JPH0336796A - Shielded printed board for surface mount component - Google Patents

Shielded printed board for surface mount component

Info

Publication number
JPH0336796A
JPH0336796A JP1171294A JP17129489A JPH0336796A JP H0336796 A JPH0336796 A JP H0336796A JP 1171294 A JP1171294 A JP 1171294A JP 17129489 A JP17129489 A JP 17129489A JP H0336796 A JPH0336796 A JP H0336796A
Authority
JP
Japan
Prior art keywords
surface mount
conductor
board
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1171294A
Other languages
Japanese (ja)
Inventor
Shinji Takahashi
伸治 高橋
Koji Kawashima
河島　浩二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP1171294A priority Critical patent/JPH0336796A/en
Publication of JPH0336796A publication Critical patent/JPH0336796A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To allow a digital electronic circuit and an analog electronic circuit to coexist on a mother board and to raise connecting reliability of soldering by operating upper and lower conductor layers as a shielding layer used also as a power source layer, and raising the thermal resistance of a component connection part in the conductor layer to be soldered of a surface mounting component. CONSTITUTION:Upper and lower outer layer conductors 11, 12 cover the whole surface of a multilayer board except a part necessary for connection terminals of various electronic components, through holes, etc., as surface mounting components to be used also as a power source line. In this case, power source pads 32 as connection pads are so provided with a vacant part 33 therearound to increase its thermal resistance. Solder-plated Kovar conductor pin 4 is secured to a through hole 13 of a multilayer printed circuit board 1 by a high melting point solder dipping method to obtain a shielded printed wiring board for a surface mounting component.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は表面実装部品用シールドプリント配線板に関
するものであり、特に、その上面側に表面実装部品を搭
載し、その下側から突出する導体ピンによって他の基板
等に実装する表面実装部品用パッケージのためのシール
ドプリント配線板に関するものであって、その中に形成
される電子回路を電磁波ノイズからシールドし、また、
当該内部の電子回路の電磁波ノイズをシールドすること
により内部の信号線による干渉を抑制して、動作上の信
頼性を向上させるとともに、前記表面実装部品の半田付
は部分における熱抵抗を高くしたものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a shield printed wiring board for surface mount components, and in particular, a surface mount component is mounted on the upper surface side of the board, and a conductor protrudes from the bottom side of the shield printed wiring board. This relates to a shield printed wiring board for a package for surface mount components that is mounted on another board using pins, and which shields the electronic circuit formed therein from electromagnetic noise.
By shielding the electromagnetic noise of the internal electronic circuit, interference from internal signal lines is suppressed, improving operational reliability, and the soldering of the surface mount components has a high thermal resistance. It is.

［従来の技術］ 近事の電子回路技術の発達により、いわゆる半導体素子
等の電子部品の集積度は相当高度になってきている。こ
のために、自動車、産業用機器等においても種々の電子
機器が搭載され、また電子機器の動作も高速になってき
ている。このため、産業用機器等に設置された電子機器
においては、安全上、機器外部の電磁波ノイズの影響を
受けないように、確実にシールドを施すことが必要とさ
れる。[Background Art] With the recent development of electronic circuit technology, the degree of integration of electronic components such as so-called semiconductor devices has become considerably high. For this reason, various electronic devices are being installed in automobiles, industrial equipment, etc., and the operation speed of electronic devices is also becoming faster. Therefore, for safety reasons, it is necessary for electronic devices installed in industrial equipment etc. to be reliably shielded so as not to be affected by electromagnetic noise from outside the device.

また、各種の分野で使用されているデジタル電子回路や
アナログ電子回路については、マイクロコンピュータ技
術やセンサ技術の発達にともない、高速な動作をするこ
とが可能になっているが、これらの高速に動作する電子
回路は他の電子回路からの干渉を受は易く、デジタル電
子回路でさえもシールドを施して、他の電子回路に対す
る干渉を起こさないようにせねばならない。Furthermore, with the development of microcomputer technology and sensor technology, it has become possible for digital and analog electronic circuits used in various fields to operate at high speeds; Digital electronic circuits are susceptible to interference from other electronic circuits, and even digital electronic circuits must be shielded to prevent interference with other electronic circuits.

ところが、所要の表面実装部品を実装する際に、シール
ドを施すためのシールドパターンを電源層として使用し
たときには、当該表面実装部品を外部に接続させるため
の接続パッド部における熱容量が大きくなり、この接続
パッド部の温度が表面実装部品のリード部の温度よりも
−ヒがりにくくなる。その結果として、接続のための半
田が表面実装部品のリード部に吸い取られてしまって、
所望の接続部に充分な半田が付着できなくなり、このた
めに、表面実装部品の半田付けに対する信頼性が揺らぐ
ことになる。However, when a shield pattern for shielding is used as a power supply layer when mounting a required surface mount component, the heat capacity at the connection pad for connecting the surface mount component to the outside increases, and this connection The temperature of the pad portion is less likely to cause a negative temperature drop than the temperature of the lead portion of the surface mount component. As a result, the solder for connection is absorbed by the leads of the surface mount components.
Sufficient solder will not be able to adhere to the desired connections, and this will result in unreliable soldering of surface mount components.

［発明が解決しようとする課題１ 従来の表面実装部品用シールドプリント配線板は、上記
されたように、所望のシールド効果をもたらすために、
プリント基板の両面に電源ライン兼用の外層導体を設け
たものであるが、表面実装部品を外部に接続させるため
の接続パッド部における熱容量が大きくなり、所望の接
続部に充分な半田が付着できなくなり、このために、表
面実装部品の半田付けに対する信頼性が揺らいでしまう
という問題点があった。[Problem to be Solved by the Invention 1] As described above, in the conventional shield printed wiring board for surface mount components, in order to bring about the desired shielding effect,
Although outer layer conductors that also serve as power lines are provided on both sides of the printed circuit board, the heat capacity at the connection pads for connecting surface mount components to the outside becomes large, making it impossible for sufficient solder to adhere to the desired connections. Therefore, there was a problem in that the reliability of soldering surface-mounted components was unstable.

この発明は、上記された問題点を解決するためになされ
たものであり、簡単な構成であって、従来技術を充分に
利用・発展させることができ、しかも、必要な電磁シー
ルドを可能とする表面実装部品用プリント配線板を用い
て、マザーボード上でのデジタル電子回路およびアナロ
グ電子回路の混在ができるようにして、内部での信号線
の干渉を抑制し、その信頼性の向上をさせるとともに、
半田付けの接続信頼性があり、汎用性の高い表面実装部
品用シールドプリント配線板を得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and has a simple structure, can fully utilize and develop the conventional technology, and also enables the necessary electromagnetic shielding. By using a printed wiring board for surface mount components, it is possible to mix digital and analog electronic circuits on the motherboard, suppressing internal signal line interference and improving its reliability.
The purpose of the present invention is to obtain a shield printed wiring board for surface mount components that has solder connection reliability and is highly versatile.

［課題を解決するための手段］ この発明に係る表面実装部品用シールドプリント配線板
は、 「中心基板の上下に導体層を設けた多層基板の上面側に
表面実装部品が搭載され、その下面側から突出した導体
ピンによって他の基板等に実装される表面実装部品用パ
ッケージのためのシールドプリント配線板において、 前記上下の導体層は電源層兼用のシールド層としての機
能を果たし、 前記表面実装部品の半田付けがなされる前記導体層内の
部品接続部における熱抵抗が高くされている」 ことを特徴とするものである。[Means for Solving the Problems] The shield printed wiring board for surface mount components according to the present invention has the following features: "Surface mount components are mounted on the upper surface side of a multilayer board in which conductor layers are provided above and below a center board, and In a shield printed wiring board for a package for a surface mount component that is mounted on another board etc. by conductor pins protruding from the surface, the upper and lower conductor layers function as a shield layer that also serves as a power supply layer, and the surface mount component The thermal resistance of the component connection portion within the conductor layer to which soldering is performed is increased.

［作用］ この発明においては、中心基板の上下に設けた導体層に
より所望のシールド効果がもたらされるとともに、表面
実装部品の半田付けがなされる前記導体層内の部品接続
部における熱抵抗が高くされることにより半田接続部の
信頼性が高くなるようにされる。[Function] In this invention, the desired shielding effect is brought about by the conductor layers provided above and below the center board, and the thermal resistance at the component connection portion within the conductor layer where surface mount components are soldered is increased. This makes the solder joints more reliable.

［実施例］ 第１図は、この発明の実施例である表面実装部品用シー
ルドプリント配線板に表面実装部品を実装した状態の斜
視図である。この第１図において、多層プリント配線板
（１）の上下両面には、それぞれに電源ラインである外
層導体が設けられている。[Embodiment] FIG. 1 is a perspective view of a shield printed wiring board for surface mount components, which is an embodiment of the present invention, in which surface mount components are mounted. In FIG. 1, outer layer conductors, which are power supply lines, are provided on both upper and lower surfaces of a multilayer printed wiring board (1).

そして、この多層プリント配線板（１）の表面適所には
、所要の表面実装部品（２）が対応の部品接続部（３〉
に対して半田で固定することにより接続されている。ま
た、多層プリント配線板（１）の裏面適所には、適当な
導電材料からなる複数本の導体ピン（４〉が設けられて
おり、かくして、所期のシールド効果を奏する表面実装
部品用シールドパタ−ン〈５〉が構成されることになる
。The required surface mount components (2) are placed at appropriate locations on the surface of this multilayer printed wiring board (1) at corresponding component connection portions (3).
It is connected by fixing it with solder. In addition, a plurality of conductor pins (4) made of an appropriate conductive material are provided at appropriate locations on the back surface of the multilayer printed wiring board (1), thus creating a shield pattern for surface mount components that achieves the desired shielding effect. -n <5> will be constructed.

第２図は、上記実施例の構成を概略的に示す部分拡大断
面図である。この第２図において、多層プリント配線板
（１）の上下両面には、それぞれに電源ラインである上
部外層導体（１１〉および下部外層導体（１２）が設け
られており、また、スルーホール（１３）には、半田メ
ツキを施したコバール製の導体ピン（４）が、例えば、
高融点半田デイツプ法を用いて固定されている。FIG. 2 is a partially enlarged sectional view schematically showing the configuration of the above embodiment. In FIG. 2, upper and lower outer layer conductors (11) and lower outer layer conductors (12), which are power lines, are provided on the upper and lower surfaces of the multilayer printed wiring board (1), respectively, and through holes (13) are provided on both sides of the multilayer printed wiring board (1). ) has a solder-plated Kovar conductor pin (4), for example.
It is fixed using a high melting point solder dip method.

第３図は、上記実施例における部品接続部（３）近傍の
要部拡大平面図である。この第３図において部品接続部
（３）を構成するものは、電源ライン兼用の外層導体部
（３１Ｌ表面実装部品のリード線部分を外部と接続させ
る接続パッドとしての電源パッド（３２）、および、前
記電源パッド（３２）における熱抵抗を増大させるため
の空白部（３３）であって、この空白部（３３）により
、外層導体部（３１）との極めて一部分での接続を除き
、前記外層導体部（３１〉は電源パッド（３２）から殆
ど隔離されている。FIG. 3 is an enlarged plan view of the main part near the component connection part (3) in the above embodiment. In FIG. 3, the component connecting portion (3) includes an outer layer conductor portion (31L) that also serves as a power line (a power pad (32) as a connection pad for connecting the lead wire portion of the surface mount component to the outside), and A blank area (33) for increasing thermal resistance in the power supply pad (32), which allows the outer layer conductor to be connected to the outer layer conductor (31) except for a very small portion of the connection. The section (31>) is almost isolated from the power supply pad (32).

上記された実施例のものは、次のようにして作成された
。The examples described above were created as follows.

（Ａ）　　まず、板厚２．２＋ｍのガラス−エポキシ鋼
張積層板（両面に厚み７０帥の銅箔付きのもの〉に対し
て、通常のサブトラクティブ法にて内層導体回路を形成
してから、ガラス−ポリイミド−プリプレグ（０，１ｍ
ｍの厚みのもの〉を介して、厚み１８ＩＩＩ１１の銅箔
をプレス法により張り合わせて多層基板が形成された。(A) First, on a glass-epoxy steel clad laminate with a thickness of 2.2m (copper foil 70cm thick on both sides), an inner layer conductor circuit is formed using the normal subtractive method. , glass-polyimide-prepreg (0.1m
A multilayer board was formed by laminating copper foils with a thickness of 18III and 11 times using a pressing method via a 18mm thick copper foil.

（Ｂ）　　次に、この多層基板に対して上部外層導体（
１１）、下部外層導体（１２）およびスルーホール（１
３）の形成を行い、多層プリンＩ・配線板（１）が形成
された。なお、上部外層導体（１１）および下部外層導
体（１２）は、表面実装部品としての各種の電子部品類
の接続端子やスルーホール等の必要な部分を除いて、前
記多層基板の全表面を覆っており、また、電源ラインと
しても使用できるようにされている。このとき、接続パ
ッドとしての電源パッド（３２）は、熱抵抗が大きくな
るように、その周囲に空白部（３３）が設けられている
。(B) Next, the upper outer layer conductor (
11), lower outer layer conductor (12) and through hole (1
3) was carried out to form a multilayer print I/wiring board (1). Note that the upper outer layer conductor (11) and the lower outer layer conductor (12) cover the entire surface of the multilayer board except for necessary parts such as connection terminals and through holes for various electronic components as surface mount components. It can also be used as a power line. At this time, a blank portion (33) is provided around the power supply pad (32) as a connection pad so that the thermal resistance is increased.

（Ｃ）　　次いで、この多層プリント配線板（１）にお
けるスルーホール（１３）に対して、半田メツキを施し
たコバール製の導体ピン（４）が高融点半田デイツプ法
を用いて固定されて、表面実装部品用シールドプリント
配線板が得られた。(C) Next, solder-plated Kovar conductor pins (4) are fixed to the through holes (13) in this multilayer printed wiring board (1) using a high melting point solder dip method, and the surface A shield printed wiring board for mounted components was obtained.

（Ｄ〉　しかる後に、この多、屑プリント配線板（１）
の上部表面適所には、所要の表面実装部品（２）が、対
応の部品接続部（３）に対して半田で固定することによ
り接続された。かくして、所期のシールド効果を奏する
表面実装部品用シールドパッケージ（５〉が構成された
。(D> After that, this lot, scrap printed wiring board (1)
Required surface mount components (2) were connected to corresponding component connection portions (3) by soldering to the appropriate locations on the upper surface of the device. In this way, a shield package (5) for surface-mounted components that exhibited the desired shielding effect was constructed.

なお、この実施例で適用される部品接続部としては、前
記された第３図のような場合だけではなく、第４図に示
されているような様々な態様の空白部を用いることもで
きる。この第４図において、第４図（Ａ）に例示されて
いるものは、接続パッドとしての電源パッド（３２）を
包囲する空白部（３３）が、図面上の上下２箇所で電源
ライン兼用の外層導体部（３１）に接続されているもの
である。It should be noted that, as the component connection part applied in this embodiment, not only the case shown in FIG. 3 described above but also various forms of blank parts as shown in FIG. 4 can be used. . In FIG. 4, in the example shown in FIG. 4(A), the blank area (33) surrounding the power supply pad (32) as a connection pad is located at two locations on the top and bottom of the drawing that also serve as a power supply line. It is connected to the outer layer conductor section (31).

また、第４図（Ｂ）に例示されているものは、接続パッ
ドとしての電源パッド（３２〉を包囲する空白部（３３
）が、図面上の左右２箇所で電源ライン兼用の外層導体
部（３１）に接続されているものである。そして、第４
図（Ｃ）に例示されているものは、接続パッドとしての
電源パッド（３２）を包囲する空白部（３３）が、図面
上の左方下端部１箇所で電源ライン兼用の外層導体部（
３１）に接続されているものである。Moreover, what is illustrated in FIG. 4(B) is a blank area (33
) are connected to the outer layer conductor portion (31) which also serves as a power supply line at two locations on the left and right in the drawing. And the fourth
In the example shown in Figure (C), a blank area (33) surrounding a power supply pad (32) as a connection pad is located at one location on the lower left end of the drawing, and an outer layer conductor that also serves as a power supply line (
31).

「発明の効果］ 以上説明されたように、この発明に係る表面実装部品用
シールドプリント配線板は、 「中心基板の上下に導体層を設けた多層基板の上面側に
表面実装部品が搭載され、その下面側から突出した導体
ピンによって他の基板等に実装される表面実装部品用パ
ッケージのためのシールドプリント配線板において、 前記上下の導体層は電源層兼用のシールド層としての機
能を果たし、 前記表面実装部品の半田付けがなされる前記導体層内の
部品接続部における熱抵抗が高くされている」 ことを特徴とするものである。``Effects of the Invention'' As explained above, the shield printed wiring board for surface mount components according to the present invention has the following advantages: In a shield printed wiring board for a surface mount component package that is mounted on another board etc. by conductor pins protruding from the lower surface side, the upper and lower conductor layers function as a shield layer that also serves as a power supply layer, and the above-mentioned The thermal resistance of the component connection portion within the conductor layer to which surface-mounted components are soldered is increased.

即ち、この発明に係る表面実装部品用シールドプリント
配線板は、信号伝達用の導体パターンが、多層プリント
配線板の電源ラインである外層導体で囲まれた構造を有
しているために、外部からこの表面実装部品用シールド
パッケージへの電磁波ノイズの侵入や、この表面実装部
品用シールドパッケージから外部への電磁波ノイズの放
射を防ぐことができる。従って、所要の電子回路を構成
するときに、この発明における表面実装部品用シールド
パッケージに、電磁波ノイズに敏感な回路を納めたり、
または、電磁波ノイズを放射しやすい高周波回路を納め
たりして、全体としての電子回路を構成することにより
、局所的にアイソレート化し、回路動作を安定化させる
ことで、電子回路の信頼性を向上させることができる。That is, the shield printed wiring board for surface mount components according to the present invention has a structure in which the conductor pattern for signal transmission is surrounded by the outer layer conductor, which is the power supply line of the multilayer printed wiring board, so that It is possible to prevent electromagnetic noise from entering the shielded package for surface-mounted components and to prevent electromagnetic noise from being radiated to the outside from this shielded package for surface-mounted components. Therefore, when configuring a required electronic circuit, it is necessary to place a circuit sensitive to electromagnetic noise in the shield package for surface mount components according to the present invention.
Alternatively, by configuring the entire electronic circuit by including high-frequency circuits that easily emit electromagnetic noise, it can be locally isolated and stabilize the circuit operation, improving the reliability of the electronic circuit. can be done.

しがち、搭載しようとする半導体電子部品の電源用パッ
ドの周囲には、その熱抵抗が大きくなるように所定の空
白部が設けられており、これに応じて前記電源用パッド
と表面実装部品との間の接続信頼性も大幅に向上する。Usually, a predetermined blank space is provided around the power supply pad of the semiconductor electronic component to be mounted to increase its thermal resistance, and accordingly, the power supply pad and the surface mount component are separated. The reliability of the connection between the two is also significantly improved.

更に、この発明においては、プリント配線板の表面の大
部分が導体層としての金属箔で覆われており、従って、
・その耐水性、耐候性の向上も期待されるものである。Furthermore, in this invention, most of the surface of the printed wiring board is covered with metal foil as a conductive layer, and therefore,
・It is also expected to improve its water resistance and weather resistance.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この発明の実施例である表面実装部品用シー
ルドプリント配線板に表面実装部品を実装した状態の斜
視図、第２図は、上記実施例の構成を概略的に示す部分
拡大断面図、第３図は、−り記実施例における部品接続
部近傍の要部拡大平面図、第４図は、上記実施例におけ
る部品接続部近傍の他の態様の例示図である。 １：多層プリント配線板、 １１：上部外層導体、 １２：下部外層導体、 １３ニスルーホール、 ２：表面実装部品、 ３：部品接続部、 ３１：外層導体部（電源ライン兼用）、３２：電源パッ
ド（接続パッド〉、 ３３：空白部、 ４：導体ピン、 ５：表面実装部品用シールドパッケージ。 なお、図面中で同一の符号が付されているもの多層プリ
ント配線板 表面実装部品 “部品接続部 導体ピン 表面実装部品用シールドバシヶーヅFIG. 1 is a perspective view of a surface mount component mounted on a shield printed wiring board for surface mount components according to an embodiment of the present invention, and FIG. 2 is a partially enlarged cross-sectional view schematically showing the configuration of the above embodiment. FIG. 3 is an enlarged plan view of the main part near the component connection portion in the embodiment described above, and FIG. 4 is an illustrative view of another aspect of the vicinity of the component connection portion in the above embodiment. 1: Multilayer printed wiring board, 11: Upper outer layer conductor, 12: Lower outer layer conductor, 13 Varnish through hole, 2: Surface mount component, 3: Component connection section, 31: Outer layer conductor section (also used as power line), 32: Power supply Pad (connection pad), 33: blank area, 4: conductor pin, 5: shield package for surface mount components. In addition, the same reference numerals in the drawings refer to multilayer printed wiring board surface mount components "component connection section" Shield Bashigazu for conductor pin surface mount components

Claims (1)

【特許請求の範囲】[Claims] （１）中心基板の上下に導体層を設けた多層基板の上面
側に表面実装部品が搭載され、その下面側から突出した
導体ピンによって他の基板等に実装される表面実装部品
用パッケージのためのシールドプリント配線板において
、 前記上下の導体層は電源層兼用のシール ド層としての機能を果たし、 前記表面実装部品の半田付けがなされる 前記導体層内の部品接続部における熱抵抗が高くされて
いることを特徴とする表面実装部品用シールドプリント
配線板。(1) A surface mount component package in which surface mount components are mounted on the top side of a multilayer board with conductor layers above and below the center board, and mounted on other boards etc. using conductor pins protruding from the bottom surface. In the shielded printed wiring board, the upper and lower conductor layers function as shield layers that also serve as power supply layers, and the thermal resistance at the component connection part in the conductor layer to which the surface mount component is soldered is increased. A shield printed wiring board for surface mount components, which is characterized by:
JP1171294A 1989-07-04 1989-07-04 Shielded printed board for surface mount component Pending JPH0336796A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1171294A JPH0336796A (en) 1989-07-04 1989-07-04 Shielded printed board for surface mount component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1171294A JPH0336796A (en) 1989-07-04 1989-07-04 Shielded printed board for surface mount component

Publications (1)

Publication Number Publication Date
JPH0336796A true JPH0336796A (en) 1991-02-18

Family

ID=15920637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1171294A Pending JPH0336796A (en) 1989-07-04 1989-07-04 Shielded printed board for surface mount component

Country Status (1)

Country Link
JP (1) JPH0336796A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307894A (en) * 1998-04-27 1999-11-05 Kenichi Ito Printed wiring board
US7134592B2 (en) 2001-03-13 2006-11-14 Daimlerchrysler Ag Method and protection apparatus for installation of a temperature-sensitive electronic component
JP2013069390A (en) * 2011-09-26 2013-04-18 Dainippon Printing Co Ltd Suspension substrate, suspension, suspension with head, and hard disk drive
CN117156791A (en) * 2023-02-22 2023-12-01 荣耀终端有限公司 Electronic equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307894A (en) * 1998-04-27 1999-11-05 Kenichi Ito Printed wiring board
US7134592B2 (en) 2001-03-13 2006-11-14 Daimlerchrysler Ag Method and protection apparatus for installation of a temperature-sensitive electronic component
JP2013069390A (en) * 2011-09-26 2013-04-18 Dainippon Printing Co Ltd Suspension substrate, suspension, suspension with head, and hard disk drive
CN117156791A (en) * 2023-02-22 2023-12-01 荣耀终端有限公司 Electronic equipment
CN117156791B (en) * 2023-02-22 2024-06-04 荣耀终端有限公司 Electronic equipment

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