JPH0330346A - Wire bonding device - Google Patents

Abstract

PURPOSE:To form a microcircuit by setting the length direction of wires in parallel with the contact surface between a pair of conductive electrodes provided with wire joining surfaces at their leading end sections and an insulating body put between the electrode and connecting each electrode to a welding power source. CONSTITUTION:Wire joining surfaces 1a and 2a which press a wire 4 against an electrodes 1 and 2 and become electrification surfaces to the wire 4 are respectively formed on bottom surfaces of the electrodes 1 and 2 and cross sections of the wire joining surfaces 1a end 2a form an inverted U-shape. Each of the electrodes 1 and 2 is connected with a welding power source 6. In this case, the length direction of the wire 4 is set in parallel with the contact surface between the pair of electrodes 1 and 2 and an insulating body 3 put between the electrodes 1 and 2 by supplying the wire 4 through a wire guide section 8 by means of a wire clamper 7 so that the wire 4 can be thermally joined with an electrode 5 when the electrodes 1 and 2 are electrified in the state where the wire 4 is pressed at the time of bonding. Therefore, wire bonding to a microcircuit becomes possible, since the joint can be formed shorter in length.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applied to the manufacturing process of IC parts, etc.
The present invention relates to a wire bonding device that connects 11 electrodes and an external electrode one by one using a wire.

BACKGROUND OF THE INVENTION There are various types of wire bonding equipment conventionally used in the wire bonding process, but one that can be applied to combinations of many types of metals is a wire bonding system that is connected to a welding power source while facing each other through an insulator. The wires were locally heated and joined using two wedge tools.

The wedge tool will be explained below with reference to the screen. In FIG. 3, 11 is a wire bonding surface 11a.
A tool 12 has a guide hole 17 for guiding the wire 14 toward the wire joint surface 11a facing the tool 11.
This tool has a wire bonding surface 12a coplanar with the wire bonding surface 12a. 13 is an insulator sandwiched between tools 11 and 12. Additionally, the tools 11,12 are typically constructed from an electrically conductive material such as cemented carbide. In addition, tool 11.12
Wire bonding surfaces 11a and 12a formed at the tips of the lower surfaces press the wire 14 against the surface to be bonded and
Becomes a current-carrying surface.

The wire bonding surfaces 11a, 12a are formed in a chevron-shaped or inverted U-shape in cross section. Further, a guide portion 16 is formed in the lower part of the tool 11, and a guide hole 17 is formed in the guide portion 16 for stably supplying the wire 14 toward the wire bonding surface 11a. Furthermore, tool 1
1 and tool 12 are connected to a welding power source 18.

Problems to be Solved by the Invention However, in the configuration of the prior art described above, the wire-wire joint is formed by the wire joint surfaces 11a and 12a, and the wire joint length e2 is equal to the bonding pad length el.
Since it is thicker, it has had the problem of not being able to form microcircuits.

Means for Solving the Problems In order to solve the above problems, the present invention provides a pair of electrodes having a wire bonding surface at the tip and having conductivity, and a contact surface between the insulator sandwiched between the electrodes. The longitudinal direction of the wires was arranged parallel to the , and each electrode was connected to a welding power source.

In the above structure, the present invention is capable of joining the wire to the surface to be welded by applying current to the welding power source while the wire is pressed against the surface to be welded by the wire joining surface of the electrode, thereby instantaneously heating the wire locally. Since the bonding section is formed small, wire bonding to microcircuits becomes possible.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

FIG. 1 is a view of the main part of the bonding position in one embodiment of the present invention, viewed from the wire direction.

In FIG. 1, 1 and 2 are electrodes, and 3 is an insulator provided to provide a gap between the electrodes 1 and 2. A wire 4 is connected to the bottom surface of these electric lights and 2.
Wire bonding surfaces 1a and 2a are formed that press against the t-pole and serve as current-carrying surfaces for the wires. The cross-sectional shape of these wire bonding surfaces 1a, 2a is formed into an inverted U-shape. The electrodes 1 and 2 are each connected to a welding power source 6. 5 is a pounding pad. Further, FIG. 2 is a perspective view of the main parts of the bonding device.

In FIG. 2, 7 is a wire clamper, and 8 is a guide portion that is guided during wire feeding during a bonding operation. In the above configuration, the wire 4 is supplied by the wire clamper 7 through the wire guide section 8, and the wire 4 is aligned in the longitudinal direction parallel to the contact surface between the pair of electrodes 1 and 2 and the insulator 3 sandwiched between the electrodes. By energizing the electrodes 1 and 2 while pressing the wire 4 during bonding, the wire 4 is heated and bonded to the electrode 5.

Effects of the Invention According to the present invention, since the longitudinal direction of the wire is arranged parallel to the contact surface between a pair of electrodes and the insulator sandwiched between the electrodes during bonding, the bonding portion can be made small and the pressure can be reduced. Since the entire group is joined, a stable joint can be obtained.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the configuration of the main part of an embodiment of the present invention, and FIG.
The figure is a perspective view of the main parts of the same embodiment, and FIG. 3 is a schematic explanatory diagram of the conventional example. 1.2... Electrode, 3... Insulator, 4...
...Wire, 6...Welding power source.

Claims (1)

[Claims] A pair of conductive electrodes that have a wire bonding surface at the tip and an insulator sandwiched between these electrodes are arranged with the longitudinal direction of the wire parallel to the connection surface, and each electrode is welded. Wire bonding equipment connected to power supply.