JPH0336219U - - Google Patents

Info

Publication number
JPH0336219U
JPH0336219U JP1989096846U JP9684689U JPH0336219U JP H0336219 U JPH0336219 U JP H0336219U JP 1989096846 U JP1989096846 U JP 1989096846U JP 9684689 U JP9684689 U JP 9684689U JP H0336219 U JPH0336219 U JP H0336219U
Authority
JP
Japan
Prior art keywords
piezoelectric substrate
wave device
surface wave
comb
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989096846U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989096846U priority Critical patent/JPH0336219U/ja
Publication of JPH0336219U publication Critical patent/JPH0336219U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係る表面波デバイスの平面
図、第２図乃至第４図は同上における圧電基板の
端部傾斜面の異なつた例を示す正面図、第５図は
従来の表面波デバイスの平面図、第６図は同上の
正面図、第７図は従来の表面波デバイスの他の例
を示す正面図、第８図は同上の正面図である。 １１……圧電基板、１２，１３……櫛歯電極、
１８……傾斜面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 圧電基板の表面に複数の櫛歯状電極を形成した
    表面波デバイスにおいて、圧電基板の両端面を傾
    斜面としたことを特徴とする表面波デバイス。
JP1989096846U 1989-08-18 1989-08-18 Pending JPH0336219U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989096846U JPH0336219U (ja) 1989-08-18 1989-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989096846U JPH0336219U (ja) 1989-08-18 1989-08-18

Publications (1)

Publication Number Publication Date
JPH0336219U true JPH0336219U (ja) 1991-04-09

Family

ID=31646027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989096846U Pending JPH0336219U (ja) 1989-08-18 1989-08-18

Country Status (1)

Country Link
JP (1) JPH0336219U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7397327B2 (en) 2004-04-08 2008-07-08 Murata Manufacturing Co., Ltd. Surface acoustic wave filter and method of producing the same
WO2008114490A1 (ja) * 2007-03-16 2008-09-25 Panasonic Corporation 弾性表面波デバイス
JP2012080188A (ja) * 2010-09-30 2012-04-19 Kyocera Corp 弾性波装置およびその製造方法
JP2020043442A (ja) * 2018-09-10 2020-03-19 太陽誘電株式会社 弾性波デバイス
WO2026004184A1 (ja) * 2024-06-27 2026-01-02 京セラ株式会社 弾性波装置、通信装置、圧電基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7397327B2 (en) 2004-04-08 2008-07-08 Murata Manufacturing Co., Ltd. Surface acoustic wave filter and method of producing the same
EP1734654A4 (en) * 2004-04-08 2009-12-23 Murata Manufacturing Co SURFACE WAVE FILTER AND MANUFACTURING METHOD THEREFOR
WO2008114490A1 (ja) * 2007-03-16 2008-09-25 Panasonic Corporation 弾性表面波デバイス
JP2012080188A (ja) * 2010-09-30 2012-04-19 Kyocera Corp 弾性波装置およびその製造方法
JP2020043442A (ja) * 2018-09-10 2020-03-19 太陽誘電株式会社 弾性波デバイス
WO2026004184A1 (ja) * 2024-06-27 2026-01-02 京セラ株式会社 弾性波装置、通信装置、圧電基板
JP2026008700A (ja) * 2024-06-27 2026-01-19 京セラ株式会社 弾性波装置、通信装置、圧電基板
JP2026008701A (ja) * 2024-06-27 2026-01-19 京セラ株式会社 弾性波装置、通信装置、圧電基板

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