JPH0332443U - - Google Patents

Info

Publication number
JPH0332443U
JPH0332443U JP9190989U JP9190989U JPH0332443U JP H0332443 U JPH0332443 U JP H0332443U JP 9190989 U JP9190989 U JP 9190989U JP 9190989 U JP9190989 U JP 9190989U JP H0332443 U JPH0332443 U JP H0332443U
Authority
JP
Japan
Prior art keywords
circuit board
power element
thermal conductivity
control element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9190989U
Other languages
Japanese (ja)
Other versions
JPH0719167Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989091909U priority Critical patent/JPH0719167Y2/en
Publication of JPH0332443U publication Critical patent/JPH0332443U/ja
Application granted granted Critical
Publication of JPH0719167Y2 publication Critical patent/JPH0719167Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す半導体装置の
横断面図、第２図は同じくその縦断面図、第３，
４図は半導体装置の縦断面図、第５図は半導体装
置の電気回路を示す図である。 １１……電力素子、１２……制御素子、１３…
…第一回路基板、１４……第二回路基板。 FIG. 1 is a cross-sectional view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view thereof, and FIG.
FIG. 4 is a longitudinal sectional view of the semiconductor device, and FIG. 5 is a diagram showing an electric circuit of the semiconductor device. 11... Power element, 12... Control element, 13...
...first circuit board, 14...second circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高熱を発する電力素子と、該電力素子を制御す
る制御素子とが設けられ、前記電力素子が第一回
路基板に搭載され、前記制御素子が第二回路基板
に搭載され、前記第一回路基板は、高熱伝導性材
料から構成され、前記第二回路基板は、低熱伝導
性材料から構成されたことを特徴とする半導体装
置。 A power element that generates high heat and a control element that controls the power element are provided, the power element is mounted on a first circuit board, the control element is mounted on a second circuit board, and the first circuit board is mounted on a second circuit board. . A semiconductor device, characterized in that the second circuit board is made of a material with high thermal conductivity, and the second circuit board is made of a material with low thermal conductivity.
JP1989091909U 1989-08-03 1989-08-03 Semiconductor device Expired - Lifetime JPH0719167Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989091909U JPH0719167Y2 (en) 1989-08-03 1989-08-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989091909U JPH0719167Y2 (en) 1989-08-03 1989-08-03 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0332443U true JPH0332443U (en) 1991-03-29
JPH0719167Y2 JPH0719167Y2 (en) 1995-05-01

Family

ID=31641368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989091909U Expired - Lifetime JPH0719167Y2 (en) 1989-08-03 1989-08-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0719167Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02291160A (en) * 1989-04-28 1990-11-30 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02291160A (en) * 1989-04-28 1990-11-30 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0719167Y2 (en) 1995-05-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term