JPH0330834U - - Google Patents
Info
- Publication number
- JPH0330834U JPH0330834U JP9176489U JP9176489U JPH0330834U JP H0330834 U JPH0330834 U JP H0330834U JP 9176489 U JP9176489 U JP 9176489U JP 9176489 U JP9176489 U JP 9176489U JP H0330834 U JPH0330834 U JP H0330834U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- sensing element
- element layer
- temperature sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000009966 trimming Methods 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図ないし第４図は、この考案の好適な実施
例を示した図面であり、第１図は分解斜視図、第
２図は第１図に示したものを組合わせた完成品の
斜視図、第３図は第２図に示す矢視Ａ−Ａ方向断
面詳細図、第４図は第２図に示す矢視Ｂ−Ｂ方向
断面詳細図である。第５図は、従来の技術を示す
分解斜視図である。
１……基板、２……第１の導電路、３……第２
の導電路、４……温度感知素子層、５……ガラス
コート層、６，７……端子、８……良熱伝導性ケ
ース、８ａ……凹部、９……樹脂、９ａ……コネ
クタ、１０……スペーサ、４ａ，４ｂ，４ｃ……
トリミング部。
Figures 1 to 4 are drawings showing a preferred embodiment of this invention, with Figure 1 being an exploded perspective view and Figure 2 being a perspective view of a completed product that combines the elements shown in Figure 1. 3 are detailed cross-sectional views in the direction of arrows A--A shown in FIG. 2, and FIG. 4 is detailed cross-sectional views in the direction of arrows B--B shown in FIG. 2. FIG. 5 is an exploded perspective view showing a conventional technique. 1... Substrate, 2... First conductive path, 3... Second
Conductive path, 4... Temperature sensing element layer, 5... Glass coat layer, 6, 7... Terminal, 8... Good thermal conductive case, 8a... Recess, 9... Resin, 9a... Connector, 10... Spacer, 4a, 4b, 4c...
Trimming section.
Claims (1)
電路と、該第１及び第２の導電路を橋絡するよう
前記基板に印刷形成された所定の温度特性を有す
る温度感知素子層と、該温度感知素子層の露出部
を被覆するガラスコート層と、前記第１及び第２
の導電路の端部に接続された端子と、前記基板を
収納する凹部を有する筒状の良熱伝導性ケースと
、前記凹部に前記基板を埋設する樹脂とを備える
とともに、前記温度感知素子層は抵抗調整のため
のトリミング部を有することを特徴とした温度セ
ンサ。 a substrate, first and second conductive paths formed on the substrate, and a temperature sensing element layer having predetermined temperature characteristics printed on the substrate to bridge the first and second conductive paths. , a glass coat layer that covers the exposed portion of the temperature sensing element layer, and the first and second
a cylindrical good thermally conductive case having a terminal connected to an end of a conductive path, a recess for accommodating the substrate, and a resin for embedding the substrate in the recess; A temperature sensor characterized by having a trimming part for adjusting resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9176489U JPH0330834U (en) | 1989-08-03 | 1989-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9176489U JPH0330834U (en) | 1989-08-03 | 1989-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330834U true JPH0330834U (en) | 1991-03-26 |
Family
ID=31641230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9176489U Pending JPH0330834U (en) | 1989-08-03 | 1989-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330834U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4769956B2 (en) * | 2005-01-13 | 2011-09-07 | ラス アイティーエス コーポレーション | pants |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106159A (en) * | 1980-01-28 | 1981-08-24 | Hitachi Ltd | Production of sensor for detecting flow speed and flow rate |
| JPS56114732A (en) * | 1980-02-15 | 1981-09-09 | Hitachi Ltd | Temperature measuring instrument for sucked air of internal combustion engine |
| JPS5851238B2 (en) * | 1976-10-28 | 1983-11-15 | トヨタ自動車株式会社 | digital car clock |
| JPS63263702A (en) * | 1987-04-22 | 1988-10-31 | 松下電器産業株式会社 | Manufacturing method of platinum thin film temperature sensor |
-
1989
- 1989-08-03 JP JP9176489U patent/JPH0330834U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5851238B2 (en) * | 1976-10-28 | 1983-11-15 | トヨタ自動車株式会社 | digital car clock |
| JPS56106159A (en) * | 1980-01-28 | 1981-08-24 | Hitachi Ltd | Production of sensor for detecting flow speed and flow rate |
| JPS56114732A (en) * | 1980-02-15 | 1981-09-09 | Hitachi Ltd | Temperature measuring instrument for sucked air of internal combustion engine |
| JPS63263702A (en) * | 1987-04-22 | 1988-10-31 | 松下電器産業株式会社 | Manufacturing method of platinum thin film temperature sensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4769956B2 (en) * | 2005-01-13 | 2011-09-07 | ラス アイティーエス コーポレーション | pants |