JPH0338917U - - Google Patents
Info
- Publication number
- JPH0338917U JPH0338917U JP9862989U JP9862989U JPH0338917U JP H0338917 U JPH0338917 U JP H0338917U JP 9862989 U JP9862989 U JP 9862989U JP 9862989 U JP9862989 U JP 9862989U JP H0338917 U JPH0338917 U JP H0338917U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- ceramic substrate
- view
- common electrode
- independent electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000006247 magnetic powder Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案の第１の実施例装置の外観斜視
図、第２図は第１図に示すＡ−Ａ断面図、第３図
は第２図に示す矢印Ｂの方向から見たセラミツク
基板の平面図、第４図は第２図に示す矢印Ｃの方
向から見たセラミツク基板の平面図、第５図は第
１図に示すリード線の成形前を示す平面図、第６
図はセラミツク基板と金属板との接続状態を示す
斜視図、第７図は本考案の第２の実施例装置の外
観斜視図、第８図は第７図に示すＤ−Ｄ断面図、
第９図は第１の実施例装置の変形例を示す断面図
、第１０図はセラミツク基板と金属板との接続状
態を示す他の例の斜視図、第１１図は第２の実施
例装置の変形例を示す断面図、第１２図は第１図
に示す第１の実施例装置のプリント板への実装状
態を示す平面図、第１３図はこの回路図、第１４
図は従来例のフイルタのプリント板への実装状態
を示す平面図、第１５図はこのフイルタの回路図
である。
１０……ＬＣフイルタ装置、１１……セラミツ
ク基板、１１ａ……独立電極、１１ｂ……共通電
極、１２，１３……リード線、１４……磁性粉入
り樹脂モールド部材。
Fig. 1 is an external perspective view of the first embodiment of the device of the present invention, Fig. 2 is a sectional view taken along the line A-A shown in Fig. 1, and Fig. 3 is a ceramic structure seen from the direction of arrow B shown in Fig. 2. 4 is a plan view of the ceramic substrate as seen from the direction of arrow C shown in FIG. 2; FIG. 5 is a plan view showing the lead wire before forming shown in FIG. 1;
The figure is a perspective view showing the state of connection between the ceramic substrate and the metal plate, FIG. 7 is an external perspective view of the second embodiment of the device of the present invention, and FIG. 8 is a sectional view taken along line DD shown in FIG.
FIG. 9 is a cross-sectional view showing a modification of the device of the first embodiment, FIG. 10 is a perspective view of another example showing the state of connection between the ceramic substrate and the metal plate, and FIG. 11 is the device of the second embodiment. 12 is a plan view showing the mounting state of the first embodiment device shown in FIG. 1 on a printed circuit board, FIG. 13 is a circuit diagram of this, and FIG.
The figure is a plan view showing how a conventional filter is mounted on a printed board, and FIG. 15 is a circuit diagram of this filter. 10... LC filter device, 11... Ceramic substrate, 11a... Independent electrode, 11b... Common electrode, 12, 13... Lead wire, 14... Resin mold member containing magnetic powder.
Claims (1)
に共通電極を形成して成るセラミツク基板と、前
記各独立電極に接続された対向リード線と、前記
共通電極に接続されたリード線と、少なくとも前
記セラミツク基板及び前記リード線と電極との接
続部を含めて封止する磁性粉入り樹脂モールド部
材とを有するＬＣフイルタ装置。 A ceramic substrate having a plurality of independent electrodes formed on one surface and a common electrode formed on the other surface, a counter lead wire connected to each of the independent electrodes, and a lead wire connected to the common electrode. . An LC filter device comprising a magnetic powder-containing resin mold member for sealing at least the ceramic substrate and the connection portion between the lead wire and the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862989U JPH0338917U (en) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862989U JPH0338917U (en) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338917U true JPH0338917U (en) | 1991-04-15 |
Family
ID=31647712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9862989U Pending JPH0338917U (en) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338917U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011088650A (en) * | 2009-10-23 | 2011-05-06 | Taisei Kogyo:Kk | Pallet |
-
1989
- 1989-08-24 JP JP9862989U patent/JPH0338917U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011088650A (en) * | 2009-10-23 | 2011-05-06 | Taisei Kogyo:Kk | Pallet |
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