JPH033773U - - Google Patents
Info
- Publication number
- JPH033773U JPH033773U JP6369489U JP6369489U JPH033773U JP H033773 U JPH033773 U JP H033773U JP 6369489 U JP6369489 U JP 6369489U JP 6369489 U JP6369489 U JP 6369489U JP H033773 U JPH033773 U JP H033773U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldering
- insertion hole
- terminal insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント基
板における半田付けランドの構成を示す概略図、
第２図は第１図の要部における半田の流れを説明
するための図、第３図は第１図の半田付けランド
１３のＡ−Ａ断面図、第４図は従来のプリント基
板の部品の実装状態を示す図、第５図および第６
図はそれぞれ従来のプリント基板における半田付
けランドの第１および第２の構成例を示す概略図
、第７図は第５図の要部における半田の流れを説
明するための図、第８図は第５図の各半田付けラ
ンド１１および１２に半田が半田付けされた場合
の概略図である。
１１〜１３……半田付けランド、２１〜２３…
…部品端子挿入孔、９……レジスト被膜。
FIG. 1 is a schematic diagram showing the configuration of a soldering land on a printed circuit board according to an embodiment of the invention;
Fig. 2 is a diagram for explaining the flow of solder in the main part of Fig. 1, Fig. 3 is a sectional view taken along A-A of soldering land 13 in Fig. 1, and Fig. 4 is a diagram of a conventional printed circuit board. Figures 5 and 6 showing the mounting state of parts
The figures are schematic diagrams showing first and second configuration examples of soldering lands on a conventional printed circuit board, respectively. FIG. 7 is a diagram for explaining the flow of solder in the main part of FIG. 5, and FIG. 6 is a schematic view of solder soldered to each soldering land 1 1 and 1 2 of FIG. 5. FIG. 1 1 to 1 3 ... soldering land, 2 1 to 2 3 ...
...Component terminal insertion hole, 9...Resist coating.
Claims (1)
ンドが互いに近接して複数配列されたプリント基
板において、その露出部分が前記部品端子挿入孔
を要として前記配列の方向と直交する方向に広が
る一対の扇形となるようにしたことを特徴とする
プリント基板における半田付けランド。 In a printed circuit board in which a plurality of soldering lands each having a component terminal insertion hole in the center are arranged close to each other, a pair of soldering lands whose exposed portions extend in a direction perpendicular to the direction of the arrangement with the component terminal insertion hole as a key point. A soldering land on a printed circuit board characterized by being fan-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6369489U JPH033773U (en) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6369489U JPH033773U (en) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033773U true JPH033773U (en) | 1991-01-16 |
Family
ID=31593970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6369489U Pending JPH033773U (en) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033773U (en) |
-
1989
- 1989-05-31 JP JP6369489U patent/JPH033773U/ja active Pending
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