JPH0340820U - - Google Patents
Info
- Publication number
- JPH0340820U JPH0340820U JP10001889U JP10001889U JPH0340820U JP H0340820 U JPH0340820 U JP H0340820U JP 10001889 U JP10001889 U JP 10001889U JP 10001889 U JP10001889 U JP 10001889U JP H0340820 U JPH0340820 U JP H0340820U
- Authority
- JP
- Japan
- Prior art keywords
- plate frame
- frame body
- wiring device
- size
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010276 construction Methods 0.000 description 1
Landscapes
- Details Of Indoor Wiring (AREA)
Description
第１図は本考案の実施例の施工状態を示す断面
図、第２図は同上の分解斜視図、第３図ａは同上
のプレート枠本体の正面図、第３図ｂは同上の第
３図ａのＡ〜Ｄ′ラインを含む破断底面図、第３
図ｃは同上の第３図ａのＥ〜Ｈ′ラインの断面図
、第３図ｄは同上の背面図、第４図は同上の他の
実施例の分解斜視図、第５図は従来例の断面図で
ある。
１はプレート枠本体、２３は化粧プレート、３
６は取付部、４１は埋込穴、４２は埋込ボツクス
である。
Fig. 1 is a sectional view showing the construction state of the embodiment of the present invention, Fig. 2 is an exploded perspective view of the same, Fig. 3a is a front view of the plate frame main body of the above, and Fig. 3b is a sectional view of the same as the above. Broken bottom view including lines A to D' in Figure a, No. 3
Figure c is a sectional view taken from line E to H' in Figure 3a of the above, Figure 3d is a rear view of the same, Figure 4 is an exploded perspective view of another embodiment of the same, and Figure 5 is a conventional example. FIG. 1 is the plate frame body, 23 is the decorative plate, 3
6 is a mounting portion, 41 is an embedding hole, and 42 is an embedding box.
Claims (1)
配線器具を着脱自在に装着し埋込穴の開口面がわ
を覆うプレート枠本体を形成し、埋込穴内に配設
された埋込ボツクスの前面に取着する取付部を上
記プレート枠本体に形成し、該取付部の背面をプ
レート枠本体の外周部より前面側に設け、プレー
ト枠本体の大きさを規格化された配線器具モジユ
ール１個分の大きさの配線器具を３個装着できる
大きさとしたことを特徴とする配線器具用プレー
ト枠。 (2) 規格化された配線器具モジユール１個分の
大きさの配線器具を３個、並列に計６個装着でき
るプレート枠本体としたことを特徴とする請求項
１記載の配線器具用プレート枠。[Scope of Claim for Utility Model Registration] (1) A decorative plate is attached to the front side, a wiring device is detachably attached to the center part, and a plate frame body is formed to cover the opening surface of the embedded hole, and the inside of the embedded hole is A mounting portion is formed on the plate frame body to be attached to the front surface of the recessed box disposed in the plate frame body, and the back surface of the mounting portion is provided on the front side of the outer periphery of the plate frame body to reduce the size of the plate frame body. A plate frame for a wiring device, characterized in that it is sized to accommodate three wiring devices each having the size of one standardized wiring device module. (2) The plate frame for a wiring device according to claim 1, characterized in that the plate frame main body is capable of mounting three wiring devices of the size of one standardized wiring device module, a total of six in parallel. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10001889U JPH0340820U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10001889U JPH0340820U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0340820U true JPH0340820U (en) | 1991-04-19 |
Family
ID=31649043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10001889U Pending JPH0340820U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340820U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101139166B1 (en) * | 2009-02-16 | 2012-04-26 | 파나소닉 주식회사 | Plate for wiring device, wiring apparatus |
-
1989
- 1989-08-28 JP JP10001889U patent/JPH0340820U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101139166B1 (en) * | 2009-02-16 | 2012-04-26 | 파나소닉 주식회사 | Plate for wiring device, wiring apparatus |
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