JPH0333215B2 - - Google Patents
Info
- Publication number
- JPH0333215B2 JPH0333215B2 JP16172484A JP16172484A JPH0333215B2 JP H0333215 B2 JPH0333215 B2 JP H0333215B2 JP 16172484 A JP16172484 A JP 16172484A JP 16172484 A JP16172484 A JP 16172484A JP H0333215 B2 JPH0333215 B2 JP H0333215B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- film
- heat flow
- sensitive
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
- G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat-transmission coefficient
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は室内暖冷房装置などの熱源の発熱量を
制御するシステムに利用される熱流センサ、すな
わち熱流を検出するセンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat flow sensor used in a system for controlling the amount of heat generated by a heat source such as an indoor heating/cooling device, that is, a sensor that detects heat flow.
従来例の構成とその問題点
従来の熱流センサの構成を第１図に示す。同セ
ンサは熱抵抗体１の表裏にサーモパイル２を組み
込み、さらに熱抵抗体１の温度測定用熱電対３を
付加して構成される。熱流センサが放熱面４に設
置されたとき、熱抵抗体１の表裏に温度差△Ｔが
生じる。熱抵抗体１の熱伝導率をλ、厚さをｄと
すれば、熱流Ｑは原理的にＱ＝（λ／ｄ）△Ｔに
よつて求められる。Configuration of a conventional example and its problems The configuration of a conventional heat flow sensor is shown in Fig. 1. The sensor is constructed by incorporating thermopiles 2 on the front and back sides of a thermal resistor 1, and further adding a thermocouple 3 for measuring the temperature of the thermal resistor 1. When the heat flow sensor is installed on the heat radiation surface 4, a temperature difference ΔT occurs between the front and back surfaces of the thermal resistor 1. If the thermal conductivity of the thermal resistor 1 is λ and the thickness is d, the heat flow Q can be theoretically determined by Q=(λ/d)ΔT.
このように従来の熱流センサでは、サーモパイ
ル２（熱電対を複数個直列に接続したもの）およ
び温度測定用熱電対３が用いられているが、熱電
対の熱起電力は１℃あたり１〜10μVと小さな値
である。このように従来のものは熱流の検出感度
が小さく、また、このために起電力の検出回路が
複数で高価であるなどの問題があつた。 In this way, conventional heat flow sensors use a thermopile 2 (a plurality of thermocouples connected in series) and a thermocouple 3 for temperature measurement, but the thermoelectromotive force of the thermocouple is 1 to 10 μV per 1°C. This is a small value. As described above, the conventional devices have problems such as low heat flow detection sensitivity and the need for multiple electromotive force detection circuits, which are expensive.
発明の目的
本発明は熱流の検出感度が大きく、かつ構成が
簡単で安価な熱流センサを提供することを目的と
する。OBJECTS OF THE INVENTION An object of the present invention is to provide a heat flow sensor that has high heat flow detection sensitivity, has a simple configuration, and is inexpensive.
発明の構成
本発明の熱流センサは感湿性平板状セラミツク
基板とこの感湿性平板状セラミツク基板の互いに
平行な２つの表面に形成された感温抵抗体膜、電
極膜とから構成される。Structure of the Invention The heat flow sensor of the present invention is composed of a moisture-sensitive flat ceramic substrate, and a temperature-sensitive resistor film and an electrode film formed on two mutually parallel surfaces of the moisture-sensitive flat ceramic substrate.
感湿性平板状セラミツク基板は感温抵抗体膜と
電極膜とを保持する基板として作用するとともに
熱抵抗体としても作用する。この熱抵抗体の表裏
の温度差は感温抵抗体膜の抵抗値によつて検出さ
れる。感温抵抗体膜の抵抗値は１℃あたり１〜10
％の割合で変化するので、熱流を感度よく検出で
きる。 The moisture-sensitive flat ceramic substrate functions as a substrate for holding the temperature-sensitive resistor film and the electrode film, and also functions as a thermal resistor. The temperature difference between the front and back sides of this thermal resistor is detected by the resistance value of the temperature-sensitive resistor film. The resistance value of the temperature sensitive resistor film is 1 to 10 per ℃
%, so heat flow can be detected with high sensitivity.
実施例の説明
本発明の一実施例を第２図に示す。熱抵抗体と
しての感湿性平板状セラミツク基板５の互いに平
行な２つの表面５１，５１′に感温抵抗体膜６，
６′と電極膜７，７′を形成した。感湿性平板状セ
ラミツク基板５としてマグネシウムクロメイトな
どの多孔質セラミツクを用い、感温抵抗体膜６，
６′としてFe、Co、Mnなどの複合酸化物、SiC、
Ge、Siなどの厚膜抵抗体あるいは薄膜抵抗体を
用い、電極膜７，７′として厚膜電極膜あるいは
薄膜電極膜を用いる。電極膜７，７′にはリード
線８，８′が接続される。DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention is shown in FIG. Temperature-sensitive resistor films 6,
6' and electrode films 7, 7' were formed. A porous ceramic such as magnesium chromate is used as the moisture-sensitive flat ceramic substrate 5, and a temperature-sensitive resistor film 6,
As 6', composite oxides such as Fe, Co, and Mn, SiC,
A thick film resistor or a thin film resistor such as Ge or Si is used, and a thick film electrode film or a thin film electrode film is used as the electrode films 7 and 7'. Lead wires 8, 8' are connected to the electrode films 7, 7'.
このようにして形成された熱流センサにおいて
感温抵抗体膜６と感温抵抗体膜６′との間に１℃
の温度差が生じたとき、両者の抵抗値には約６％
（感湿性平板状セラミツク基板５の温度は約30℃）
の差が観測された。両者の抵抗値の差は、感湿性
平板状セラミツク基板５の温度が上昇すると、低
下する傾向を示すが、感湿性平板状セラミツク基
板５が約230℃になつてもこの抵抗値の差は約2.5
％を示した。このように本発明の熱流センサは、
熱抵抗体、すなわち感湿性平板状セラミツク基板
５の表裏の温度差を高感度で検出できるので、熱
流の検出感度が大きく、また、その検出回路も簡
単で安価となる。 In the heat flow sensor formed in this manner, there is a temperature of 1° C. between the temperature sensitive resistor film 6 and the temperature sensitive resistor film 6'.
When there is a temperature difference of approximately 6% in the resistance value of both
(The temperature of the moisture-sensitive flat ceramic substrate 5 is approximately 30°C)
difference was observed. The difference in resistance value between the two tends to decrease as the temperature of the moisture-sensitive flat ceramic substrate 5 increases, but even when the temperature of the moisture-sensitive flat ceramic substrate 5 reaches approximately 230°C, this difference in resistance value remains approximately. 2.5
%showed that. In this way, the heat flow sensor of the present invention
Since the temperature difference between the front and back sides of the thermal resistor, that is, the moisture-sensitive flat ceramic substrate 5, can be detected with high sensitivity, the detection sensitivity of heat flow is high, and the detection circuit thereof is also simple and inexpensive.
また、本発明の熱流センサは、感湿性平板状セ
ラミツク基板５の表裏に電極膜７，７′が形成さ
れているので、電極膜７と電極膜７′との間の感
湿性平板状セラミツク基板５の湿度抵抗をも同時
に測定できる。この湿度抵抗は雰囲気の湿度に応
じて変化するので、本発明の熱流センサは湿度抵
抗によつて雰囲気の湿度をも検出できる。 Further, in the heat flow sensor of the present invention, since the electrode films 7 and 7' are formed on the front and back surfaces of the moisture-sensitive flat ceramic substrate 5, the moisture-sensitive flat ceramic substrate 5 is formed between the electrode films 7 and 7'. 5 humidity resistance can also be measured at the same time. Since this humidity resistance changes depending on the humidity of the atmosphere, the heat flow sensor of the present invention can also detect the humidity of the atmosphere using the humidity resistance.
湿度抵抗を測定するには、感温抵抗体６，６′
および電極膜７，７′が厚膜抵抗体、厚膜電極膜
で構成されることが望ましい。その理由は、厚膜
抵抗体、厚膜電極膜は導電性粒子、硝子粉末およ
び溶剤で構成されたペーストを印刷、焼成して形
成されるので、溶剤の蒸発により多孔質厚膜が形
成され、この多孔質のために水分子が厚膜抵抗
体、厚膜電極膜を透過し易すくなり、したがつ
て、感湿性平板状セラミツク基板５の湿度抵抗を
高感度で測定できるようになるからである。 To measure humidity resistance, use temperature-sensitive resistors 6, 6'
It is also desirable that the electrode films 7 and 7' be composed of a thick film resistor and a thick film electrode film. The reason for this is that thick film resistors and thick film electrode films are formed by printing and firing a paste composed of conductive particles, glass powder, and a solvent, so a porous thick film is formed by the evaporation of the solvent. This porosity makes it easier for water molecules to pass through the thick film resistor and thick film electrode film, making it possible to measure the humidity resistance of the moisture-sensitive flat ceramic substrate 5 with high sensitivity. be.
発明の効果
本発明の熱流センサによれば次の効果が得られ
る。Effects of the Invention According to the heat flow sensor of the present invention, the following effects can be obtained.
(1) 熱抵抗体としての感湿性平板状セラミツク基
板の表裏の温度差の検出に感温抵抗体膜を用い
ているので、温度差を高感度で検出できる。し
たがつて、熱流の検出感度が大きく、また検出
回路も簡単で安価になる。(1) Temperature-sensitive resistor films are used to detect temperature differences between the front and back sides of a moisture-sensitive flat ceramic substrate as a thermal resistor, so temperature differences can be detected with high sensitivity. Therefore, the heat flow detection sensitivity is high, and the detection circuit is simple and inexpensive.
(2) 感湿性平板状セラミツク基板の表裏に電極膜
が形成されているので、電極膜の間の感湿性平
板状セラミツク基板の湿度抵抗を測定すること
により雰囲気の湿度をも熱流と同時に検出でき
る。(2) Since electrode films are formed on the front and back sides of the moisture-sensitive flat ceramic substrate, atmospheric humidity can be detected at the same time as heat flow by measuring the humidity resistance of the moisture-sensitive flat ceramic substrate between the electrode films. .
第１図は従来の熱流センサの構成を示す断面
図、第２図は本発明の熱流センサの実施例の構成
を示す断面図である。
５……感湿性平板状セラミツク基板、５１，５
１′……感湿性平板状セラミツク基板の互いに平
行な２つの表面、６，６′……感温抵抗体膜、７，
７′……電極膜、８，８′……リード線。
FIG. 1 is a sectional view showing the structure of a conventional heat flow sensor, and FIG. 2 is a sectional view showing the structure of an embodiment of the heat flow sensor of the present invention. 5...Moisture-sensitive flat ceramic substrate, 51,5
1'... Two mutually parallel surfaces of a moisture-sensitive flat ceramic substrate, 6, 6'... Temperature-sensitive resistor film, 7,
7'... Electrode film, 8, 8'... Lead wire.
Claims (1)
板状セラミツク基板の互いに平行な２つの表面に
形成された感温抵抗体膜、電極膜とからなる熱流
センサ。 ２ 感温抵抗体膜と電極膜とが厚膜抵抗体、厚膜
電極膜とで構成された特許請求の範囲第１項記載
の熱流センサ。[Scope of Claims] 1. A heat flow sensor comprising a moisture-sensitive flat ceramic substrate and a temperature-sensitive resistor film and an electrode film formed on two mutually parallel surfaces of the moisture-sensitive flat ceramic substrate. 2. The heat flow sensor according to claim 1, wherein the temperature sensitive resistor film and the electrode film are composed of a thick film resistor and a thick film electrode film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16172484A JPS6138534A (en) | 1984-07-31 | 1984-07-31 | Heat flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16172484A JPS6138534A (en) | 1984-07-31 | 1984-07-31 | Heat flow sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6138534A JPS6138534A (en) | 1986-02-24 |
| JPH0333215B2 true JPH0333215B2 (en) | 1991-05-16 |
Family
ID=15740673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16172484A Granted JPS6138534A (en) | 1984-07-31 | 1984-07-31 | Heat flow sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138534A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0781546A1 (en) | 1995-12-26 | 1997-07-02 | Sanwa Kagaku Kenkyusho Co., Ltd. | A multi-layered film preparation |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03123239U (en) * | 1990-03-29 | 1991-12-16 | ||
| US5356216A (en) * | 1993-05-03 | 1994-10-18 | Industrial Technology Research Institute | Apparatus for measuring heat of circuit module |
| CN106768493B (en) * | 2016-12-04 | 2019-06-18 | 中国科学院工程热物理研究所 | A series powered thin film thermal resistance heat flow sensor |
-
1984
- 1984-07-31 JP JP16172484A patent/JPS6138534A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0781546A1 (en) | 1995-12-26 | 1997-07-02 | Sanwa Kagaku Kenkyusho Co., Ltd. | A multi-layered film preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6138534A (en) | 1986-02-24 |
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