JPH0336761U - - Google Patents
Info
- Publication number
- JPH0336761U JPH0336761U JP3640789U JP3640789U JPH0336761U JP H0336761 U JPH0336761 U JP H0336761U JP 3640789 U JP3640789 U JP 3640789U JP 3640789 U JP3640789 U JP 3640789U JP H0336761 U JPH0336761 U JP H0336761U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- main body
- measuring element
- sizing device
- biasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004513 sizing Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１図は、本考案の第１の実施例を示す平面研
削盤の自動定寸装置の正面断面図である。第２図
は、第２の実施例を示す平面研削盤の自動定寸装
置の正面断面図である。
１……本体、２……接触子、３……測定子、４
，５……ばね、６……近接センサ、１２……ドツ
グ。
FIG. 1 is a front sectional view of an automatic sizing device for a surface grinder showing a first embodiment of the present invention. FIG. 2 is a front sectional view of an automatic sizing device for a surface grinder showing a second embodiment. 1...Main body, 2...Contact element, 3...Measuring element, 4
, 5... Spring, 6... Proximity sensor, 12... Dog.
Claims (1)
子と、上記接触子の移動方向と平行な方向に移動
自在の測定子と、接触子と測定子をそれぞれ付勢
する手段と、接触子と測定子の相対位置を検出す
る検出手段とからなることを特徴とする平面切削
盤の自動定寸装置。 a main body, a contact movably supported by the main body, a measuring element movable in a direction parallel to the moving direction of the contact, means for biasing the contact and the measuring element, respectively; An automatic sizing device for a plane cutting machine, comprising a detection means for detecting the relative position of a contact point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3640789U JPH0336761U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3640789U JPH0336761U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336761U true JPH0336761U (en) | 1991-04-10 |
Family
ID=31542609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3640789U Pending JPH0336761U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336761U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006334276A (en) * | 2005-06-06 | 2006-12-14 | Reiko Fujita | Toothbrush device |
| JP2007222986A (en) * | 2006-02-23 | 2007-09-06 | Disco Abrasive Syst Ltd | Grinding equipment |
| JP2010167532A (en) * | 2009-01-22 | 2010-08-05 | Disco Abrasive Syst Ltd | Method for confirming reference position of chuck table of grinder |
| JP2015102365A (en) * | 2013-11-22 | 2015-06-04 | 株式会社ディスコ | Workpiece thickness measuring instrument |
| JP2018027597A (en) * | 2016-08-18 | 2018-02-22 | 株式会社ディスコ | Measuring tool |
| TWI723293B (en) * | 2018-04-19 | 2021-04-01 | 南韓商舒語科技股份有限公司 | Grinding thickness control apparatus and method of semiconductor package grinder |
| JP2022040984A (en) * | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | Grinding apparatus |
| JP2023053560A (en) * | 2021-10-01 | 2023-04-13 | 株式会社ディスコ | Grinding apparatus |
| JP2023064325A (en) * | 2021-10-26 | 2023-05-11 | 株式会社ディスコ | Setup method |
-
1989
- 1989-03-31 JP JP3640789U patent/JPH0336761U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006334276A (en) * | 2005-06-06 | 2006-12-14 | Reiko Fujita | Toothbrush device |
| JP2007222986A (en) * | 2006-02-23 | 2007-09-06 | Disco Abrasive Syst Ltd | Grinding equipment |
| JP2010167532A (en) * | 2009-01-22 | 2010-08-05 | Disco Abrasive Syst Ltd | Method for confirming reference position of chuck table of grinder |
| JP2015102365A (en) * | 2013-11-22 | 2015-06-04 | 株式会社ディスコ | Workpiece thickness measuring instrument |
| JP2018027597A (en) * | 2016-08-18 | 2018-02-22 | 株式会社ディスコ | Measuring tool |
| TWI723293B (en) * | 2018-04-19 | 2021-04-01 | 南韓商舒語科技股份有限公司 | Grinding thickness control apparatus and method of semiconductor package grinder |
| JP2022040984A (en) * | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | Grinding apparatus |
| JP2023053560A (en) * | 2021-10-01 | 2023-04-13 | 株式会社ディスコ | Grinding apparatus |
| JP2023064325A (en) * | 2021-10-26 | 2023-05-11 | 株式会社ディスコ | Setup method |