JPH0330422U

JPH0330422U -

Info

Publication number: JPH0330422U
Application number: JP9048589U
Authority: JP
Priority date: 1989-07-31
Filing date: 1989-07-31
Publication date: 1991-03-26

Description

[Brief explanation of drawings]

第１図は本考案によるチツプコンデンサの一実
施例を示すもので、同図ａは斜視図、同図ｂは内
部構造を示す模式断面図である。第２図は従来の
チツプコンデンサを示すもので同図ａは斜視図、
同図ｂはその内部構造を示す模式断面図である。符号の説明、１……誘電体、２……内部電極、
３……外部電極、４……内装コート、５……外装
コート、６……導電体、８……メツキ層。 FIG. 1 shows an embodiment of a chip capacitor according to the present invention, in which FIG. 1A is a perspective view and FIG. 1B is a schematic sectional view showing the internal structure. Figure 2 shows a conventional chip capacitor; figure a is a perspective view;
Figure b is a schematic sectional view showing its internal structure. Explanation of symbols, 1...dielectric, 2...internal electrode,
3...External electrode, 4...Interior coat, 5...Exterior coat, 6...Conductor, 8...Plating layer.

Claims

[Scope of utility model registration request]

A chip capacitor consisting of a cylindrical dielectric, an internal electrode formed from at least a part of the inner circumferential surface to a part of the outer circumferential surface, and an external electrode formed on the other part of the outer circumferential surface insulated from the internal electrode. The entire surface of the inner circumferential surface and the entire surface of the outer circumferential surface except for some annular bands at both ends are each covered with an insulating resin, and both end annular portions of the outer circumferential surface and one of them are coated with an insulating resin. A cylindrical chip capacitor characterized in that an exposed electrode protected by a plating layer is present on a connected end plane portion, and the other end plane portion is coated with a resin.