JPH0340741U - - Google Patents
Info
- Publication number
- JPH0340741U JPH0340741U JP10153789U JP10153789U JPH0340741U JP H0340741 U JPH0340741 U JP H0340741U JP 10153789 U JP10153789 U JP 10153789U JP 10153789 U JP10153789 U JP 10153789U JP H0340741 U JPH0340741 U JP H0340741U
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- coating layer
- insulating tube
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011247 coating layer Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Description
第１図は本考案の実施例を示す説明図、第２図
並びに第３図はそれぞれ従来例を示す説明図であ
る。 １……絶縁被覆リード線、１１……導体、１２
……絶縁被覆層、２……低融点可溶金属体、４…
…絶縁筒、５……封止樹脂。
並びに第３図はそれぞれ従来例を示す説明図であ
る。 １……絶縁被覆リード線、１１……導体、１２
……絶縁被覆層、２……低融点可溶金属体、４…
…絶縁筒、５……封止樹脂。
Claims (1)
- 【実用新案登録請求の範囲】 絶縁被覆リード線間に低融点可溶金属体を橋設
し、該低融点可溶金属体上に絶縁筒を挿通し、各
絶縁被覆リード線の絶縁被覆層端を絶縁筒外に存
在させ、絶縁筒各端部と各リード線の絶縁被覆層
端部との間を樹脂で封止し、その各絶縁被覆層端
と絶縁筒各端との間隔Ｌ（mm）を、 ０．４×Ｒ２／Ｒ１≦Ｌ≦１．２５×Ｒ２／Ｒ
１ （ただし、Ｒ１は絶縁被覆層外径、Ｒ２は絶縁
筒外径）としたことを特徴とする温度ヒユーズ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101537U JP2571046Y2 (ja) | 1989-08-29 | 1989-08-29 | 温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101537U JP2571046Y2 (ja) | 1989-08-29 | 1989-08-29 | 温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0340741U true JPH0340741U (ja) | 1991-04-18 |
| JP2571046Y2 JP2571046Y2 (ja) | 1998-05-13 |
Family
ID=31650485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989101537U Expired - Lifetime JP2571046Y2 (ja) | 1989-08-29 | 1989-08-29 | 温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2571046Y2 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63434U (ja) * | 1986-06-17 | 1988-01-05 | ||
| JPH01124638U (ja) * | 1988-02-17 | 1989-08-24 |
-
1989
- 1989-08-29 JP JP1989101537U patent/JP2571046Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63434U (ja) * | 1986-06-17 | 1988-01-05 | ||
| JPH01124638U (ja) * | 1988-02-17 | 1989-08-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2571046Y2 (ja) | 1998-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |