JPH033771U - - Google Patents
Info
- Publication number
- JPH033771U JPH033771U JP6460489U JP6460489U JPH033771U JP H033771 U JPH033771 U JP H033771U JP 6460489 U JP6460489 U JP 6460489U JP 6460489 U JP6460489 U JP 6460489U JP H033771 U JPH033771 U JP H033771U
- Authority
- JP
- Japan
- Prior art keywords
- mounting pad
- flat package
- package mounting
- view
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例の平面図、第２
図は本考案の第２実施例の部分拡大平面図、第３
図は本考案の第３の実施例の部分拡大平面図、第
４図は従来の印刷配線板のフラツトパツケージ実
装パツドの一例の平面図、第５図は従来の印刷配
線板の布線検査検出ピンの植立の一例を示す平面
図、第６図は従来の印刷配線板の布線検査検出ピ
ンの植立の他の例を示す平面図である。
１……回路、２，１２，２２……布線検査検出
部、３，１３，２３，３３……フラツトパツケー
ジ実装パツド、４……布線検査検出ピン。
Figure 1 is a plan view of the first embodiment of the present invention;
The figure is a partially enlarged plan view of the second embodiment of the present invention, and the third figure is a partially enlarged plan view of the second embodiment of the invention.
The figure is a partially enlarged plan view of the third embodiment of the present invention, FIG. 4 is a plan view of an example of a flat package mounting pad of a conventional printed wiring board, and FIG. 5 is a conventional wiring inspection of a printed wiring board. FIG. 6 is a plan view showing an example of how the detection pins are installed. FIG. 6 is a plan view showing another example of how the detection pins are installed for wiring inspection on a conventional printed wiring board. 1... Circuit, 2, 12, 22... Wiring inspection detection section, 3, 13, 23, 33... Flat package mounting pad, 4... Wiring inspection detection pin.
Claims (1)
線板において、前記フラツトパツケージ実装パツ
ドに該フラツドパツケージ実装パツドの幅よりも
広い布線検査検出部を設けたことを特徴とする印
刷配線板。 1. A printed wiring board having a flat package mounting pad, characterized in that the flat package mounting pad is provided with a wiring inspection detecting section that is wider than the width of the flat package mounting pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6460489U JPH033771U (en) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6460489U JPH033771U (en) | 1989-06-01 | 1989-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033771U true JPH033771U (en) | 1991-01-16 |
Family
ID=31595699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6460489U Pending JPH033771U (en) | 1989-06-01 | 1989-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119235U (en) * | 1976-02-20 | 1977-09-09 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120078B2 (en) * | 1981-02-06 | 1986-05-20 | Fujitsu Ltd | |
| JPS6234471B2 (en) * | 1983-10-27 | 1987-07-27 | Kumano Hiroyasu |
-
1989
- 1989-06-01 JP JP6460489U patent/JPH033771U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120078B2 (en) * | 1981-02-06 | 1986-05-20 | Fujitsu Ltd | |
| JPS6234471B2 (en) * | 1983-10-27 | 1987-07-27 | Kumano Hiroyasu |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119235U (en) * | 1976-02-20 | 1977-09-09 |
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