JPH0341960U - - Google Patents

Info

Publication number
JPH0341960U
JPH0341960U JP10339989U JP10339989U JPH0341960U JP H0341960 U JPH0341960 U JP H0341960U JP 10339989 U JP10339989 U JP 10339989U JP 10339989 U JP10339989 U JP 10339989U JP H0341960 U JPH0341960 U JP H0341960U
Authority
JP
Japan
Prior art keywords
flexible
wiring pattern
circuit board
adhesive
circuit wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10339989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10339989U priority Critical patent/JPH0341960U/ja
Publication of JPH0341960U publication Critical patent/JPH0341960U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る可撓性回路基板の屈曲可
撓部構造の要部断面構成図、そして、第２図は従
来構造の可撓性片面導電板の断面説明図である。 １…ベースフイルム、２…回路配線パターン、
３…接着層、４…ベースフイルム。 FIG. 1 is a cross-sectional configuration diagram of a main part of a bent flexible portion structure of a flexible circuit board according to the present invention, and FIG. 2 is a cross-sectional explanatory diagram of a flexible single-sided conductive plate having a conventional structure. 1...Base film, 2...Circuit wiring pattern,
3...adhesive layer, 4...base film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電箔とベースフイルムとを接着剤を介在させ
ることなく接合した無接着剤可撓性片面導電板の
該導電箔により形成した所要の回路配線パターン
を備え、この回路配線パターン側に接着層を介し
て被着したカバーフイルムを有し、その回路配線
パターンの中心がこの可撓性回路基板の屈曲中立
線に配置されるように構成したことを特徴とする
可撓性回路基板の屈曲可撓部構造。 A conductive foil and a base film are bonded to each other without intervening adhesive to form an adhesive-free flexible single-sided conductive plate with a required circuit wiring pattern formed by the conductive foil, with an adhesive layer interposed on the circuit wiring pattern side. A bent flexible portion of a flexible circuit board, comprising a cover film attached to the flexible circuit board, the center of the circuit wiring pattern being arranged on the bending neutral line of the flexible circuit board. structure.
JP10339989U 1989-09-01 1989-09-01 Pending JPH0341960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10339989U JPH0341960U (en) 1989-09-01 1989-09-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10339989U JPH0341960U (en) 1989-09-01 1989-09-01

Publications (1)

Publication Number Publication Date
JPH0341960U true JPH0341960U (en) 1991-04-22

Family

ID=31652240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10339989U Pending JPH0341960U (en) 1989-09-01 1989-09-01

Country Status (1)

Country Link
JP (1) JPH0341960U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340382A (en) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd Flexible printed wiring board and method for manufacturing the flexible printed wiring board
USRE43124E1 (en) 2001-03-26 2012-01-24 Sharp Kabushiki Kaisha Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
JP2024146952A (en) * 2023-03-31 2024-10-15 住友電工プリントサーキット株式会社 Printed Wiring Boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE43124E1 (en) 2001-03-26 2012-01-24 Sharp Kabushiki Kaisha Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
JP2005340382A (en) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd Flexible printed wiring board and method for manufacturing the flexible printed wiring board
JP2024146952A (en) * 2023-03-31 2024-10-15 住友電工プリントサーキット株式会社 Printed Wiring Boards

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