JPH0334865B2 - - Google Patents
Info
- Publication number
- JPH0334865B2 JPH0334865B2 JP27307285A JP27307285A JPH0334865B2 JP H0334865 B2 JPH0334865 B2 JP H0334865B2 JP 27307285 A JP27307285 A JP 27307285A JP 27307285 A JP27307285 A JP 27307285A JP H0334865 B2 JPH0334865 B2 JP H0334865B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- solder
- semiconductor element
- heat
- detaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔概要〕
本発明のヒートシンク着脱方法は、半導体素子
の熱を奪うため通常は低温度に冷却されているヒ
ートシンクが、ヒートシンク着脱時には逆に高温
度に加熱され、その熱によつて半導体素子とヒー
トシンクとを接合しているハンダ（熱伝導媒体）
を溶融させる構成になつている。[Detailed Description of the Invention] [Summary] In the heat sink attachment/detachment method of the present invention, the heat sink, which is normally cooled to a low temperature to remove heat from a semiconductor element, is heated to a high temperature when the heat sink is attached/detached, and the heat sink is Solder (thermal conductive medium) that connects the semiconductor element and heat sink by
It is designed to melt.
本発明は大型電算機等に装備される半導体素子
冷却方法の改良に係り、特に熱伝導媒体としてハ
ンダが用いられている冷却機構におけるヒートシ
ンク着脱方法に関する。
The present invention relates to an improvement in a method for cooling a semiconductor device installed in a large-sized computer or the like, and particularly to a method for attaching and detaching a heat sink in a cooling mechanism that uses solder as a heat conductive medium.
第３図は熱伝導媒体としてハンダを用いる従来
の半導体素子冷却機構の構成を示す要部側断面図
である。
FIG. 3 is a sectional side view of a main part showing the configuration of a conventional semiconductor device cooling mechanism using solder as a heat transfer medium.
同図に示すように、半導体素子冷却機構は、冷
媒通路５上に配設されたヒートシンク６と基板１
０に実装された半導体素子１とがハンダ２で接合
された構造となつている。そして半導体素子１
は、該ハンダ２およびヒートシンク６を介して冷
媒通路５内を流動する冷媒液４に熱を奪われて冷
却される。 As shown in the figure, the semiconductor device cooling mechanism includes a heat sink 6 disposed on a coolant passage 5 and a substrate 1.
The semiconductor element 1 mounted on the semiconductor element 1 is bonded to the semiconductor element 1 with solder 2. and semiconductor element 1
The refrigerant liquid 4 flowing through the refrigerant passage 5 removes heat through the solder 2 and the heat sink 6 and is cooled.
上記で明らかなように、本冷却機構では前記ハ
ンダ２を熱伝導媒として用いている。 As is clear from the above, this cooling mechanism uses the solder 2 as a heat transfer medium.
従つて本冷却機構と半導体素子１とを分離す
る、つまりヒートシンク６の着脱を行うために
は、先ず該ハンダ２を溶融させる必要がある。 Therefore, in order to separate the cooling mechanism and the semiconductor element 1, that is, to attach and detach the heat sink 6, it is first necessary to melt the solder 2.
従来はハンダ２を溶融するための手段として、
例えば下記の方法が用いられていた。 Conventionally, as a means for melting solder 2,
For example, the following method was used.
半導体素子１が実装された基板１０と冷却機
構とを加熱槽に収容して雰囲気温度を上げ、ハ
ンダ２を溶融させる。 The substrate 10 on which the semiconductor element 1 is mounted and the cooling mechanism are housed in a heating tank, the ambient temperature is raised, and the solder 2 is melted.
半導体素子１の配設数と同数のハンダ鏝を使
用してハンダ２を加熱溶融させる。 The solder 2 is heated and melted using the same number of soldering irons as the number of semiconductor elements 1 disposed.
しかしながら、上記方法中、の方法は、半導
体素子が実装された基板と冷却機構とを同時に加
熱槽に収容して加熱を行うので大型の加熱槽を必
要とする上、該加熱槽内においてヒートシンクの
着脱操作を行う必要がある（加熱槽外ではハンダ
が固まつた着脱操作が不可能）ため、作業効率面
で特に問題がある。またの方法は、散在する半
導体素子上のハンダを同時に溶融させるという技
術的な問題がある。
However, in the above method, the substrate on which the semiconductor element is mounted and the cooling mechanism are placed in a heating tank and heated at the same time, so a large heating tank is required, and a heat sink is not installed in the heating tank. Since it is necessary to perform attachment and detachment operations (attachment and detachment operations are impossible outside the heating tank when the solder has solidified), there is a particular problem in terms of work efficiency. Another method has the technical problem of simultaneously melting solder on scattered semiconductor elements.
本発明はこのような従来の問題点を解決して、
ヒートシンクの着脱作業を効率化するためになさ
れたものである。 The present invention solves these conventional problems and
This was done to make the work of attaching and detaching the heat sink more efficient.
本発明は第１図の実施例および第２図の変形例
に示すように、ヒートシンク着脱時にはヒートシ
ンク６の温度を上昇させ、高温度になつた該ヒー
トシンク６の熱によつて熱伝導媒体であるハンダ
２を溶融させるようにしている。
As shown in the embodiment shown in FIG. 1 and the modified example shown in FIG. 2, the present invention increases the temperature of the heat sink 6 when the heat sink is attached or removed, and uses the heat of the heat sink 6 that has reached a high temperature to act as a heat conduction medium. The solder 2 is melted.
このような手段を用いるヒートシンク着脱方法
においては、半導体素子１の配設数や配設位置と
は無関係に、ヒートシンク６と半導体素子１とを
接合しているハンダ２を簡単且つ的確に溶融する
ことが可能となる。
In the heat sink attachment/detachment method using such means, it is possible to easily and accurately melt the solder 2 that joins the heat sink 6 and the semiconductor element 1, regardless of the number of semiconductor elements 1 and the position thereof. becomes possible.
以下図面に示した実施例に基づいて本発明を詳
細に説明する。
The present invention will be described in detail below based on embodiments shown in the drawings.
第１図および第２図は本発明のヒートシンク着
脱方法の一実施例と一変形例とを示す要部側断面
図であるが、前記第３図と同一部分には同一符号
を付している。 1 and 2 are side sectional views of main parts showing an embodiment and a modified example of the heat sink attachment/detachment method of the present invention, and the same parts as in FIG. 3 are given the same reference numerals. .
第１図に示す実施例は、通常時にはヒートシン
ク６を冷却するための冷媒液４が循環している冷
媒通路５に、ヒートシンク着脱時には高温液体８
を流してヒートシンク６の温度を逆に上昇させ、
該ヒートシンク６の熱によつてハンダ２を溶融さ
せるようにしている。 In the embodiment shown in FIG. 1, a refrigerant passage 5 in which a refrigerant liquid 4 for cooling the heat sink 6 circulates during normal operation, and a high-temperature liquid 8 when the heat sink is attached or removed.
The temperature of the heat sink 6 is increased by flowing
The solder 2 is melted by the heat of the heat sink 6.
なお高温液体８は、例えば“熱湯”であつても
良いが、この時のハンダ２は、90〜100℃で溶融
する低融点ハンダ（通常の錫−鉛ハンダに例えば
ビスマス等を添加して溶融温度を低下させたハン
ダで、溶融温度は添加物の量によつて調整され
る）が用いられる。 Note that the high-temperature liquid 8 may be, for example, "hot water," but the solder 2 at this time is a low-melting point solder that melts at 90 to 100 °C (normal tin-lead solder with the addition of bismuth, etc.). A lower temperature solder (melting temperature adjusted by the amount of additives) is used.
第２図に示す変形例は、ヒートシンク６の温度
を上昇させるための手段として、ヒートシンク自
身が加熱用ヒータ７を装備している。 In the modification shown in FIG. 2, the heat sink itself is equipped with a heater 7 as a means for increasing the temperature of the heat sink 6.
第２図の変形例の場合も、第１図の実施例の場
合と同様に、先ず冷媒通路５内の冷媒４を抜き去
つた後、加熱用ヒータ７に通電を行つてヒートシ
ンク６を加熱してハンダ２を溶融させる。 In the case of the modified example shown in FIG. 2, as in the case of the embodiment shown in FIG. to melt solder 2.
本発明は以上説明したように、ヒートシンクと
半導体素子とを接合しているハンダが、ヒートシ
ンクの温度を上昇させるといつた単純な手段によ
つて簡単且つ確実に溶融し得る利点がある。
As explained above, the present invention has the advantage that the solder joining the heat sink and the semiconductor element can be easily and reliably melted by a simple means such as increasing the temperature of the heat sink.
従つて本発明を適用すれば、半導体冷却装置の
ヒートシンク着脱作業が著しく効率化される。 Therefore, if the present invention is applied, the work of attaching and detaching a heat sink to a semiconductor cooling device can be made significantly more efficient.
第１図および第２図は、本発明のヒートシンク
着脱方法の一実施例と一変形例とを示す要部側断
面図、第３図は従来の半導体素子冷却機構の構成
を示す要部側断面図である。
図中、１は半導体素子、２はハンダ、４は冷媒
液、５は冷媒通路、６はヒートシンク、７は加熱
用ヒータ、８は高温液体、１０は基板をそれぞれ
示す。
1 and 2 are side cross-sectional views of essential parts showing an embodiment and a modified example of the heat sink attachment/detachment method of the present invention, and FIG. 3 is a side cross-sectional view of essential parts showing the configuration of a conventional semiconductor element cooling mechanism. It is a diagram. In the figure, 1 is a semiconductor element, 2 is solder, 4 is a refrigerant liquid, 5 is a refrigerant passage, 6 is a heat sink, 7 is a heater, 8 is a high temperature liquid, and 10 is a substrate.
Claims (1)
ヒートシンク６とをハンダ２で接合し、該ハンダ
２を熱伝導媒体として前記半導体素子１の冷却を
行うよう構成されてなる冷却装置のヒートシンク
着脱方法であつて、 半導体素子１の冷却時には冷媒液４を流通させ
る前記冷媒通路５に、ヒートシンク６の着脱時の
み高温液体８を流通させ、該高温液体８に触れて
温度上昇したヒートシンク６によつて前記ハンダ
２を溶融させるようにしたことを特徴とするヒー
トシンク着脱方法。 ２ 前記ヒートシンク６は、加熱用ヒータ７を内
蔵してなることを特徴とする特許請求の範囲第１
項に記載のヒートシンク着脱方法。[Scope of Claims] 1. A semiconductor element 1 and a heat sink 6 disposed on a coolant passage 5 are joined with solder 2, and the semiconductor element 1 is cooled using the solder 2 as a heat conduction medium. A method for attaching and detaching a heat sink in a cooling device comprising: passing a high temperature liquid 8 through the coolant passage 5 through which a coolant liquid 4 flows when cooling a semiconductor element 1 only when attaching or detaching a heat sink 6; A method for attaching and detaching a heat sink, characterized in that the solder 2 is melted by the heat sink 6 whose temperature has increased. 2. Claim 1, wherein the heat sink 6 has a built-in heater 7.
How to attach and detach the heat sink as described in section.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27307285A JPS62131551A (en) | 1985-12-03 | 1985-12-03 | Heat-sink attaching and detaching method |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| DE86307669T DE3688962T2 (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit arrangement. |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27307285A JPS62131551A (en) | 1985-12-03 | 1985-12-03 | Heat-sink attaching and detaching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131551A JPS62131551A (en) | 1987-06-13 |
| JPH0334865B2 true JPH0334865B2 (en) | 1991-05-24 |
Family
ID=17522751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27307285A Granted JPS62131551A (en) | 1985-10-04 | 1985-12-03 | Heat-sink attaching and detaching method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131551A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4640170B2 (en) * | 2005-12-28 | 2011-03-02 | 株式会社豊田自動織機 | Soldering method, semiconductor module manufacturing method, and soldering apparatus |
| CN115992968B (en) * | 2023-03-10 | 2025-08-22 | 上海瞳亮科技有限责任公司 | Phase change heat storage heater and use method |
-
1985
- 1985-12-03 JP JP27307285A patent/JPS62131551A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131551A (en) | 1987-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |