JPH0340501U - - Google Patents
Info
- Publication number
- JPH0340501U JPH0340501U JP10220989U JP10220989U JPH0340501U JP H0340501 U JPH0340501 U JP H0340501U JP 10220989 U JP10220989 U JP 10220989U JP 10220989 U JP10220989 U JP 10220989U JP H0340501 U JPH0340501 U JP H0340501U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- back sides
- pattern matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Description
第1図はこの考案による寸法検査装置の一実施
例の全体構成図、第2図はその寸法検査品取付け
部の上面図は、第3図はその寸法検査装置の被検
査装置のメモリに記憶されている寸法検査プラグ
ラムのフローチヤート、第4図a及びbはその寸
法検査装置の被検査品となる高精度パターン相対
型両面PWBの配線パターンの一例を示す表裏両
面の図である。
図において、1は被検査品の高精度パターン相
対型両面PWB、2はガラス板製のステージ、3
はフイクスチヤ、4及び5はCCDカメラ、6及
び7は自動焦点調節回路、8はXYZポジシヨナ
、9はXYZポジシヨナ制御回路、10はマイク
ロコンピユータ、11はCPU、12はメモリ、
13は入力回路、14は出力回路、15はキーボ
ード、16はCRT、17はプリンタ、18はフ
イクスチヤのL字、19a及び19dはフイクス
チヤのスライダ、20a及び20bは高精度パタ
ーン相対型両面PWBの基板、21a及び21b
は高精度パターン相対型両面PWBの配線パター
ンである。なお、図中、同一符号は同一、又は相
当部分を示す。
Fig. 1 is an overall configuration diagram of an embodiment of the dimension inspection device according to this invention, Fig. 2 is a top view of the dimensional inspection item attachment part, and Fig. 3 is stored in the memory of the device to be inspected of the dimension inspection device. FIGS. 4a and 4b of the flowchart of the dimension inspection program shown in FIG. 4 are front and back views showing an example of the wiring pattern of a high-precision pattern-relative type double-sided PWB that is an item to be inspected by the dimension inspection apparatus. In the figure, 1 is a high-precision pattern-relative type double-sided PWB for the product to be inspected, 2 is a stage made of a glass plate, and 3
is a fixture, 4 and 5 are CCD cameras, 6 and 7 are automatic focus adjustment circuits, 8 is an XYZ positioner, 9 is an XYZ positioner control circuit, 10 is a microcomputer, 11 is a CPU, 12 is a memory,
13 is an input circuit, 14 is an output circuit, 15 is a keyboard, 16 is a CRT, 17 is a printer, 18 is a fixture L-shape, 19a and 19d are fixture sliders, 20a and 20b are high-precision pattern relative type double-sided PWB boards , 21a and 21b
is a wiring pattern of a high-precision pattern-relative type double-sided PWB. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
て寸法検査する装置において、前記印刷配線基板
について面対称の位置にそれぞれCCDカメラを
保持し、前記印刷配線基板の表裏両面を同時撮像
する両面撮像手段、前記2台のCCDカメラの画
像を画素単位でパターン照合して、そのパターン
合致状況を評価する画像パターン照合手段、前記
印刷配線基板の配線パターンの位置と形状に関す
る寸法の設計データを記憶させる配線パターン記
憶手段及び前記両面撮像手段と前記画像パターン
照合手段を、前記配線パターン記憶手段により記
憶されたデータに基づいて前記印刷配線基板の配
線パターンとその近傍の領域について順次自動的
に適用させ、前記印刷配線基板全体について表裏
両面の配線パターンの合致状況を検査する手段を
備えた寸法検査装置。 In an apparatus for dimensional inspection of wiring patterns on both the front and back sides of a printed wiring board, a double-sided imaging means for simultaneously capturing images of both the front and back sides of the printed wiring board by holding a CCD camera at a plane-symmetrical position with respect to the printed wiring board; Image pattern matching means for pattern matching the images of the CCD camera of the stand pixel by pixel and evaluating the pattern matching status, and wiring pattern storage means for storing design data of dimensions regarding the position and shape of the wiring pattern of the printed wiring board. and the double-sided imaging means and the image pattern matching means are sequentially and automatically applied to the wiring pattern of the printed wiring board and the area in the vicinity thereof based on the data stored by the wiring pattern storage means, and the printed wiring board is A dimension inspection device equipped with means for inspecting the matching status of wiring patterns on both the front and back sides of the whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10220989U JPH0340501U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10220989U JPH0340501U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0340501U true JPH0340501U (en) | 1991-04-18 |
Family
ID=31651120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10220989U Pending JPH0340501U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340501U (en) |
-
1989
- 1989-08-31 JP JP10220989U patent/JPH0340501U/ja active Pending
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