JPH034130U - - Google Patents
Info
- Publication number
- JPH034130U JPH034130U JP6495989U JP6495989U JPH034130U JP H034130 U JPH034130 U JP H034130U JP 6495989 U JP6495989 U JP 6495989U JP 6495989 U JP6495989 U JP 6495989U JP H034130 U JPH034130 U JP H034130U
- Authority
- JP
- Japan
- Prior art keywords
- transport
- lead parts
- conveyance path
- path
- upstream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 1
Landscapes
- Chutes (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
はＩＣデバイスの搬送装置の要部断面図、第２図
は第１図の−断面図、第３図はＩＣデバイス
の外観図である。
１……ＩＣデバイス、２……基板部、２ａ，２
ｂ……側面、３……リード部、１０……プリヒー
タ、１１……シユートユニツト、１２……ヒート
ユニツト、１３……デバイス通路、２０……デバ
イス導入部、２２……デバイス収容部、３０……
センサ、３１……エアノズル。
The drawings show an embodiment of the present invention; FIG. 1 is a cross-sectional view of a main part of an IC device transport device, FIG. 2 is a cross-sectional view of FIG. 1, and FIG. 3 is an external view of the IC device. be. 1...IC device, 2...substrate part, 2a, 2
b...Side surface, 3...Lead part, 10...Preheater, 11...Shoot unit, 12...Heat unit, 13...Device passage, 20...Device introduction part, 22...Device accommodating part, 30...
Sensor, 31... Air nozzle.
Claims (1)
させたＩＣデバイスを、そのリード部を鉛直状態
にして自重滑降するようにガイドする搬送装置に
おいて、前記ＩＣデバイスの搬送経路のうち、上
流側搬送路と下流側搬送路との間の移行部にＩＣ
デバイスの詰まりが生じたときに、該ＩＣデバイ
スの基板部の膨出側表面に、その走行方向と直交
する方向に加圧エアを間欠的に吹き付けるエアノ
ズルを前記上流側搬送路に設ける構成としたこと
を特徴とするＩＣデバイスの搬送装置。 In a transport device that guides an IC device having a plurality of lead parts extending straight from one end of a substrate part so as to slide down under its own weight with the lead parts in a vertical state, an upstream side of the transport path of the IC device is provided. An IC is installed at the transition between the conveyance path and the downstream conveyance path.
The upstream transport path is provided with an air nozzle that intermittently blows pressurized air to the bulging side surface of the substrate portion of the IC device in a direction perpendicular to the traveling direction thereof when the device is clogged. An IC device transport device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6495989U JPH034130U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6495989U JPH034130U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH034130U true JPH034130U (en) | 1991-01-16 |
Family
ID=31596359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6495989U Pending JPH034130U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034130U (en) |
-
1989
- 1989-06-05 JP JP6495989U patent/JPH034130U/ja active Pending
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