JPH0332974U - - Google Patents

Info

Publication number
JPH0332974U
JPH0332974U JP8904789U JP8904789U JPH0332974U JP H0332974 U JPH0332974 U JP H0332974U JP 8904789 U JP8904789 U JP 8904789U JP 8904789 U JP8904789 U JP 8904789U JP H0332974 U JPH0332974 U JP H0332974U
Authority
JP
Japan
Prior art keywords
processing tank
vacuum
vacuum processing
concentration meter
microwave oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8904789U
Other languages
Japanese (ja)
Other versions
JPH0717421Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8904789U priority Critical patent/JPH0717421Y2/en
Publication of JPH0332974U publication Critical patent/JPH0332974U/ja
Application granted granted Critical
Publication of JPH0717421Y2 publication Critical patent/JPH0717421Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるプラズマ処理装置の好ま
しい一例を示した略示フローシート、第2図はH
C測定濃度と塗膜付着の関係を示したグラフ、第
3図は単位時間濃度と塗膜付着の関係を示したグ
ラフ、そして、第4図は濃度オーバー時の処理パ
ターンを示したグラフである。 図中、1……真空処理槽、2……被処理物、3
……マイクロ波発振器、4……マイクロ波導波管
、5……プラズマ発生部、6……プラズマ輸送管
、7……シヤワー管、8……真空ポンプ、8……
配管、10……炭化水素濃度計、11……炭化水
素センサ、12……制御装置、そして13及び1
4……指示回路である。
FIG. 1 is a schematic flow sheet showing a preferred example of the plasma processing apparatus according to the present invention, and FIG.
C A graph showing the relationship between measured concentration and paint film adhesion, Figure 3 is a graph showing the relationship between unit time concentration and paint film adhesion, and Figure 4 is a graph showing the processing pattern when the concentration is exceeded. . In the figure, 1...vacuum processing tank, 2...workpiece, 3
...Microwave oscillator, 4...Microwave waveguide, 5...Plasma generation section, 6...Plasma transport tube, 7...Shower tube, 8...Vacuum pump, 8...
Piping, 10...hydrocarbon concentration meter, 11...hydrocarbon sensor, 12...control device, and 13 and 1
4...This is an instruction circuit.

Claims (1)

【実用新案登録請求の範囲】 合成樹脂材料からなる被処理物を有機溶剤蒸気
で洗浄した後であつて塗装を行う前にプラズマ処
理するための装置であつて、下記の手段: プラズマ処理を行う真空処理槽、 プラズマ発生部を介して真空処理槽に連通した
マイクロ波発振器、 真空処理槽に接続された真空ポンプ、 真空処理槽内かもしくはその真空排気系内に配
置された炭化水素センサを装備した炭化水素濃度
計、そして 炭化水素濃度計の出力信号を処理しかつ適正化
された駆動信号を真空ポンプ及び/又はマイクロ
波発振器に入力する制御装置、 を含んでなることを特徴とするプラズマ処理装
置。
[Scope of Claim for Utility Model Registration] An apparatus for subjecting a workpiece made of a synthetic resin material to plasma treatment after cleaning it with organic solvent vapor and before painting, which performs the following means: Plasma treatment. Equipped with a vacuum processing tank, a microwave oscillator connected to the vacuum processing tank via a plasma generator, a vacuum pump connected to the vacuum processing tank, and a hydrocarbon sensor placed within the vacuum processing tank or its vacuum evacuation system. a hydrocarbon concentration meter, and a control device that processes the output signal of the hydrocarbon concentration meter and inputs an optimized drive signal to a vacuum pump and/or a microwave oscillator. Device.
JP8904789U 1989-07-31 1989-07-31 Plasma processing device Expired - Fee Related JPH0717421Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8904789U JPH0717421Y2 (en) 1989-07-31 1989-07-31 Plasma processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8904789U JPH0717421Y2 (en) 1989-07-31 1989-07-31 Plasma processing device

Publications (2)

Publication Number Publication Date
JPH0332974U true JPH0332974U (en) 1991-03-29
JPH0717421Y2 JPH0717421Y2 (en) 1995-04-26

Family

ID=31638639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8904789U Expired - Fee Related JPH0717421Y2 (en) 1989-07-31 1989-07-31 Plasma processing device

Country Status (1)

Country Link
JP (1) JPH0717421Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000073029A (en) * 1998-08-26 2000-03-07 Nitto Denko Corp Adhesive member and method of manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660702B2 (en) * 2005-05-19 2011-03-30 国立大学法人名古屋大学 Injection molding apparatus with plasma generator, injection molding and surface treatment method
JP4669522B2 (en) * 2008-01-08 2011-04-13 セイコーエプソン株式会社 Coloring structure manufacturing apparatus and manufacturing method of coloring structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000073029A (en) * 1998-08-26 2000-03-07 Nitto Denko Corp Adhesive member and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0717421Y2 (en) 1995-04-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees