JPH0339U - - Google Patents
Info
- Publication number
- JPH0339U JPH0339U JP5788689U JP5788689U JPH0339U JP H0339 U JPH0339 U JP H0339U JP 5788689 U JP5788689 U JP 5788689U JP 5788689 U JP5788689 U JP 5788689U JP H0339 U JPH0339 U JP H0339U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- tool
- bonding
- tab
- upper plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000007665 sagging Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案のボンデイングツールの実施
例による斜視図である。第２図は、従来のボン
デイングツールの従来例のＡＡ′断面図である
。第３図は、従来例のボンデイングツールをラ
ツピング加工した後、そのＡＡ′断面図のダレ状
態を模式的に表現をした図である。第４図は、従
来のボンデイングツールの従来例のＡＡ′断面
図である。第５図は、従来例のボンデイングツ
ールをラツピング加工した後、そのＡＡ′断面図
のダレ状態を模式的に表現をした図である。第６
図は、本考案のボンデイングツールの実施例の
ＡＡ′断面図である。第７図は、実施例のボン
デイングツールの１万回使用後のＡＡ′断面図の
ダレ状態を模式的に表現をした図である。第８図
は、従来例のボンデイングツールの斜視図であ
る。第９図は、従来例のボンデイングツールの
１万回使用後のＡＡ′断面図のダレ状態を模式的
に表現をした図である。第１０図は、本考案のボ
ンデイングツールの実施例によるラツピング加
工した後、そのＡＡ′断面図のダレ状態を模式的
に表現をした図である。
１…上平面の溝、２…ボンデイングツール上平
面、３…導電性支持部、４…従来のツールの断面
、５…従来のラツピング加工後のダレ部、６…従
来のラツピング加工前のツール断面、７…従来の
１万回使用後のツールダレ部、８…実施のツール
の断面、９…実施の１万回使用後のツールダレ部
、１０…従来の１万回使用後のツールダレ部、１
１…ＩＣ上のＡＬパツト、１２…ＩＣチツプ、１
３…フインガー部。
FIG. 1 is a perspective view of an embodiment of the bonding tool of the present invention. FIG. 2 is a sectional view along line AA' of a conventional example of a conventional bonding tool. FIG. 3 is a diagram schematically showing the sagging state of a conventional bonding tool taken along the line AA' after wrapping. FIG. 4 is a sectional view along line AA' of a conventional example of a conventional bonding tool. FIG. 5 is a diagram schematically showing the sagging state of a conventional bonding tool taken along the line AA' after wrapping. 6th
The figure is a sectional view along line AA' of an embodiment of the bonding tool of the present invention. FIG. 7 is a diagram schematically representing the sagging state of the bonding tool of the example after 10,000 times of use in the AA' cross-sectional view. FIG. 8 is a perspective view of a conventional bonding tool. FIG. 9 is a diagram schematically representing the sagging state of a conventional bonding tool in a cross-sectional view along line AA' after 10,000 uses. FIG. 10 is a schematic representation of the sagging state in the AA' cross-sectional view after the wrapping process is performed using the embodiment of the bonding tool of the present invention. 1...Groove on top plane, 2...Bonding tool top plane, 3...Conductive support part, 4...Cross section of conventional tool, 5...Sagging part after conventional wrapping process, 6...Cross section of tool before conventional wrapping process , 7... Conventional tool sag part after 10,000 uses, 8... Cross section of the actual tool, 9... Tool sag part after 10,000 uses, 10... Conventional tool sag part after 10,000 uses, 1
1...AL part on IC, 12...IC chip, 1
3...Finger section.
Claims (1)
ＩＣパツド部に加圧し接合させるＴＡＢまたはＢ
ＴＡＢ用ボンデイングツールにおいて、上平面が
四角形をしたボンデイングツールの各辺に平行に
ツール上平面を０．１〜１００μｍの幅の溝を入
れ、その溝で区切られた内側の平坦部を接合時に
使用することを特徴とするボンデイングツール。 TAB or B, in which a finger whose surface is plated with gold is pressed and bonded to the IC pad under high temperature heating.
In the bonding tool for TAB, grooves with a width of 0.1 to 100 μm are made in the upper plane of the tool parallel to each side of the bonding tool whose upper plane is square, and the inner flat part separated by the groove is used for bonding. A bonding tool that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5788689U JPH0339U (en) | 1989-05-19 | 1989-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5788689U JPH0339U (en) | 1989-05-19 | 1989-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339U true JPH0339U (en) | 1991-01-07 |
Family
ID=31583001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5788689U Pending JPH0339U (en) | 1989-05-19 | 1989-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01147952U (en) * | 1988-03-31 | 1989-10-13 |
-
1989
- 1989-05-19 JP JP5788689U patent/JPH0339U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01147952U (en) * | 1988-03-31 | 1989-10-13 |