JPH0338631U - - Google Patents
Info
- Publication number
- JPH0338631U JPH0338631U JP1989098577U JP9857789U JPH0338631U JP H0338631 U JPH0338631 U JP H0338631U JP 1989098577 U JP1989098577 U JP 1989098577U JP 9857789 U JP9857789 U JP 9857789U JP H0338631 U JPH0338631 U JP H0338631U
- Authority
- JP
- Japan
- Prior art keywords
- bare chip
- semiconductor bare
- semiconductor
- electrode
- electrode body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は従来の半導体ベアチツプ搭載を示す構
造図、第２図は本考案の実施例を示す構造図であ
る。第１図、第２図共通で１…基板、２…金属電
極体、３…半導体ベアチツプ、４…ボンデイング
線、５…導体箔である。
FIG. 1 is a structural diagram showing conventional semiconductor bare chip mounting, and FIG. 2 is a structural diagram showing an embodiment of the present invention. Common to FIGS. 1 and 2 are 1...substrate, 2...metal electrode body, 3...semiconductor bare chip, 4...bonding wire, and 5...conductor foil.
Claims (1)
定し、該半導体ベアチツプから基板等に設けたボ
ンデイング用電極にボンデイングワイヤー等によ
つて接続されて成る半導体装置に於いて、前記半
導体ベアチツプとほぼ同一形状、同一面積の前記
電極体を２つ以上の部分に等分割した電極構造を
持つ半導体装置。 In a semiconductor device in which a semiconductor bare chip is fixed to an electrode body provided on a substrate, and the semiconductor bare chip is connected to a bonding electrode provided on a substrate etc. by a bonding wire or the like, the semiconductor bare chip has substantially the same shape as the semiconductor bare chip. . A semiconductor device having an electrode structure in which the electrode body having the same area is equally divided into two or more parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098577U JPH0338631U (en) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098577U JPH0338631U (en) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338631U true JPH0338631U (en) | 1991-04-15 |
Family
ID=31647664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989098577U Pending JPH0338631U (en) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338631U (en) |
-
1989
- 1989-08-24 JP JP1989098577U patent/JPH0338631U/ja active Pending