JPH0339559U - - Google Patents
Info
- Publication number
- JPH0339559U JPH0339559U JP9911989U JP9911989U JPH0339559U JP H0339559 U JPH0339559 U JP H0339559U JP 9911989 U JP9911989 U JP 9911989U JP 9911989 U JP9911989 U JP 9911989U JP H0339559 U JPH0339559 U JP H0339559U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- grooves
- thermal head
- heating elements
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図はこの考案の一実施例を示す側面図およ
び部分平面図、第２図はこの考案の他の実施例を
示す側面図および部分平面図、第３図〜第５図は
それぞれ従来の装置を示す斜視図、第６図は別途
出願の一実施例を示す斜視図、第７図はヒートパ
イプの動作原理を説明するための縦断面図。
１……サーマルヘツド基板、２……冷却用基板
、３……ヒートパイプ、１０……サーマルヘツド
、３４……孔部、３５……溝部。なお、各図中同
一符号は同一又は相当部分を示すものとする。
Fig. 1 is a side view and a partial plan view showing one embodiment of this invention, Fig. 2 is a side view and a partial plan view showing another embodiment of this invention, and Figs. FIG. 6 is a perspective view showing an embodiment of a separately filed application; FIG. 7 is a longitudinal cross-sectional view for explaining the operating principle of a heat pipe. DESCRIPTION OF SYMBOLS 1... Thermal head board, 2... Cooling board, 3... Heat pipe, 10... Thermal head, 34... Hole, 35... Groove. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
状に形成されたサーマルヘツド基板、 このサーマルヘツド基板の強度を補強し、その
熱を吸収して外部へ放出するため、サーマルヘツ
ド基板の上記発熱体の形成されている表面と反対
面に接触される冷却用基板、 この冷却用基板に形成され、上記発熱体の配列
線に互いに平行な複数本の溝部又は孔部、 互いに平行な上記複数本の溝部又は孔部の隣接
間隔を上記発熱体に近いものほど短くする手段、 上記複数本の溝又は孔部に順次蛇行状に連続し
て挿入される１本のヒートパイプ、 を備えたサーマルヘツド基板の冷却装置。[Claims for Utility Model Registration] A thermal head substrate in which the heating elements constituting the thermal head array are formed in a straight line. A cooling substrate that is in contact with a surface of the head substrate opposite to the surface on which the heating elements are formed; a plurality of grooves or holes that are formed on the cooling substrate and are mutually parallel to the arrangement line of the heating elements; Means for reducing the distance between adjacent grooves or holes of the plurality of parallel grooves or holes as they are closer to the heating element; one heat pipe that is successively inserted into the plurality of grooves or holes in a meandering manner; Cooling device for thermal head board equipped with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9911989U JPH0339559U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9911989U JPH0339559U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339559U true JPH0339559U (en) | 1991-04-16 |
Family
ID=31648180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9911989U Pending JPH0339559U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339559U (en) |
-
1989
- 1989-08-28 JP JP9911989U patent/JPH0339559U/ja active Pending
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