JPH034046U - - Google Patents
Info
- Publication number
- JPH034046U JPH034046U JP6324389U JP6324389U JPH034046U JP H034046 U JPH034046 U JP H034046U JP 6324389 U JP6324389 U JP 6324389U JP 6324389 U JP6324389 U JP 6324389U JP H034046 U JPH034046 U JP H034046U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- heating element
- insulating layer
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Electronic Switches (AREA)
Description
第１図は本考案一実施例のサーマルヘツドの一
部の外観斜視図、第２図はその発熱抵抗体周辺構
成部の拡大断面図、第３図は本例において発熱抵
抗体を間欠的に通電したとき、発熱抵抗体がいか
ように温度上昇するかを説明するための図、第４
図は本例における発熱分布を示す図、第５図は従
来例における発熱分布を示す図、第６図は従来例
のその発熱抵抗体周辺構成部の拡大断面図、第７
図は従来例において発熱抵抗体を間欠的に通電し
たとき、発熱抵抗体がいかように温度上昇するか
を説明するための図、第８図は従来例において通
電パルス幅を大きく調整しなければならないこと
を説明するための図である。
１…基板、２…絶縁層、３…発熱体、６，６′
…伝熱層、７…放熱手段としての放熱フイン。
Fig. 1 is an external perspective view of a part of a thermal head according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the surrounding components of the heating resistor, and Fig. 3 is an intermittently connected heating resistor in this embodiment. Diagram 4 for explaining how the temperature of the heating resistor rises when energized
5 is a diagram showing the heat generation distribution in the present example, FIG. 5 is a diagram showing the heat generation distribution in the conventional example, FIG.
The figure is a diagram to explain how the temperature of the heating resistor rises when the heating resistor is intermittently energized in the conventional example. Figure 8 shows that in the conventional example, the energizing pulse width must be largely adjusted. FIG. 1...Substrate, 2...Insulating layer, 3...Heating element, 6, 6'
...heat transfer layer, 7...heat radiation fin as a heat radiation means.
Claims (1)
ーマルヘツドにおいて、基板と絶縁層との間の位
置を少なくとも含む前記発熱体からの熱の伝達可
能な位置に、熱伝導率の高い伝熱材料より成る伝
熱層を設け、且つ、該伝熱層に放熱手段を熱伝達
可能に接続させて成るようにしたサーマルヘツド
。 In a thermal head in which a heating element is provided to a substrate via an insulating layer, heat transfer with high thermal conductivity is provided at a position where heat from the heating element can be transferred, including at least a position between the substrate and the insulating layer. A thermal head comprising a heat transfer layer made of a material, and a heat dissipation means connected to the heat transfer layer in a heat transferable manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324389U JPH034046U (en) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324389U JPH034046U (en) | 1989-06-01 | 1989-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH034046U true JPH034046U (en) | 1991-01-16 |
Family
ID=31593116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6324389U Pending JPH034046U (en) | 1989-06-01 | 1989-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034046U (en) |
-
1989
- 1989-06-01 JP JP6324389U patent/JPH034046U/ja active Pending