:30) (b) CHl CH3 *(CH2-CCHz CH)-k COOCR.
COOCC00 C2H5( 00゜ M w / M n = 2.1 。COOCC00 C2H5( 00° Mw/Mn=2.1.
m:n: l :に=30:30:36.5:3.5
)(C)
(MW=2
00゜
Mw/Mn=6.9゜
m:n:/=30:40:30)
(d)
m:n:j!=20:35:45)
(e)
O
(Mw=33
00゜
Mw/M n = 7 。m:n:l:ni=30:30:36.5:3.5
) (C) (MW=2 00°Mw/Mn=6.9°m:n:/=30:40:30) (d) m:n:j! = 20:35:45) (e) O (Mw = 33 00°Mw/M n = 7.
m:n:f=38:60:2) (f) CH3 CHl (Mw=40000゜ M w / M n = 3.5 。m:n:f=38:60:2) (f) CH3 CHl (Mw=40000゜ Mw/Mn=3.5.
m:n:f=20:60:20) (g) CH3 CH3 CH。m:n:f=20:60:20) (g) CH3 CH3 CH.
CH。CH.
*イCl2 CI分丁−−−−−HCHz −Cヂ]−N OOH (Mw=35000゜ M w / M n = 7.9 。*ICl2 CI division---HCHz-Cji]-N OOH (Mw=35000゜ Mw/Mn=7.9.
m:n:f:に:5=20:15: 30 :33 :2) (h) CH。m:n:f:ni:5=20:15: 30:33:2) (h) CH.
(Mw=35
00
M w / M n = 3.5
m: n : f=30 : 30 : 4
0)(i)
H1ll
CH3
H
(Mw=5
000゜
M w / M n −8,2。(Mw=35 00 Mw/Mn=3.5 m:n:f=30:30:4
0)(i) H1ll CH3H (Mw=5 000°Mw/Mn -8,2.
m:n:f=20:40:40) (Mw=20000゜ M W / M n = 3.5 。m:n:f=20:40:40) (Mw=20000゜ MW/Mn=3.5.
manミ1 : 1)
0■
(Mw=51000.Mw/Mn=5.7゜m:n:=
1:1)
(1)
CH3
H
(Mw=35000.Mw/Mn=3.8゜m: n
: t2=30 : 35 : 35)本発明に用
いられるビニル系重合体は上記重合体を単独で用いても
よいし、また2種以上組合わせて用いてもよい。また、
他の高分子化合物等と組合わせて用いることもできる。manmi1:1) 0■ (Mw=51000.Mw/Mn=5.7゜m:n:=
1:1) (1) CH3H (Mw=35000.Mw/Mn=3.8゜m: n
: t2=30 : 35 : 35) As the vinyl polymer used in the present invention, the above-mentioned polymers may be used alone or in combination of two or more. Also,
It can also be used in combination with other polymer compounds.
本発明においては、バイダーとしてノボラック樹脂を前
記重合体(B)に対して0.1〜60%(重量比)の範
囲で併用してもよい。In the present invention, a novolak resin may be used as a binder in an amount of 0.1 to 60% (weight ratio) based on the polymer (B).
かかるノボラック樹脂としては、例えばフェノール・ホ
ルムアルデヒド樹脂、クレゾール・ホルムアルデヒド樹
脂、特開昭55−57841号公報に記載されているよ
うなフェノール・クレゾール・ホルムアルデヒド共重縮
合体樹脂、特開昭55−1275り3号公報に記載され
ているような、p−置換フェノールとフェノールもしく
は、クレゾールとホルムアルデヒドとの共重縮合体樹脂
等が挙げられる。Such novolac resins include, for example, phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolycondensate resin as described in JP-A-55-57841, and JP-A-55-1275. Examples include copolycondensate resins of p-substituted phenol and phenol or cresol and formaldehyde, as described in Japanese Patent No. 3.
前記ノボラック樹脂の分子量は、好ましくは数平均分子
量(以下、「Mn」と略す)が3X10”〜7.50x
lO3、重量平均分子量(以下、「MW」と略す)がl
Xl0”〜×3×104、より好ましくはMnが5×1
02〜4×10、Mwが3X10”〜2X10’である
。なお、本発明の分子量の測定は、Mn、Mw共に後記
実施例中の合成例1に記載した方法により行なった。The molecular weight of the novolac resin is preferably a number average molecular weight (hereinafter abbreviated as “Mn”) of 3×10” to 7.50×
lO3, weight average molecular weight (hereinafter abbreviated as "MW") is l
Xl0"~x3x104, more preferably Mn is 5x1
02 to 4 x 10, and Mw is 3 x 10" to 2 x 10'. The molecular weight of the present invention was measured by the method described in Synthesis Example 1 in Examples below for both Mn and Mw.
本発明において、上記重合体(B)は、バインダーとし
て使用され、感光体組成物中5〜95重量%、好ましく
は、20〜90重量%の範囲で使用される。In the present invention, the polymer (B) is used as a binder, and is used in the photoreceptor composition in an amount of 5 to 95% by weight, preferably 20 to 90% by weight.
以上の成分から感光層が得られるが、そのほか、露光可
視画付与剤および色素が一般的に添加される。A photosensitive layer is obtained from the above components, and in addition, an exposure visible image imparting agent and a dye are generally added.
露光可視画付与剤としては、露光により酸を発生する化
合物、色素としてはこの酸と塩を形成する化合物を用い
るのが一般的である。As the exposure visible image imparting agent, a compound that generates an acid upon exposure is generally used, and as the dye, a compound that forms a salt with this acid is generally used.
露光により酸を発生する化合物としては、丁記一般弐■
又はVで示されるトリハロアルキル化合物またはジアゾ
ニウム塩化合物が好ましく用いられる。Compounds that generate acid upon exposure to light include
or a trihaloalkyl compound or a diazonium salt compound represented by V is preferably used.
(Xaは炭素原子数1〜3個のトリハロアルキル基、W
はN、S、SeまたはP、ZはO,N、S、Seまだは
P、Yは発色団基を有し、かつWとZを環化させるには
必要な非金属原子郡よりなる基を示す)
Ar Nx X−−V
し
Xa
(式中、Xaは炭素原子1〜3個を有するトリハロアル
キル基、B、は水素またはメチル基、Aは置換若しくは
非置換アリール基または複素環式%式%)
具体的例示化合物としては、−数式■として(1)
U
等のベンゾフラン環を有するオキサジアゾール化合物、
特開昭54−74728号公報に記載されている2−ト
リクロロメチル−5−(p−メトキシスチリル)−1,
3,4−オキサジアゾール化合物等が挙げられる。(Xa is a trihaloalkyl group having 1 to 3 carbon atoms, W
is N, S, Se or P, Z is O, N, S, Se or P, Y is a group having a chromophore group and consisting of nonmetallic atoms necessary to cyclize W and Z. ) Ar Nx (Formula %) Specific exemplary compounds include - formula (1) oxadiazole compounds having a benzofuran ring such as U;
2-trichloromethyl-5-(p-methoxystyryl)-1, which is described in JP-A-54-74728,
Examples include 3,4-oxadiazole compounds.
また、−数式■、■の化合物としては、特開昭53−3
6223号公報1に記載されている4(2,4−ジメト
キシ−4−スチリル)−6−)リクロロメチルー2−ピ
ロン化合物、2. 4−ビス−(トリクロロメチル)−
6−p−メトキシスチリル−3−)リアジン化合物、2
,4−ビス(トリクロロメチル)−6−p−ジメチルア
ミノスチリル−3−)リアジン化合物等が挙げられる。In addition, as compounds of -formulas ■ and ■, JP-A-53-3
4(2,4-dimethoxy-4-styryl)-6-)lichloromethyl-2-pyrone compound described in Publication No. 6223 1; 2. 4-bis-(trichloromethyl)-
6-p-methoxystyryl-3-) riazine compound, 2
, 4-bis(trichloromethyl)-6-p-dimethylaminostyryl-3-) riazine compounds, and the like.
前記ジアゾニウム塩化合物としては、露光によって強力
なルイス酸を発生するジアゾニウム塩が好ましく、対イ
オン部分としては無機化合物の対イオンが推奨される。The diazonium salt compound is preferably a diazonium salt that generates a strong Lewis acid upon exposure to light, and a counter ion of an inorganic compound is recommended as the counter ion portion.
具体例としては、ジアゾニウム塩のアニオン部分がフッ
化リンイオン、フッ化ヒ素イオン、フッ化アンチモンイ
オン、塩化アンチモンイオン、塩化スズイオン、塩化ビ
スマスイオン及び塩化亜鉛イオンの少なくとも1種であ
る芳香族ジアゾニウム塩であり、好ましくはパラジアゾ
フェニルアミン塩である。Specific examples include aromatic diazonium salts in which the anion moiety of the diazonium salt is at least one of phosphorus fluoride ion, arsenic fluoride ion, antimony fluoride ion, antimony chloride ion, tin chloride ion, bismuth chloride ion, and zinc chloride ion. Paradiazophenylamine salt is preferred.
上記露光可視画付与剤の全感光層中に含まれる量は好ま
しくは0.01〜20重量%、更に好ましくは0.1〜
20重量%、特には0.2〜10重量%である。The amount of the exposure visible image imparting agent contained in the total photosensitive layer is preferably 0.01 to 20% by weight, more preferably 0.1 to 20% by weight.
20% by weight, especially 0.2-10% by weight.
一方前記色素としては一般に公知の酸により塩を形成す
る化合物であればいずれでも使用可能であり、例えばト
リフェニルメタン系染料、シアニン染料、ジアゾ染料、
スチリル染料等が挙げられる。具体的にはビクトリアピ
ュアブルー80、エチルバイオレット、クリスタルバイ
オレット、ブリリアントグリーン、ペイシックツクシン
、エオシン、フェノールフタレイン、キシレノールブル
ーコンゴーレツド、マラカイトグリーン、オイルブルー
、+603、オイルピンク+312、クレゾールレッド
、オーラミン、4−pジエチルアミノフェニルイミノナ
フトキノン、ロイコマラカイトグリーン、ロイコクリス
タルハイオレントオレンジ■等が挙げられる。この色素
の添加量は全感光層中で約0.01〜10重量%が好ま
しく、より好ましくは0.05〜8重量%である。On the other hand, as the dye, any compound that forms a salt with a generally known acid can be used, such as triphenylmethane dyes, cyanine dyes, diazo dyes,
Examples include styryl dyes. Specifically, Victoria Pure Blue 80, Ethyl Violet, Crystal Violet, Brilliant Green, Pesic Tsuksin, Eosin, Phenolphthalein, Xylenol Blue Congo Red, Malachite Green, Oil Blue, +603, Oil Pink +312, Cresol Red, Examples include auramine, 4-p diethylaminophenylimino naphthoquinone, leucomalachite green, leuco crystal high olent orange (■), and the like. The amount of the dye added is preferably about 0.01 to 10% by weight, more preferably 0.05 to 8% by weight, based on the total photosensitive layer.
上記感光性組成物は、各種溶媒、例えばメチル(エチル
)セロソルブ、メチル(エチル)セロソルブアセテート
等のセロソルブ類、ジメチルホルムアミド、ジメチルス
ルホキシド、ジオキサン、アセトン、シクロヘキサノン
、トリクロロエチレン等の塗布溶媒に溶解させた塗料を
前記ブライマー上に公知の方法を用いて塗布を行い乾燥
させることにより感光層を得る。感光層の厚さは0.5
mg/dm2〜L OOmg/ dm2が好ましく、よ
り好ましくは1 mg/di2〜50 mg/dm”で
ある。The above-mentioned photosensitive composition is a paint dissolved in various solvents, such as cellosolves such as methyl (ethyl) cellosolve and methyl (ethyl) cellosolve acetate, coating solvents such as dimethyl formamide, dimethyl sulfoxide, dioxane, acetone, cyclohexanone, and trichloroethylene. A photosensitive layer is obtained by coating the above-mentioned brimer using a known method and drying it. The thickness of the photosensitive layer is 0.5
It is preferably 1 mg/dm2 to 50 mg/dm2, more preferably 1 mg/dm2 to 50 mg/dm.
(シリコーンゴム層)
本発明で用いるシリコーンゴム層としては、ある程度架
橋したオルガノポリシロキサンが好ましい。該オルガノ
ポリシロキサンは、分子量が通常壬ないし数十万のもの
である。(Silicone Rubber Layer) The silicone rubber layer used in the present invention is preferably a somewhat crosslinked organopolysiloxane. The organopolysiloxane usually has a molecular weight of 100,000 to several hundred thousand.
該オルガノポリシロキサンは架橋の方法により縮合型と
付加型に分けられる。The organopolysiloxanes are classified into condensed type and addition type depending on the method of crosslinking.
縮合型は縮合反応によって架橋が行なわれるもので反応
によって水、アルコール、有機酸などが放出される。特
に有用な縮合型のシリコーンゴムとしては、両末端ある
いは主鎖の1部に水酸基を有する線状オルガノポリシロ
キサンとシリコーン架橋剤の混合物が、水酸基にシリコ
ーン架橋剤を反応させたものが挙げられ、いずれも縮合
溶媒を加えた方が架橋速度の点で有利である。In the condensed type, crosslinking is performed by a condensation reaction, and water, alcohol, organic acid, etc. are released by the reaction. Particularly useful condensation type silicone rubbers include those obtained by reacting a mixture of a linear organopolysiloxane having hydroxyl groups at both ends or a part of the main chain with a silicone crosslinking agent, and reacting the hydroxyl groups with the silicone crosslinking agent. In either case, adding a condensation solvent is advantageous in terms of crosslinking speed.
上記オルガノポリシロキサンは主鎖に下記の繰り返し単
位を有する。The organopolysiloxane has the following repeating units in its main chain.
1
一←5i−0−)−
2
式中、R1及びR2は各々シアノ基、ハロゲン原子、水
酸基等の置換基を有していてもよいアルキル、アリール
、アルケニルまたはその組み合わせであり、メチル基、
フェニル基、ビニル基、トリフルオロプロピル基が好ま
しく、特にメチル基が好ましい。1 ← 5i-0-)- 2 In the formula, R1 and R2 are alkyl, aryl, alkenyl, or a combination thereof, each of which may have a substituent such as a cyano group, a halogen atom, or a hydroxyl group, and a methyl group,
A phenyl group, a vinyl group, and a trifluoropropyl group are preferred, and a methyl group is particularly preferred.
上記シリコーン架橋剤としては、
または−OH(式中、RとR′はアルキル基である)で
表わされる官能基を持つ、いわゆる脱酢酸型、脱オキシ
ム型、脱アルコール型、脱アミノ型、脱水型などの縮合
型シリコーン架橋剤が挙げられる。このような架橋剤の
例としては、テトラアセトキシシラン、メチルトリアセ
トキシシラン、エチルトリアセトキシシラン、フェニル
トリアセトキシシラン、ジメチルジアセトキシシラン、
ジエチルジアセトキシシラン、ビニルトリアセトキシシ
ラン、メチルトリメトキシシラン、ジメチルジメトキシ
シラン、ビニルトリメトキシシラン、メチルトリス(ア
セトンオキシム)シラン、メチルトリ(N−メチル、N
−アセチルアミノ)シラン、ビニルトリ(メチルエチル
ケトオキシム)シランメチルトリ (メチルエチルケト
オキシム)シランまたはそのオリゴマーなどを挙げるこ
とができる。The above-mentioned silicone crosslinking agents include the so-called acetic acid-removal type, oxime-elimination type, alcohol-elimination type, deamination type, dehydration type, and those having a functional group represented by -OH (in the formula, R and R' are alkyl groups). Examples include condensed silicone crosslinking agents such as molds. Examples of such crosslinking agents include tetraacetoxysilane, methyltriacetoxysilane, ethyltriacetoxysilane, phenyltriacetoxysilane, dimethyldiacetoxysilane,
Diethyldiacetoxysilane, vinyltriacetoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, vinyltrimethoxysilane, methyltris(acetoneoxime)silane, methyltri(N-methyl, N
-acetylamino)silane, vinyltri(methylethylketoxime)silane, methyltri(methylethylketoxime)silane, or oligomers thereof.
これらの架橋剤はいずれもオルガノポリシロキサン10
0重量部に対して0.5〜30重量部の範囲とするのが
よい。特に好ましくは1〜20重量部である。All of these crosslinking agents are organopolysiloxane 10
The amount is preferably in the range of 0.5 to 30 parts by weight relative to 0 parts by weight. Particularly preferably 1 to 20 parts by weight.
前記縮合触媒としては、有機のカルボン酸、チタン酸エ
ステル、ナフテン酸等があげられる。Examples of the condensation catalyst include organic carboxylic acids, titanate esters, naphthenic acids, and the like.
付加型とは、本体中の不飽和基、例えばビニル基(−C
H=CH2)に架橋剤中の水素が付加して架橋するよう
なものを言う。The addition type refers to an unsaturated group in the main body, such as a vinyl group (-C
H=CH2) is crosslinked by the addition of hydrogen in the crosslinking agent.
具体的にはビニル基含有オルガノポリシロキサン、水素
化オルガノポリシロキサン等に白金系触媒(例えば塩化
白金酸)等を混合させたものが挙げられる。Specifically, examples include vinyl group-containing organopolysiloxanes, hydrogenated organopolysiloxanes, and the like mixed with platinum-based catalysts (for example, chloroplatinic acid).
該オルガノポリシロキサンは主鎖に前記縮合型と同様の
繰り返し単位を有する。The organopolysiloxane has repeating units similar to those of the condensed type in the main chain.
本発明のシリコーンゴム層には、縮合型及び付加型シリ
コーンゴムのいずれがあるいは両方用いる事が可能であ
る。In the silicone rubber layer of the present invention, either or both of condensation type silicone rubber and addition type silicone rubber can be used.
また1つのオルガノポリシロキサンの中に水酸基、不飽
和基等を有する縮合がっ付加型のものを使用する事も可
能である。Furthermore, it is also possible to use a condensation-addition type organopolysiloxane having a hydroxyl group, an unsaturated group, etc. in one organopolysiloxane.
本発明に係るシリコーンゴムとして入手しうる市販品の
内、好ましい例としては、信越■製KS−705F、K
E−41,42,44、東芝シリコーン(製)YE55
05、YF3802、東レジリーン(製)SH−781
、PRX−305,5H−237等の縮合型シリコーン
ゴム及び信越■製KS−837、KE−103、KE−
106、KE−1300、東芝’iリコー7(製)TS
E3032、RTU−B、東しシリコーン(製)SI(
−9555等の付加型シリコーンゴムがあげられる。Among the commercial products available as the silicone rubber according to the present invention, preferred examples include KS-705F and K manufactured by Shin-Etsu.
E-41, 42, 44, Toshiba Silicone (manufactured) YE55
05, YF3802, Higashi Rejirin (manufactured) SH-781
, PRX-305, 5H-237 and other condensation silicone rubbers, and Shin-Etsu KS-837, KE-103, KE-
106, KE-1300, Toshiba'i Ricoh 7 (manufactured) TS
E3032, RTU-B, Toshi Silicone (manufactured by) SI (
Examples include addition-type silicone rubber such as -9555.
また、シリコーンゴムの強度を向上させる目的で、シリ
カ、酸化チタン、酸化アルミニウムなどの無機質充填剤
を付加しても良く、特にシリカは好ましく用いられる。Further, for the purpose of improving the strength of silicone rubber, an inorganic filler such as silica, titanium oxide, or aluminum oxide may be added, and silica is particularly preferably used.
このような充填剤としては分散性あるいは分散安定性の
点から平均粒子径500μm以下のものが好ましい。From the viewpoint of dispersibility or dispersion stability, such fillers preferably have an average particle diameter of 500 μm or less.
さらに本発明において用いられシリコーンゴム層には上
記の成分の他にイソシアヌレート基を有する反応性シラ
ン化合物を感光層との接着性向上のために添加してもよ
い。Furthermore, in addition to the above-mentioned components, a reactive silane compound having an isocyanurate group may be added to the silicone rubber layer used in the present invention in order to improve the adhesion to the photosensitive layer.
本発明で用いるイソシアネート基を有する反応性シラン
化合物は、下記式で示される。The reactive silane compound having an isocyanate group used in the present invention is represented by the following formula.
R8 0へ/\り0 1 特に下記式で示したものが好ましい。R8 to 0/\ri0 1 Particularly preferred are those represented by the following formula.
C3H6Si (OMe) 3 0\/N\りO CC 1 上記反応性シラン化合物の添加量は、 オルガノ ポリシロキサンに対し0.5%〜1 0%、 好ましく は1〜5%である。C3H6Si (OMe) 3 0\/N\riO C.C. 1 The amount of the reactive silane compound added is: organo 0.5% to 1 for polysiloxane 0%, preferably is 1-5%.
本発明においてシリコーンゴム層の膜厚は、画質及び現
像性の点から薄い程好ましく、耐剛性、印刷汚れ等の点
からは逆にある程度の厚さを必要とするため、一般には
3 mg/ dm” 〜50 mg/ di2が好まし
く、5 mg / dm” 〜30 mg / di”
がより好ましい。In the present invention, the thickness of the silicone rubber layer is preferably as thin as possible from the point of view of image quality and developability, and on the other hand, a certain degree of thickness is required from the point of view of rigidity resistance, printing stains, etc., so it is generally 3 mg/dm. "~50 mg/di2 is preferred, 5 mg/dm" ~30 mg/di"
is more preferable.
(保護層)
更に本発明の湿し水不要感光性平版印刷版はシリコーン
ゴム層の上に保護層を設けても良く、核保護層を設ける
方法として特公昭61−614号に記載のポリプロピレ
ンフィルム等をラミネートする方法や特開昭61−27
545号に記載の高分子重合体を塗布する方法等が知ら
れている。(Protective layer) Furthermore, in the photosensitive lithographic printing plate that does not require dampening water of the present invention, a protective layer may be provided on the silicone rubber layer, and as a method for providing a nuclear protective layer, a polypropylene film described in Japanese Patent Publication No. 61-614 may be used. How to laminate etc. and JP-A-61-27
A method of coating a high molecular weight polymer described in No. 545 is known.
(露光現像処理)
以上のようにして得られた湿し水不要感光性平版印刷版
は、以下の方法などで使用することができる。(Exposure and development treatment) The photosensitive lithographic printing plate that does not require dampening water, obtained as described above, can be used in the following methods.
湿し水不要感光性平版印刷版の保護層の上に原画のリス
フィルムを密着させ、超高圧水銀灯、メタルハライドラ
ンプ等で露光し、保護層を剥し、現像することにより印
刷版とすることができる。A printing plate can be obtained by closely adhering the lith film of the original image onto the protective layer of a photosensitive lithographic printing plate that does not require dampening water, exposing it to ultra-high pressure mercury lamps, metal halide lamps, etc., peeling off the protective layer, and developing it. .
現像時に用いる現像液としては、アルカリ水溶液主体ま
たは、アルカリ水溶液である。好ましく使用されうるア
リカリ剤としては、ケイ酸カリウム、ケイ酸リチウム、
ケイ酸ナトリウム、水酸化ナトリウム、水酸化カリウム
、水酸化リチウム、第三リン酸ナトリウム、第ニリン酸
ナトリウム、第三リン酸カリウム、第ニリン酸カリウム
、炭酸ナトリウム、炭酸カリウム等が挙げられる。これ
らの中でもケイ酸カリウム、ケイ酸リチウム、ケイ酸ナ
トリウム等のケイ酸アルカリを含有する現像液は現像階
調性が良好なため最も好ましく、ケイ酸アルカリの組成
がモル比で[SiO□〕/(M]−0,5〜1.5(こ
こに〔Si○2〕、(M3はそれ5in2のモル濃度と
総アルカリ金属のモル濃度を示す。)であり、かつSi
O□を0.8〜8重量%含有する現像液が好ましく用い
られる。The developer used during development is mainly an alkaline aqueous solution or an alkaline aqueous solution. Alkaline agents that can be preferably used include potassium silicate, lithium silicate,
Examples include sodium silicate, sodium hydroxide, potassium hydroxide, lithium hydroxide, tribasic sodium phosphate, dibasic sodium phosphate, tribasic potassium phosphate, dibasic potassium phosphate, sodium carbonate, potassium carbonate, and the like. Among these, a developer containing an alkali silicate such as potassium silicate, lithium silicate, or sodium silicate is most preferable because it has good development gradation, and the composition of the alkali silicate is [SiO□]/ (M]-0.5 to 1.5 (here, [Si○2], (M3 indicates the molar concentration of 5 in2 and the molar concentration of the total alkali metal), and Si
A developer containing 0.8 to 8% by weight of O□ is preferably used.
このケイ酸アルカリ組成のうち、特にモル比で(S i
02 :l / CM) −0,5〜0.75であり
、かつSingが0.8〜4重量%の現像液は、低濃度
のため現像液のため現像廃液の中和が容易なことから好
ましく用いられ、一方0.75を超え1.3までのモル
比であり、かつSiO□が1〜8重量%の現像液は緩衝
力が高く、処理能力が高いことから好適に用いられる。Of this alkali silicate composition, especially in terms of molar ratio (S i
02:l/CM) -0.5 to 0.75 and a Sing of 0.8 to 4% by weight, because it is a developer with a low concentration and it is easy to neutralize the developer waste solution. On the other hand, a developer having a molar ratio of more than 0.75 and up to 1.3 and containing 1 to 8% by weight of SiO□ is preferably used because it has a high buffering power and a high throughput.
また、該現像液中には、例えば亜硫酸ナトリウム、亜硫
酸カリウム、亜硫酸リチウム、亜硫酸マグネシウムなど
の水溶性亜硫酸塩を添加することもできる。Furthermore, water-soluble sulfites such as sodium sulfite, potassium sulfite, lithium sulfite, and magnesium sulfite can also be added to the developer.
また、該現像液中に、特開昭50−51324号公報に
記載されているような、アニオン性界面活性剤、および
両性界活性剤、特開昭59−75255号公報、同60
−111246号公報に記載されているような非イオン
性界面活性剤のうち少なくとも一つ含有させることによ
り、または特開昭55−9546号公報、同56−14
2528号公報に記されるように高分子電解質を含有さ
せることもできる。かかる界面活性剤の添加量は特に制
限はないが、0.003〜3重量%が好ましく、特にO
,OO6〜1重量%の濃度が好ましい。Further, in the developer, anionic surfactants and amphoteric surfactants such as those described in JP-A-50-51324, and JP-A-59-75255 and JP-A-60
By containing at least one of the nonionic surfactants as described in JP-A-111246, or JP-A-55-9546, JP-A-56-14.
A polymer electrolyte can also be included as described in Japanese Patent No. 2528. The amount of such surfactant added is not particularly limited, but is preferably 0.003 to 3% by weight, especially O
, OO 6-1% by weight is preferred.
さらに該ケイ酸アルカリのアルカリ金属として全アルカ
リ金属中、カリウムを20モル%以上含むことが、現像
液中での不溶物発生が少ないため好ましく、より好まし
くはカリウムを90モル%以上含むことであり、最も好
ましくはカリウムが100モル%の場合である。Further, it is preferable that the alkali silicate contains at least 20 mol% of potassium as the alkali metal in all the alkali metals, since the generation of insoluble matter in the developer is small, and more preferably 90 mol% or more of potassium. , most preferably when the potassium content is 100 mol %.
さらに、本発明に使用される現像液には消泡剤を含有さ
せることができる。好適な消泡剤には有機シラン化合物
が挙げられる。Furthermore, the developer used in the present invention can contain an antifoaming agent. Suitable antifoaming agents include organosilane compounds.
さらに場合によっては、10重量パーセント以下のはん
いて下記の極性溶媒を含有させることもできる。Further, depending on the case, 10% by weight or less of a polar solvent as described below may be contained.
極よし1炙
アルコール類(メタノール、エタノール、水など)
エナール類(メチルセロソルブ、エチルセロソルブ、プ
チルセロソルフ、メチルカルピトール、エチルカルピト
ール、ブチルカルピトール、ジオキサンなど)
ケトン類(アセトン、メチルエチルケトンなど)エステ
ル類(酢酸エチル、メチルセロソルブアセテート、セロ
ソルブアセテート、カルピトールアセテートなど)
現像後、画線部分(インキ着肉部分)にはプライマー層
があられれ、非画線部分(インキ反発部分)はシリコン
ゴム層に覆われた状態になる。現像後に検版等に便利な
ように画線部分であるプライマー層は染色するのが好ま
しい。この染色に好適に用いられる染料としてはクリス
タルバイオレット、ビクトリアピュアーブルー(BOH
)、マラカイトグリーン等があげられる。これらの染料
を水又は水にアルコール等の溶剤を加えたものに溶かし
、この液を用い染色することができる。Gokuyoshi 1 Roasted Alcohols (methanol, ethanol, water, etc.) Enals (methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl calpitol, ethyl calpitol, butyl calpitol, dioxane, etc.) Ketones (acetone, methyl ethyl ketone, etc.) Esters (Ethyl acetate, methyl cellosolve acetate, cellosolve acetate, carpitol acetate, etc.) After development, a primer layer is applied to the image areas (ink-bearing areas), and a silicone rubber layer is applied to the non-image areas (ink repellent areas). become covered. After development, the primer layer, which is the image area, is preferably dyed for convenience in plate inspection, etc. Dyes suitably used for this dyeing include crystal violet, Victoria Pure Blue (BOH
), malachite green, etc. These dyes can be dissolved in water or a mixture of water and a solvent such as alcohol, and this solution can be used for dyeing.
(実施例)
以下、実施例により本発明の湿し水不要感光性平版印刷
版について詳しく述べるが本発明は、これらに制限され
るものではない。(Example) Hereinafter, the dampening water-free photosensitive lithographic printing plate of the present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.
(ジアジド化合物の合成〕
合成例1 (QD−1)
ピロガロール50g、アセトン500gウォーターハス
中にセットした3頭コルベン中に投入シ窒素ガスを吹込
み、窒素置換を行った後、オキシ塩化リン5gを投入し
重縮合反応を行った。反応温度は20°Cに保ち一昼夜
反応させた後、水15!中に強力に撹拌しながら徐々に
投入し生成した重縮合物を沈澱させた。(Synthesis of diazide compound) Synthesis Example 1 (QD-1) 50 g of pyrogallol and 500 g of acetone were placed in a three-headed kolben set in a water lotus. After nitrogen gas was blown into the tank and nitrogen was replaced, 5 g of phosphorous oxychloride was added. The reaction temperature was kept at 20°C and the reaction was allowed to proceed for a day and night, and then the mixture was gradually poured into 15 cm of water with strong stirring to precipitate the formed polycondensate.
析出したした樹脂を濾取し水にてpHがほぼ7の中性に
なるまで洗浄を行い、濾取物は40 ’C以下にて乾燥
を行った。このようにして淡褐色状の樹脂48gを得た
。The precipitated resin was collected by filtration and washed with water until the pH became approximately neutral (7), and the filtered material was dried at 40'C or lower. In this way, 48 g of light brown resin was obtained.
この樹脂の分子量をGPC(日立635型、カラム シ
ョデシクス(Shodex)A804、A303、A3
02の直列〕にてポリスチレンを標準として測定を行っ
た。Mn、Mwの算出は柘植等、日本化学会誌、197
2年(4月号)第800頁に記載の方法により、オリゴ
マー領域のピークをならす(ピークの山と谷の中心を結
ぶ)方法にて行った。その結果、Mnは1.20x10
3Mwは2.12X10’であった。The molecular weight of this resin was determined by GPC (Hitachi model 635, column Shodex) A804, A303, A3.
02 in series] using polystyrene as a standard. Calculation of Mn and Mw is by Tsuge et al., Journal of the Chemical Society of Japan, 197.
The measurement was carried out in accordance with the method described in 2004 (April issue), page 800, by leveling the peaks of the oligomer region (connecting the centers of the peaks and valleys). As a result, Mn is 1.20x10
3Mw was 2.12X10'.
次にこの樹脂60gをジオキサン720/11i2に溶
解させ、1.2−ナフトキノンジアジド−4−スルホニ
ルクロライド70gを投入し、溶解後、炭酸カリ水溶液
(13重量%)70gを滴下し、40〜50°Cで約1
時開綿合反応を行わせた後、反応液を大量の希塩酸水中
(濃塩酸13In1、水3りに投入し、沈澱した樹脂を
濾取し、乾燥した。ピロガロール・アセトン樹脂の1.
2−ナフトキノンジアジド−4−スルホン酸エステル5
6g黄色粉末樹脂が得られた。分析の結果、OH基の縮
合率は30%であった。ポリヒドロキシ樹脂と同様にエ
ステル体の分子量を測定したところ、Mnは1.50X
103、Mwは2.32X103であった。Next, 60 g of this resin was dissolved in dioxane 720/11i2, 70 g of 1,2-naphthoquinonediazide-4-sulfonyl chloride was added, and after dissolving, 70 g of potassium carbonate aqueous solution (13% by weight) was added dropwise to the 40-50° Approximately 1 in C
After the time-spacing cotton mixing reaction, the reaction solution was poured into a large amount of diluted hydrochloric acid (13 in concentrated hydrochloric acid, 3 in in water), and the precipitated resin was collected by filtration and dried. 1.
2-naphthoquinonediazide-4-sulfonic acid ester 5
6g yellow powder resin was obtained. As a result of analysis, the condensation rate of OH groups was 30%. When the molecular weight of the ester was measured in the same way as polyhydroxy resin, Mn was 1.50X.
103, Mw was 2.32×103.
合成例2 (QD−2)
p−クレゾール200g、37%ホルムアルアヒド水溶
液50g、および蓚酸2.5gを、オイルパスにセット
した3頭コルベン中に投入し撹拌しながら昇温した。9
0°C付近で激しく発泡し一時的に冷却した後再び昇温
、内温を105°Cにした。Synthesis Example 2 (QD-2) 200 g of p-cresol, 50 g of a 37% aqueous formaldehyde solution, and 2.5 g of oxalic acid were placed in a three-headed colben set in an oil path and heated while stirring. 9
It foamed violently at around 0°C, and after being temporarily cooled, the temperature was raised again to bring the internal temperature to 105°C.
約3時間反応後、更に175°Cまで昇温し、水を留去
した。After reacting for about 3 hours, the temperature was further raised to 175°C, and water was distilled off.
2時間後200°Cに昇温し、100mm)Igまで減
圧し残留上ツマ−を留去した。10分後反応を止め、反
応物をテフロン・バットへ流し出し固化させた。この樹
脂の分子量を測定した結果Mnは500、Mwは800
であった。After 2 hours, the temperature was raised to 200°C, and the pressure was reduced to 100 mm) to distill off the residual supernatant. After 10 minutes, the reaction was stopped, and the reaction product was poured into a Teflon vat and solidified. As a result of measuring the molecular weight of this resin, Mn is 500 and Mw is 800.
Met.
次にこの樹脂60gをジオキサン720dに溶解させ、
1.2−ナフトキノンジアジド−4−スルホニルクロラ
イド70gを投入し、以下合成例1と同様にしてエステ
ル化物(QD−2)62gの黄色粉樹脂が得られた。分
析の結果、OH基の縮合率は50%であり分子量はMn
=700Mw=1010であった。Next, 60 g of this resin was dissolved in 720 d of dioxane,
70 g of 1.2-naphthoquinonediazide-4-sulfonyl chloride was added, and the same procedure as in Synthesis Example 1 was repeated to obtain 62 g of yellow powder resin of esterified product (QD-2). As a result of the analysis, the condensation rate of OH groups was 50% and the molecular weight was Mn.
=700Mw=1010.
比較合成例−1(QI)−3)
ピロガロール50g5アセトン350gをウオターパス
中にセットした3頭コルベン中に投入し窒素ガスを吹込
み、窒素置換を行った後、オキシ塩化リン5gを投入し
重縮合反応を行った。反応温度は20°Cに保ち一昼夜
反応させた後、水152中に強力に撹拌しながら徐々に
投入し生成した重縮合物を沈澱させる。Comparative Synthesis Example-1 (QI)-3) 50 g of pyrogallol and 350 g of acetone were placed in a three-headed colben set in a water path, and nitrogen gas was blown in to perform nitrogen substitution, and then 5 g of phosphorus oxychloride was added for polycondensation. The reaction was carried out. The reaction temperature was kept at 20°C and the reaction was allowed to proceed for a day and night, and then the mixture was gradually poured into 152 ml of water with strong stirring to precipitate the formed polycondensate.
析出した樹脂を濾取し水にてpHがほぼ7の中性になる
まで洗浄を行う。濾取物は40°C以下にて乾燥を行う
。このようにして淡褐色状の樹脂50gを得た。Mnは
2.0OX10’、Mwは3.40×103であった。The precipitated resin is collected by filtration and washed with water until the pH becomes approximately neutral (7). The filtered material is dried at 40°C or less. In this way, 50 g of light brown resin was obtained. Mn was 2.0OX10' and Mw was 3.40x103.
次にこの樹脂60gをジオキサン720dに溶解させ、
1.2−ナフトキノンジアジド−5−スルホニルクロラ
イド’ 70 gを投入し、溶解後、炭酸カリ水溶液(
13重量%)60gを滴下し、40〜50°Cで約1時
開綿合反応を行わせた後、反応液を大量の希塩酸水中(
濃塩酸13d、水3f)に投入し、沈澱した樹脂を濾取
し、乾燥した。ピロガロール・アセトン樹脂の1.2−
ナフトキノンジアジド−5−スルホン酸エステル56g
の黄色粉末樹脂が得られた。分析の結果、OH基の縮合
率は20%であった。ポリヒドロキシ樹脂と同様にエス
テル体の分子量を測定したところ、Mnは2.30X1
0”、Mwは3.03X103であった。Next, 60 g of this resin was dissolved in 720 d of dioxane,
1. Add 70 g of 2-naphthoquinonediazide-5-sulfonyl chloride and dissolve, then add potassium carbonate aqueous solution (
After dropping 60 g of 13% by weight) and carrying out an open-cotton combination reaction at 40 to 50°C for about 1 hour, the reaction solution was poured into a large amount of diluted hydrochloric acid (
The precipitated resin was collected by filtration and dried. 1.2- of pyrogallol acetone resin
Naphthoquinonediazide-5-sulfonic acid ester 56g
A yellow powder resin was obtained. As a result of analysis, the condensation rate of OH groups was 20%. When the molecular weight of the ester was measured in the same way as polyhydroxy resin, Mn was 2.30X1
0”, Mw was 3.03×103.
合成例3(バインダー1〕
P−ヒドロキシアニリン400g、ハイドロキノンモノ
メチルエーテル4g、アセトン41およびピリジン36
0gを混合し、寒剤を用いて外部より冷却し、内温か一
10″Cまで下った時点でメタルアクリル酸クロライド
420gを撹拌上滴下した。反応温度が0°C以下にな
るよう滴下温度を調節し、滴下終了後0〜3°Cで約2
時間撹拌し、次いで、25°Cで2時間撹拌後反応液を
1/3位になるまで濃縮し、これを希塩酸(pH約1.
0)10f中に注入し、生じた沈澱を吸引濾過して白色
の固体を得た。この白色の固体をメタルノール21に加
温溶解し、さらに5%炭酸ナトリウム水溶液21を加え
て40°Cで30分間撹拌した。次いで暗赤色のこの溶
液を5%塩酸水溶液8!に注入して多量の沈澱を生成さ
せ、これを吸濾過し乾燥して淡桃色の固体を得た。これ
をエタノールと水との混合溶媒より再結晶して融点15
5〜156”CのP−ヒドロキシメタアクリルアニリド
の無色針状晶450gを得た。Synthesis Example 3 (Binder 1) 400 g of P-hydroxyaniline, 4 g of hydroquinone monomethyl ether, 41 acetone, and 36 pyridine
0 g was mixed and cooled from the outside using a cryogen, and when the internal temperature had dropped to -10"C, 420 g of metal acrylic acid chloride was added dropwise with stirring. The dropping temperature was adjusted so that the reaction temperature was below 0 °C. After dropping, heat at 0 to 3°C for about 2 hours.
After stirring for 1 hour and then stirring at 25°C for 2 hours, the reaction solution was concentrated to about 1/3 and mixed with dilute hydrochloric acid (pH about 1.
The resulting precipitate was suction-filtered to obtain a white solid. This white solid was dissolved in Metalnol 21 while heating, and a 5% aqueous sodium carbonate solution 21 was further added, followed by stirring at 40°C for 30 minutes. Next, this dark red solution was mixed with 5% hydrochloric acid aqueous solution 8! A large amount of precipitate was formed, which was filtered and dried to obtain a pale pink solid. This was recrystallized from a mixed solvent of ethanol and water with a melting point of 15
450 g of colorless needle-like crystals of P-hydroxymethacrylanilide having a carbon content of 5 to 156"C were obtained.
得られたp−ヒドロキシメタアクリルアニリド(HyP
MA)53.2g、アクリルニトリル(AN)15.9
g、メタアルリル酸メチル(MMA)36、5 g、2
・ヒドロキシエチルメタクリレート(HEMA)3.5
gおよびα・α′−アゾビスイソブチロニトリル0.8
2 gをアセトン:エタノール(1:2)の混合溶媒1
90d中に溶解し、窒素ガス置換した後、65°Cで加
熱すると、重合体溶液が得られた。この重合体溶液を3
2の5%HCl水溶液中に注ぎ、生じた白色の沈澱物を
濾過し乾燥して白色重合体70gを得た。分子量を測定
するとMwが4.6X10’であった。The obtained p-hydroxymethacrylanilide (HyP
MA) 53.2g, acrylonitrile (AN) 15.9
g, methyl metaallylate (MMA) 36.5 g, 2
・Hydroxyethyl methacrylate (HEMA) 3.5
g and α・α′-azobisisobutyronitrile 0.8
2 g of acetone:ethanol (1:2) mixed solvent 1
A polymer solution was obtained by dissolving in 90d and heating at 65°C after purging with nitrogen gas. Add this polymer solution to 3
The resulting white precipitate was filtered and dried to obtain 70 g of a white polymer. When the molecular weight was measured, the Mw was 4.6×10'.
合成例4〔バインダー2〕
p−ヒドロキシスチレン40.0g、アクリロニトリル
20.0 g、スチレン40gおよび1gのα・α′−
アゾビスイソブチロニトリルをアセトン:エタノール(
1:1)の混合溶媒600dに溶解し、窒素ガス置換し
た後、68°Cで10時間加熱すると、重合体溶液が得
られた。これを水5I!。Synthesis Example 4 [Binder 2] 40.0 g of p-hydroxystyrene, 20.0 g of acrylonitrile, 40 g of styrene and 1 g of α・α′-
Azobisisobutyronitrile to acetone:ethanol (
A polymer solution was obtained by dissolving in 600 d of a mixed solvent (1:1), purging with nitrogen gas, and heating at 68°C for 10 hours. This is water 5I! .
に注ぎ生じた白色の沈澱物を濾温し乾燥し重合体70g
を得た。この重合体のMwは、47000であった。The white precipitate formed was filtered and dried to obtain 70g of polymer.
I got it. The Mw of this polymer was 47,000.
合成例5〔バインダー 3〕
m−クレゾール9og、p−クレゾール56g、フェノ
ール54g、37%ホルムアルデヒド水溶液85g、お
よび蓚酸2.5gを、オイルバスにセットした3頭コル
ヘン中に投入し撹拌しながら昇温した。90″C付近で
激しく発泡し一時的に冷却した後再び昇温し、内温を1
05°Cにした。Synthesis Example 5 [Binder 3] 9 og of m-cresol, 56 g of p-cresol, 54 g of phenol, 85 g of 37% formaldehyde aqueous solution, and 2.5 g of oxalic acid were put into a three-head colchen set in an oil bath and heated while stirring. did. It foams violently at around 90"C, cools down temporarily, and then rises again to bring the internal temperature to 1.
The temperature was set to 05°C.
約3時間反応後、更に175°Cまで昇温し、水を留去
した。After reacting for about 3 hours, the temperature was further raised to 175°C, and water was distilled off.
2時間後200°Cに昇温し、100mmHgまで減圧
し残留モノマーを留去した。10分後反応を止め、反応
物をテフロン・ハツトへ流し出し固化させた。この樹脂
の分子量を測定した結果Mnは1350、Mwは540
0であった。After 2 hours, the temperature was raised to 200°C, and the pressure was reduced to 100 mmHg to distill off residual monomers. After 10 minutes, the reaction was stopped and the reaction product was poured into a Teflon hat and solidified. As a result of measuring the molecular weight of this resin, Mn was 1350 and Mw was 540.
It was 0.
アルミニウム層の製造
厚さ0.24mmのアルミニウム板を3%水酸化ナトリ
ウム水溶液に浸漬して脱脂し、水洗いした後、32%硫
酸水溶液中において温度30°C15A/d1の条件で
10秒間、陽極酸化を行い、更に水洗いした後、2%メ
タケイ酸ナトリウム水溶液に温度85°Cで37秒間浸
漬し、更に温度90°Cの水(pH8,5)に25秒間
浸漬し、水洗、乾燥して、アルミニウム板を得た。Production of aluminum layer An aluminum plate with a thickness of 0.24 mm was immersed in a 3% aqueous sodium hydroxide solution to degrease it, washed with water, and then anodized in a 32% aqueous sulfuric acid solution at a temperature of 30°C and 15A/d1 for 10 seconds. After further washing with water, immersion in a 2% sodium metasilicate aqueous solution at a temperature of 85°C for 37 seconds, further immersion in water at a temperature of 90°C (pH 8.5) for 25 seconds, washing with water, drying, and aluminum Got the board.
次に下記に示す組成のプライマー層塗布液を作す高圧バ
ルブホモジナイザーにて1時間分散した後、アルミニウ
ム板aに塗布し、85どし一3分間乾燥し、3KW超高
圧水銀灯を用いて10100O/ ciの全面露光を行
なった。更に100°Cで4分間乾燥して厚さ4μmの
プライマーを形成した。Next, prepare a primer layer coating solution with the composition shown below. After dispersing for 1 hour using a high-pressure bulb homogenizer, it is applied to an aluminum plate a, dried for 13 minutes at 85°C, and heated at 10100O/ Full-body exposure of ci was performed. It was further dried at 100°C for 4 minutes to form a primer with a thickness of 4 μm.
(ブライマー組成)
1)ジアゾ樹脂 10部2)水酸基
含有ポリマー 90部3)酸化亜鉛
50部
4)溶 媒 850部
プライマー層に用いる水酸基含有ポリマー及びジアゾ樹
脂の合成を示す。(Brimer composition) 1) Diazo resin 10 parts 2) Hydroxyl group-containing polymer 90 parts 3) Zinc oxide
50 parts 4) Solvent 850 parts The synthesis of the hydroxyl group-containing polymer and diazo resin used in the primer layer is shown.
〈水酸基含有ポリマーの合成〉
窒素気流下でアセトン65gとメタノール65gの混合
溶媒に2−ヒドロキシエチルメタクリレ−)29.3
g (0,225モル)メチルメタクリレート27.5
g (0,275モル)及びアゾビスイソブチロニトリ
ル1.23 gを溶解し、この混合液を撹拌しながら、
60°Cで6時間還流した。反応終了後、反応液を水中
に投じて高分子化合物を沈澱させ、50°C−昼夜真空
乾燥させた。<Synthesis of hydroxyl group-containing polymer> Add 2-hydroxyethyl methacrylate (29.3) to a mixed solvent of 65 g of acetone and 65 g of methanol under a nitrogen stream.
g (0,225 mol) methyl methacrylate 27.5
g (0,275 mol) and 1.23 g of azobisisobutyronitrile were dissolved, and while stirring this mixture,
The mixture was refluxed at 60°C for 6 hours. After the reaction was completed, the reaction solution was poured into water to precipitate the polymer compound, and vacuum-dried at 50°C day and night.
ジアゾ樹脂の合成
p−ジアゾジフェニルアミン硫酸塩14.5g(50ミ
リモル)水冷下で40.9 gの濃硫酸に熔解した。こ
の反応液に、1.35g(45ミリモル)のパラホルム
アルデヒドを反応温度が10″Cを超えないように徐々
に添加した。Synthesis of diazo resin 14.5 g (50 mmol) of p-diazodiphenylamine sulfate was dissolved in 40.9 g of concentrated sulfuric acid under water cooling. To this reaction solution, 1.35 g (45 mmol) of paraformaldehyde was gradually added so that the reaction temperature did not exceed 10''C.
この反応混合物を水冷下、500mAのエタノール中に
滴下し、生じた沈澱を濾過した。エタノールで洗浄後、
この沈澱物を100mj2の純水に溶解し、この液に6
.8gの塩化亜鉛を溶解した冷濃厚水溶液を加えた。生
じた沈澱を濾過した後エタノールで洗浄し、これを15
0mjl!純水に溶解し、この液に8gの゛ヘキサフル
オロリン酸アンモニウムを溶解した冷濃厚水溶液を加え
た。生じた沈澱を濾取し、水洗した後、乾燥してジアゾ
樹脂1を得た。This reaction mixture was added dropwise to ethanol at 500 mA under water cooling, and the resulting precipitate was filtered. After washing with ethanol,
This precipitate was dissolved in 100 mj2 of pure water, and 6
.. A cold concentrated aqueous solution of 8 g of zinc chloride was added. The resulting precipitate was filtered and washed with ethanol.
0mjl! It was dissolved in pure water, and to this solution was added a cold concentrated aqueous solution in which 8 g of ammonium hexafluorophosphate was dissolved. The resulting precipitate was collected by filtration, washed with water, and then dried to obtain diazo resin 1.
?
〔感光層とシリコーン層の作製〕
上記ブライマー上に、表1に示す感光層とバインダーの
組み合せの感光層を下記の組成比に調液しホワラーで塗
布し、85°Cで3分間乾燥した。? [Preparation of Photosensitive Layer and Silicone Layer] A photosensitive layer having a combination of a photosensitive layer and a binder shown in Table 1 was prepared on the above-mentioned brimer in the following composition ratio, was coated with a whirler, and was dried at 85° C. for 3 minutes.
感光層の膜厚は:)+g/dm2であった。The thickness of the photosensitive layer was: )+g/dm2.
バインダー ・・・100部感光層
・・・50部2−トリクロ
ロメチル−5−(β(2′ヘンゾフリル)ビニル)−1
,3,4−オキサジゾール・・・2部
ビクトリアピュアブルーBOH1部
乳酸メチル ・・・1000部表−1
感光層とバインダーの組み合せ
次いで上記感光層上に下記シリコーンゴム組成物ヲ乾燥
重量で1.8g/n(になるように塗布し、90°Cの
熱風中で10分間乾燥した。Binder: 100 parts Photosensitive layer: 50 parts 2-trichloromethyl-5-(β(2'henzofuryl)vinyl)-1
, 3,4-oxadizole...2 parts Victoria Pure Blue BOH1 part Methyl lactate...1000 parts Table 1 Combination of photosensitive layer and binder Next, 1.8 g of the following silicone rubber composition was applied on the photosensitive layer by dry weight. /n() and dried in hot air at 90°C for 10 minutes.
(シリコーンゴム層組成物)
両末端に水酸基を有する
ジメチルポリシロキサン
(分子量52.000) 100部トリアセ
トキシメチルシラン 10部ジブチル錫ラウレー
ト 0.8部′′アイソパーE゛(エッソ
化学社製)900部次ニ、上記シリコーンゴム層上に厚
さ5μの片面マット化ポリプロピレンフィルムをラミネ
ートし、湿し水不要感光性平版印刷版を得た。(Silicone rubber layer composition) Dimethylpolysiloxane having hydroxyl groups at both ends (molecular weight 52.000) 100 parts Triacetoxymethylsilane 10 parts Dibutyltin laurate 0.8 parts'' Isopar E (manufactured by Esso Chemical Co., Ltd.) 900 parts Next, a single-sided matted polypropylene film having a thickness of 5 μm was laminated on the silicone rubber layer to obtain a photosensitive lithographic printing plate that did not require dampening water.
上記の版材料の上面に(ウグラプレートコンセールウエ
ッジ(テストカイル))を真空密着させた後、光源とし
てメタルハライドランプを用いて520mJ/ctAで
露光した。次いで27°Cの下記の現像液を1分間浸漬
した後、版材料の表面を現像液を染み込ませたパッドで
擦ることにより標準現像を行ない、さらに画線部は下記
組成の染色液を布につけ版上に軽くこすった後、水洗す
ることにより染色を行った。After a (Ugura Plate Console Wedge (Test Kyle)) was vacuum-adhered to the upper surface of the above plate material, it was exposed to light at 520 mJ/ctA using a metal halide lamp as a light source. Next, after soaking in the following developer at 27°C for 1 minute, standard development was performed by rubbing the surface of the plate material with a pad impregnated with the developer, and the image area was further coated with a dyeing solution of the following composition on the cloth. Dyeing was carried out by rubbing lightly on the plate and rinsing with water.
(現像液)
水酸化カリウム 1.0部亜硫酸カ
リウム 2.0部メタケイ酸カリウ
ム 3.0部水
91部(染色液)
゛ツルフィツト“
(クラレイソプレン化学■製 溶剤) 91部°“レ
オドールTW−0120”
(花王株製 界面活性剤)0.5部
ベンジルアルコール 5.0部ビクトリ
アピュアブルーBOH1,0部水
100部染色を行った後に現像性
を調べるために網点(ブルナー小点)の良好な再現域を
調べた。その結果を表2の現像性としるした列に示した
。(Developer) Potassium hydroxide 1.0 parts Potassium sulfite 2.0 parts Potassium metasilicate 3.0 parts Water
91 parts (staining liquid) "Tulfit" (manufactured by Clarei Soprene Chemical ■, solvent) 91 parts "Rheodol TW-0120" (manufactured by Kao Corporation, surfactant) 0.5 parts Benzyl alcohol 5.0 parts Victoria Pure Blue BOH 1,0 Department water
After dyeing 100 copies, the good reproducibility range of halftone dots (Brunner dots) was examined to examine developability. The results are shown in the column labeled Developability in Table 2.
さらに、前記現像液を水で2倍に希釈し各版に対して同
様の処理をし、網点の再現域を調べた結果を表2のアン
ダー現としるした列に示した。Further, the developer solution was diluted twice with water and the same treatment was applied to each plate, and the reproduction range of the halftone dots was investigated. The results are shown in the column labeled underprint in Table 2.
次に標準現像した各版を、湿し水供給装置をはずしたハ
イデルベルクGTO印刷機に取り付け、東洋インキ T
OYOKING ULTRAアクワレス G紅インキ
にて印刷し印刷物での網点の再現域を調べた。その結果
を表2の印刷物としるした列に示した。Next, each standard developed plate was installed on a Heidelberg GTO printing machine with the dampening water supply device removed, and the Toyo Ink T
Printed with OYOKING ULTRA Aquares G red ink and examined the reproduction range of halftone dots on the printed matter. The results are shown in the column labeled Printed Materials in Table 2.
セーフライト性を調べるために、各版に白色蛍光灯(版
面上で300fx)で露光時間10分で露光した。この
後にポジフィルムを密着露光し通常の現像処理をし、網
点により画像良否をみた。To examine safelight properties, each plate was exposed to white fluorescent light (300 fx on the plate surface) for an exposure time of 10 minutes. After this, the positive film was exposed in close contact and subjected to normal development processing, and the quality of the image was checked by halftone dots.
その結果を表2のセーフライト性と書いた列に示した。The results are shown in the column labeled Safelight property in Table 2.
(発明の効果)
以上の結果から、本発明の湿し水不要感光性平版印刷版
はアルカリ水溶液で現像できかつ、セーフライト性に優
れたものであることが確認できた。(Effects of the Invention) From the above results, it was confirmed that the photosensitive lithographic printing plate that does not require dampening water of the present invention can be developed with an alkaline aqueous solution and has excellent safelight properties.
Claims (1)
ンゴム層をこの順に塗設した湿し水不要感光性平版印刷
版において、該感光層が、少なくとも(A)1,2−ナ
フトキノン−2−ジアジド−4スルホン酸エステル化合
物及び(B)フェノール性水酸基を有する構造単位を分
子構造中に有する重合体を有することを特徴とするネガ
型の湿し水不要感光性平版印刷版。In a dampening water-free photosensitive lithographic printing plate in which at least a primer layer, a photosensitive layer, and a silicone rubber layer are coated in this order on a base plate, the photosensitive layer comprises at least (A) 1,2-naphthoquinone-2-diazide. -4 sulfonic acid ester compound and (B) a polymer having in its molecular structure a structural unit having a phenolic hydroxyl group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9567990A JPH03293669A (en) | 1990-04-11 | 1990-04-11 | Photosensitive lithographic printing plate that does not require dampening water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9567990A JPH03293669A (en) | 1990-04-11 | 1990-04-11 | Photosensitive lithographic printing plate that does not require dampening water |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03293669A true JPH03293669A (en) | 1991-12-25 |
Family
ID=14144190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9567990A Pending JPH03293669A (en) | 1990-04-11 | 1990-04-11 | Photosensitive lithographic printing plate that does not require dampening water |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03293669A (en) |
-
1990
- 1990-04-11 JP JP9567990A patent/JPH03293669A/en active Pending
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