JPH03296Y2 - - Google Patents

Description

[Detailed description of the invention] "Industrial field of application" The present invention relates to a conveying device for objects to be soldered such as printed circuit boards, and in particular, to convey the objects to be soldered in a horizontal direction.
For example, in vapor reflow soldering equipment, which is used to fix parts to objects to be soldered such as printed circuit boards by passing through a vapor layer formed in the upper part of the tank with an opening at the top end. The present invention relates to a conveyance device for objects to be soldered such as printed circuit boards.

``Technical background of the invention and its problems'' Conventionally, there has been an embodiment of this type of conveying device for objects to be soldered as shown in FIG. That is, a is a container in which a heat transfer liquid b such as fluorocarbon such as fluorinated polyoxypropylene is stored at the bottom, and a plurality of heating coils c are installed in this container a to heat the heat transfer liquid b to the boiling point. Decorated. Inlet and outlet conduits d and e are formed protruding from the opposite upper ends of the container a, and cooling coils f and g through which a cooling medium circulates are provided in these conduits d and e. h is a series of net-like conveyor members installed in the vessel a such that the inlet conduit d enters and the outlet conduit e emerges; Objects to be soldered such as printed circuit boards to which electrical parts are permanently soldered
is placed and transferred together with the conveyor member.

Therefore, in the above configuration, the object to be soldered i
is conveyed by a net-like conveyor member h, but because the conveyor member h circulates through the vapor layer in the container a, the vapor condenses or combines into a liquid. Since the coupling liquid j of the heat transfer liquid b adheres to the conveyor member h and is taken out of the container a or is rotated outside while adhering to the conveyor member, there is a drawback that the liquid is considerably consumed.

Therefore, the fluorine-based heat transfer liquid 2 for generating vapor, which is generally used in the vapor phase soldering method or apparatus, is expensive. Therefore,
The quality of the transfer device for objects to be soldered is judged based on how much of the heat transfer liquid b is not taken out of the container by the conveyor member or the transfer means.

Accordingly, there is currently a need among those skilled in the art for a conveying device for objects to be soldered that does not take the heat transfer liquid out of the container or takes it out as much as possible.

``Purpose of the present invention'' In view of the above-mentioned conventional technical background and problems, the present invention can solve the problem of the heat transfer liquid being carried out to the outside of the container or tank. Furthermore, even if the object to be soldered expands due to heat, it can be stably held and transported, and in addition, even if the object to be soldered has different dimensions, it can be easily held. An object of the present invention is to obtain a conveying device for an object to be soldered such as a printed circuit board in a vapor reflow soldering apparatus capable of holding an object to be soldered.

"Means for Achieving the Object of the Present Invention" In the vapor reflow soldering apparatus of the present invention, a conveying device for an object to be soldered such as a printed circuit board includes a mounting plate and a vertically disposed space between the mounting plate and the mounting plate. A pair of conveying means each having a plurality of rotary shafts and a clamping member provided on the rotary shafts are arranged at predetermined positions facing each other, and an object to be soldered, such as a printed circuit board, is placed on the clamping member. It is characterized in that the object to be soldered is forcibly moved to a vapor zone formed at the opening of the tank by sandwiching both end edges.

"Embodiments of the present invention" The present invention will be described in detail below with reference to embodiments shown in the drawings.

In one embodiment shown in FIGS. 1 to 5,
1 is a fluorine-based liquid for vapor generation 2
This is a soldering tank in which the soldering tank is accommodated up to the level of the horizontal plane shown by the dashed line 3 in FIG. This tank 1 has an opening 4 at its upper end so as to communicate with the atmosphere, and a portion below the horizontal plane inside the tank 1 is heated to heat the liquid 2 to the boiling point and maintain it at that temperature at all times. It has a heating element 5 such as a coil. Reference numeral 6 denotes a cooling tank with an opening at the top 8 that is connected to the front side wall 7 of the tank 2. In this cooling tank 6, steam is generated from the liquid 2 by heating with the heating element 5.
A plurality of cooling bodies 10 such as cooling coils capable of adjusting a so-called vapor zone 9 are installed inside. Although only the front side of the cooling tank 6 is shown in FIG. 4, a similar configuration is also provided on the rear side of the cooling tank 6. 11 is the side wall 7 of tank 1
These are conduction or communication holes formed at appropriate locations in the cooling body 10 to guide the liquid 2a condensed by the cooling body 10 into the tank 6 for re-vaporization.

Therefore, the conveying device in the vapor reflow soldering apparatus of the present invention is installed along the longitudinal direction of the tank 1 and the cooling tanks 1 and 6. That is, 20 and 21 are a pair of transport mechanisms or transport means that are disposed above the tanks 1 and 6 and facing each other with a predetermined interval. In addition, these conveyance means 2
Since 0 and 21 have similar configurations,
For convenience, only one of the conveying means 20 will be specifically explained, and the same components will be given the same reference numerals. Reference numeral 22 denotes a support that is appropriately erected on the entrance side further forward than the cooling tank 6 on the front side and has a required height higher than the tanks 1 and 6. The support 22 also supports one other cooling tank (not particularly shown) on the rear side. It is also erected on the outlet side behind the tank, and a lower mounting plate 2 is installed at the upper end of the column 22.
3 is fixedly installed in a horizontal position. 24 is a support stand 25 facing the lower mounting plate 23.
An upper mounting plate is fixedly provided to the support base 25 with a fixing member 26 via a plurality of bearings 27 on the upper surface of the upper mounting plate 23. There is a horizontal shaft 28 which is mounted on the shaft. This horizontal axis 28 is oriented in one direction by a drive source (not shown), and when referring to FIG. 1, the left conveying means 2
The horizontal axis 28 of the conveying means 21 on the right side is provided so that it can rotate clockwise, while the horizontal axis 28 of the conveying means 21 on the right side can rotate counterclockwise, and as shown in FIG. 29 are provided. 30 is the lower and upper mounting plates 23 and 24;
A plurality of rotating shafts each having a bevel gear 31 on a protruding end that is vertically suspended from the shaft and meshing with each of the bevel gears 29, and an object 32 to be soldered such as a printed circuit board is attached to the lower part of the rotating shaft 30. The clamping member 33 is provided with a clamping member 33 that can clamp the rotating shaft 30, and the clamping member 33 includes a receiving plate 34 of an arbitrary shape that is fixedly attached to the lower end or the lower end portion of the rotating shaft 30 in a level-adjustable manner, and the receiving plate 34. An inverted truncated conical rotary press whose upper end is stopped by a flange portion 35 provided around a suitable part of the rotating shaft 30 slightly above the position where the rotating shaft 30 is provided, and which is mounted on the rotating shaft 30 so as to be movable up and down. and a spring body 37 that constantly urges the body 36 to press against the receiving plate 34.

In this embodiment, the conveyance means 20, 21 include upper and lower mounting plates 24, 23, a horizontal shaft 28 having a plurality of bevel gears 29, a bevel gear 31 at the upper end, and a clamping member at the lower end. 33 and a plurality of rotating shafts 30 as at least a component thereof.

In the above configuration, when a drive source (not shown) is driven, the horizontal shaft 28 of the left conveying means 20 rotates clockwise as shown in FIG. 1, while the horizontal shaft 28 of the right conveying means 21 rotates counterclockwise. Rotate in the direction. Therefore, each rotating shaft 30 that meshes with each bevel gear 29 of the horizontal shaft 28 rotates at the same speed in the direction of the arrow, as shown in FIGS. 1 and 2. However,
The object 32 to be soldered is located at the fourth position from the front of the tanks 1 and 6.
As shown in the figure, both edges are the left and right rotation shafts 30.
While being held by the holding members 33 of , it is sent in the direction of movement shown by the arrow in FIG. In other words, the object to be soldered 32 has both end edges connected to the receiving plate 34 of the clamping member 33.
and the rotary pressing body 36, and is pressed toward the receiving plate 34 side in a point contact state by the rotary pressing body 36 rotated by the rotating shaft 30, and as a result, it is forcibly moved in the direction of movement in a stable state. be made to run. The object 32 to be soldered is in the vapor zone 9 as shown in FIG.
There is a possibility that the rotary press body 36 will thermally expand when it enters the inside, but if it does, the rotary pressing body 36 will rise somewhat against the spring force of the spring body 37, as shown in FIG. In this embodiment, there are a total of 6 objects 32 to be soldered, as shown in FIG.
Although it is always clamped by the clamping members 33 of four or more rotating shafts 30 and its direction is regulated, it is preferable that it is clamped by the clamping members 33 of at least four rotating shafts 30.

"Different Embodiments of the Present Invention" Next, different embodiments of the present invention shown in FIG. 6 will be described. In the description of this embodiment, the same or equivalent parts as in the embodiment of the present invention will be denoted by the same reference numerals, and redundant explanation will be omitted.

In the embodiment shown in FIG. 6, the main difference from the embodiment of the present invention is that the transport means 20 of the transport device Y
A, the specific configuration of 21A, and the conveyance means 20A,
The conveying means 20A on one side of the soldering device 21A, in this embodiment the left side, is provided so as to be movable in a direction orthogonal to the running direction of the object 32 to be soldered so that its position can be adjusted.

That is, the conveying means 20A on one side is supported by the left and right pillars 22A, 22B so as to be rotatable by a drive source (not shown), and has a rotating horizontal shaft 41 having a male thread 40 on the outer periphery. ,
The horizontal shaft 41 has a female thread that engages with the male screw 40 of the horizontal shaft 41, and when the horizontal shaft 41 rotates, the horizontal shaft 41
A cylindrical threaded body 42 that can reciprocate in the axial direction of the
A connecting rod 43 whose lower end part is fixedly fitted into the threaded body 42, and lower and upper mounting plates 23A and 24A fixedly attached to the upper end of the connecting rod 43 while facing each other and spaced apart from each other. A horizontal shaft 28A is mounted vertically on these lower and upper mounting plates 23A and 24A and has a horizontal shaft 28A at the upper end that projects from the upper mounting plate 24A.
an intermediary gear 46 having a bevel gear 44 that meshes with the bevel gear 29A and a spur gear 45 provided in the center; and the spur gear 4 of this intermediary gear 46.
A rotating shaft 30A having a spur gear 47 meshing with the rotating shaft 5 and vertically mounted on the upper and lower mounting plates 24A and 23A.
and a clamping member 33A that can elastically clamp the object to be soldered 32A provided at the lower end of the rotating shaft 30A.
Instead of a coil spring, the spring body 37A of A uses a washer type or a suitable shape in which two plates are overlapped so as to face each other. Note that the conveying means 21A on the other side is also the same as the conveying means 2 on the one side.
Although it has substantially the same structure as 0A, in this embodiment, it is fixedly provided on the support column 22B.

Even with such a configuration, it has the same functions and effects as the embodiment of the present invention, and the object to be soldered 32
The horizontal rotation shaft 41 can be moved to the position shown by the imaginary line corresponding to the width dimension of A, that is, in the width direction of the tank.

"Effects of the Present Invention" As is clear from the above explanation, the present invention has the following practical effects.

(1) A pair of conveying means equipped with clamping members is arranged at a predetermined position, and the objects to be soldered can be forcibly moved to the vapor zone formed at the opening of the tank. The disadvantage of liquid being taken out can be eliminated. In other words, in the present invention, only the objects to be soldered can travel on their own without moving the conveyance means, so that the heat transfer liquid adhering to the conveyance means does not come out of the tank as in the conventional embodiment. There is no such thing as putting it away.

Therefore, in a vapor reflow soldering apparatus, this is an extremely optimal embodiment and is economical when objects to be soldered are passed through a vapor zone.

(2) In the case of an embodiment in which an inverted truncated cone-shaped rotary pressing body that is constantly pressed against the receiving plate is used as a clamping member provided on the rotating shaft, its tapered surface makes point contact with both edges of the soldering object. Since the soldering object can be held in place, it is possible to transport the soldering object reliably and stably without lifting the object.
Further, even if the soldering object undergoes thermal expansion in the vapor zone, the rotary pressing body can rise, so there is no risk of any trouble occurring during transportation.

(3) In embodiments in which at least one side of the conveying means is movable in a position-adjustable manner, it is possible to clamp the article to be soldered regardless of its width.

[Brief explanation of the drawing]

Figures 1 to 5 show an embodiment of the present invention, Figure 1 is a schematic explanatory diagram when viewed from the direction of entry of the soldering object, and Figure 2 is viewed from the - line direction of Figure 1. FIG. 3 is a partially omitted schematic explanatory diagram when viewed from the - line direction of FIG. 1, and FIGS. 6 is a schematic explanatory diagram showing a different embodiment of the present invention as seen from the direction in which the soldering object enters, and FIG. 7 is a schematic cross-sectional diagram showing a conventional embodiment. It is an explanatory diagram. 1... Tank, 2, 2a... Liquid, 4, 8... Opening, 5... Heating element, 9... Vapor zone, 10
... Cooling body, 20, 20A, 21, 21A ... Conveying means, 22, 22A, 22B ... Support column, 23,
23A...Lower mounting plate, 25...Support stand, 24,
24A... Upper mounting plate, 27... Bearing, 28,2
8A...horizontal axis, 30, 30A...rotation axis, 29,
29A, 31, 44...Bevel gear, 32, 32
A...Object to be soldered, 37, 37A...Spring body, 4
1...Rotating horizontal axis, 42...Connecting rod, 45, 47...
... Spur gear, 46... Intermediate gear, Y, X... Conveyance device.

Claims (1)

[Claims for Utility Model Registration] 1. A conveying means comprising a mounting plate, a plurality of rotating shafts vertically installed on the mounting plate at required intervals, and a clamping member provided on the rotating shafts. A pair of clamping members are arranged at predetermined positions facing each other, and the clamping members clamp both end edges of an object to be soldered such as a printed circuit board, and the soldered object is forcibly moved to a vapor zone formed at an opening of a tank. A conveying device for objects to be soldered, such as printed circuit boards, in a vapor reflow soldering device, characterized by: 2. In the vapor reflow soldering apparatus according to claim 1 of the utility model registration claim, wherein the conveying means on at least one side is movable in a position adjustable in a direction orthogonal to the running direction of the object to be soldered. A device for transporting objects to be soldered such as printed circuit boards. 3. The clamping member includes a receiving plate fixedly provided at the lower end or the lower end portion of the rotating shaft, a spring body provided on the rotating shaft, and a spring body that is constantly biased by the spring body and in pressure contact with the receiving plate. A printed circuit board or the like in a vapor reflow soldering apparatus according to claim 1 of the utility model registration claim, characterized in that the rotating pressing body has an inverted truncated conical shape and is mounted on a rotating shaft so as to be movable up and down. Conveying device for objects to be soldered. 4. The receiving plate of the clamping member is attached to the lower end of the rotating shaft so that its level can be adjusted. Conveying device for objects to be soldered. 5 A bevel gear is provided at the protruding upper end of each rotating shaft, and these bevel gears are rotated by a drive source and are fixedly mounted at required intervals on a horizontal shaft suspended horizontally on a mounting plate. A conveying device for an object to be soldered such as a printed circuit board in a vapor reflow soldering apparatus according to claim 1, wherein the device meshes with each of the bevel gears. 6 Spur gears are provided near the upper end of each rotating shaft, and these spur gears are connected to a plurality of bevel gears fixed at required intervals to the horizontal shaft suspended horizontally on the mounting plate. A printed circuit board or the like in a vapor reflow soldering apparatus according to claim 1 of the utility model registration claim, characterized in that the invention meshes with the spur gear of each intermediary gear that is vertically mounted on a mounting plate. Conveying device for objects to be soldered.