JPH0332183B2 - - Google Patents
Info
- Publication number
- JPH0332183B2 JPH0332183B2 JP3389586A JP3389586A JPH0332183B2 JP H0332183 B2 JPH0332183 B2 JP H0332183B2 JP 3389586 A JP3389586 A JP 3389586A JP 3389586 A JP3389586 A JP 3389586A JP H0332183 B2 JPH0332183 B2 JP H0332183B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- phosphor bronze
- plating
- peeling
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 16
- 229910000906 Bronze Inorganic materials 0.000 claims description 15
- 239000010974 bronze Substances 0.000 claims description 15
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 description 12
- 206010040844 Skin exfoliation Diseases 0.000 description 10
- 230000004907 flux Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Switches With Compound Operations (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は、錫または錫合金をめつきしたりん青
銅製接触子に関するものであり、特には高温使用
下で秀れた耐剥離性を有するよう錫あるいは錫合
金をりん青銅母材に直接溶融めつきすることによ
つて作製される上記接触子に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a contact made of phosphor bronze plated with tin or a tin alloy. The present invention relates to the above-mentioned contact which is manufactured by directly melting and bonding to a bronze base material.
電子機器には回路接続用のコネクタ接触子が多
数使用されている。コネクタ接触子用の材料とし
てはベリリウム銅、チタン銅、りん青銅等の母材
に表面接点用金属として金、銀等のめつきを施し
たものがあるが、価格や量産性の点から民生用電
子機器用には適切でない。民生用電子機器におい
ては、母材としてりん青銅を用いそして表面接点
用金属として錫または錫合金を電気めつきした接
触子が主に用いられている。 Many connector contacts for circuit connection are used in electronic devices. Materials for connector contacts include base materials such as beryllium copper, titanium copper, and phosphor bronze, which are plated with gold, silver, etc. as surface contact metals, but from the viewpoint of cost and mass production, they are not suitable for consumer use. Not suitable for electronic equipment. In consumer electronic devices, contacts are mainly used in which phosphor bronze is used as the base material and tin or tin alloy is electroplated as the surface contact metal.
ところが、電子機器の内部にこれら接触子を組
込んで使用する場合、機器内部が通電による発熱
のため100℃前後に昇温するから、接触子はこの
ような比較的高温に長時間曝されていることにな
る。加えて、電子機器は、機械的振動を受けるこ
とも多い。こうした使用条件下で、めつきが母材
から剥離し、接触不良となる欠点が認識されてい
た。この高温でのめつき層の剥離は、りん青銅−
すず系の固有の問題である。 However, when these contacts are used inside electronic equipment, the temperature inside the equipment rises to around 100°C due to the heat generated by electricity, so the contacts are exposed to such relatively high temperatures for long periods of time. There will be. Additionally, electronic devices are often subject to mechanical vibrations. It has been recognized that under such usage conditions, the plating peels off from the base material, resulting in poor contact. Peeling of the plating layer at this high temperature is caused by
This is a problem unique to tin-based products.
この剥離の原因については、界面に特別な化合
物が生成する等の意見もあるが、いまだ解明され
ていない。 As for the cause of this peeling, there is an opinion that a special compound is generated at the interface, but it has not yet been elucidated.
剥離防止の対策として、ニツケルの下地めつき
を施すか、2μ以上の厚い銅下地めつきを施す試
みや、銀を含む特別な錫合金を使用する提案もあ
るが、経済性の面等から好ましくない。 As measures to prevent peeling, attempts have been made to apply a nickel underplating or a thick copper underplating of 2μ or more, and there are proposals to use a special tin alloy containing silver, but these are preferable from an economic standpoint. do not have.
本発明者は、錫あるいは錫合金をりん青銅母材
に溶融めつきをすることによつて、、上述した剥
離問題が解決されうることを見出した。 The present inventor has discovered that the above-mentioned peeling problem can be solved by melt-welding tin or a tin alloy to a phosphor bronze base material.
斯くして、本発明は、りん青銅母材と、該母材
上の錫あるいは錫合金溶融めつき皮膜から成る接
点用皮膜とを具備することを特徴とする接触子を
提供する。 Thus, the present invention provides a contact that is characterized by comprising a phosphor bronze base material and a contact coating made of a hot-dipped tin or tin alloy coating on the base material.
本発明においては、りん青銅の条に錫を溶融め
つきした後接触子に成型するのが通例であるが、
りん青銅の条を接触子に成型した後に溶融めつき
することもできる。 In the present invention, it is customary to melt tin on a phosphor bronze strip and then mold it into a contact.
It is also possible to hot-dip the phosphor bronze strips after forming them into contacts.
りん青銅はばね用りん青銅としてJISに規定さ
れる各種のものを包括するものであり、錫３〜10
％およびりん0.03〜0.35％の範囲にある。 Phosphor bronze includes various types of phosphor bronze specified by JIS as phosphor bronze for springs, and includes tin 3 to 10.
% and phosphorus in the range of 0.03-0.35%.
りん青銅条は、アルカル脱脂、電解脱脂、酸
洗、水洗等の所定の浄化処理後、銅下地めつきを
必要に応じ施される。本発明においては、銅下地
めつき無しで錫あるいは錫合金めつき層の剥離を
防止しうるものである。 After the phosphor bronze strip is subjected to a predetermined purification treatment such as alkal degreasing, electrolytic degreasing, pickling, and water washing, it is plated with a copper undercoat as necessary. In the present invention, peeling of the tin or tin alloy plating layer can be prevented without copper underplating.
錫あるいは錫合金のめつきは溶融めつきによつ
て実施される。錫合金としては、一般にはんだ材
料として知られる鉛、ビスマス、カドミウム、ア
ンチモン、インジウム、アルミニウム、亜鉛等を
一種以上含むものを包括するものである。めつき
条件は従来と変ることはない。溶融めつきは、所
定のフラツクス水溶液（ZnCl2の40゜Beの水溶液）
に１〜２秒浸漬後溶融めつき槽に10秒程度浸漬
し、エアーブローによりめつき層の厚さを適宜調
整する所謂溶融めつきが代表的である。フラツク
ス水溶液への浸漬の代りに、フラツクスを溶融め
つき層に浮上させ、そのフラツクス層を通して溶
融めつき層に浸けるようにすることもできる。 Plating of tin or tin alloys is carried out by hot-dip plating. The tin alloy includes those containing one or more of lead, bismuth, cadmium, antimony, indium, aluminum, zinc, etc., which are generally known as solder materials. The plating conditions remain the same as before. For melt plating, use a specified flux aqueous solution (40°Be aqueous solution of ZnCl 2 ).
A typical example is so-called hot-melt plating, in which the plated layer is immersed in water for 1 to 2 seconds, then immersed in a hot-melt plating tank for about 10 seconds, and the thickness of the plated layer is adjusted appropriately by air blowing. Instead of dipping into an aqueous flux solution, the flux may be floated onto the melted layer and immersed through the flux layer into the melted layer.
本発明に従つて作製された接触子は高温下での
使用中にもめつき層の剥離を生じない。例えば、
105℃の温度で600時間保持した後90゜曲げ剥離試
験を行つても剥離は全く生じない。 Contacts made in accordance with the present invention do not suffer from peeling of the plating layer during use at high temperatures. for example,
No peeling occurs even when a 90° bending peel test is performed after holding at a temperature of 105°C for 600 hours.
以下、実施例を述べる。 Examples will be described below.
実施例 １
ばね用りん青銅条をアルカリ脱脂、電解脱脂、
そして酸洗中和後水洗して、40Be塩化亜鉛水溶
液のフラツクスを塗布後320℃における浴温の溶
融錫に浸漬して2μの厚さの錫めつきを施した。Example 1 Phosphor bronze strip for springs was degreased with alkaline, electrolytically degreased,
After pickling and neutralization, the material was washed with water, coated with a flux of 40Be zinc chloride aqueous solution, and then immersed in molten tin at a bath temperature of 320° C. to provide tin plating to a thickness of 2 μm.
その後、接触子に成型後105℃において600時間
保持した後先きと同様に、剥離試験したが、めつ
き層の剥離はいずれも認められなかつた。 Thereafter, after being molded into a contact, it was held at 105°C for 600 hours and then subjected to a peel test in the same manner as before, but no peeling of the plating layer was observed.
実施例 ２
実施例１と同様に前処理したばね用りん青銅条
にフラツクス塗布後300℃の浴温の60％錫−40％
鉛の半田浴に浸漬することにより2μの半田溶融
めつきを行つた。実施例１と同様に剥離試験した
が、めつき層の剥離は生じなかつた。Example 2 After applying flux to a phosphor bronze strip for springs pretreated in the same manner as in Example 1, 60% tin - 40% at a bath temperature of 300°C
2μ solder fusion welding was performed by immersion in a lead solder bath. A peel test was conducted in the same manner as in Example 1, but no peeling of the plated layer occurred.
以上説明したように、本発明は非常に簡単な操
作で従来のりん青銅−錫接触子に見られた高温剥
離問題を解決したものである。 As explained above, the present invention solves the high-temperature peeling problem seen in conventional phosphor bronze-tin contacts with a very simple operation.
Claims (1)
金溶融めつき皮膜から成る接点用皮膜とを具備す
ることを特徴とする接触子。1. A contact comprising a phosphor bronze base material and a contact film made of a tin or tin alloy melt-plated film on the base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3389586A JPS61190876A (en) | 1986-02-20 | 1986-02-20 | Contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3389586A JPS61190876A (en) | 1986-02-20 | 1986-02-20 | Contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61190876A JPS61190876A (en) | 1986-08-25 |
| JPH0332183B2 true JPH0332183B2 (en) | 1991-05-10 |
Family
ID=12399262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3389586A Granted JPS61190876A (en) | 1986-02-20 | 1986-02-20 | Contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190876A (en) |
-
1986
- 1986-02-20 JP JP3389586A patent/JPS61190876A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61190876A (en) | 1986-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3417395B2 (en) | Lead frame for semiconductor device, method of manufacturing the same, and semiconductor device using the same | |
| US6677056B2 (en) | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film | |
| JPS58139493A (en) | Method of producing printed circuit | |
| KR100272682B1 (en) | Soldering method | |
| JPH11229178A (en) | Metal coated member | |
| JPS6019630B2 (en) | contact | |
| JP3229239B2 (en) | Electrodeposition bath | |
| JPH0119000B2 (en) | ||
| JP3402228B2 (en) | Semiconductor device having lead-free tin-based solder coating | |
| JP2684631B2 (en) | Lead wire for capacitor | |
| JPH0586007B2 (en) | ||
| JPS6136596B2 (en) | ||
| JPS61190876A (en) | Contact | |
| JPS61151914A (en) | Contactor | |
| JPH01279582A (en) | Contact | |
| JPH02145794A (en) | Copper or copper alloy material plated with tin or solder reflowed and excellent in thermal peeling resistance | |
| JPS6116430B2 (en) | ||
| JPH0742596B2 (en) | Lead frame plating method | |
| JP3827487B2 (en) | Method for manufacturing long solder coating material | |
| JPS6486417A (en) | Contact and manufacture thereof | |
| JPH01208493A (en) | Production of contact maker | |
| JP2628749B2 (en) | Sn or Sn alloy coating material with excellent heat resistance for electronic and electrical parts | |
| JPH04235292A (en) | Tinned copper alloy material and its manufacture | |
| JPS61231195A (en) | Contact and its production | |
| JPH07300696A (en) | Electroplated tin plating method |