JPH0342691Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to a lead connecting device for connecting leads on a substrate to leads on another substrate in order to lead the leads to the outside.

For example, as shown in FIG. 1, a plurality of leads 2 patterned on the surface of a substrate 1 such as ceramic are connected to leads 4 of another substrate 3 such as flexible wire leads in order to lead them out to the outside. There are things to do. For this connection, apply solder to the surfaces of leads 2 and 4 in advance.
Both substrates 1 and 3 are stacked on top of each other so that their respective leads 2 and 4 are connected to each other, and are soldered by applying heat and pressure. By this soldering, both leads 2 and 4 are mechanically coupled to each other and electrically connected.

By the way, as shown in FIGS. 1 and 2, the substrate 1
The leads 2 above do not necessarily all have the same width; one of them, for example lead 2
A may be wider than other leads. This is, for example, a current-carrying object on the board 1 (not shown).
When energizing, the lead 2 may be connected to one end of each energized body, and the lead 2A may be connected to the other end as a common lead. This uses a wide lead 2A to increase current carrying capacity.

On the other hand, the solder 5, 5A attached to the surface of the leads 2, 2A differs depending on the width of the lead, that is, as shown in FIG. 3, the solder 5 on the lead 2 is different from the solder 5A on the lead 2A. is attached in such a way that it rises higher. Of course, the solder attached to the lead 4 (not shown)
also adheres in a similar manner.

Therefore, as described above, both the leads 2 and 4 are heated and pressurized while facing each other, but at this time the solder is crushed and spread laterally. In this case, when the amount is small like solder 5, there is not much of a problem, but when the amount is large like solder 5A. Widely spread out to the side and adjacent lead 2
may come into contact with. If such contact occurs, the lead 2A and the adjacent lead 2 will be connected to each other, making it no longer usable.

The purpose of this invention is to prevent short circuits between leads due to spread of solder.

An embodiment of this invention will be explained with reference to FIG. 4 and subsequent figures. Note that parts with the same reference numerals as in FIGS. 1 to 3 refer to the same or corresponding parts. As can be understood from FIG. 4, in this invention, the wide lead 2A is divided at the portion to be soldered to the lead 4 to form split leads 2B and 2C. The split lead 2B may have approximately the same width as the lead 2, but the split lead 2C has a narrower width than the lead 2. The interval between the divided lead 2C and the adjacent lead 2 is approximately equal to the interval between the leads 2.

With this configuration, each lead 2,
Solder attached to the surface of B, 2C 5.5B, 5
C becomes as shown in Figure 5. In other words, the amount of solder 5B attached to the surface of portion 2B is approximately equal to the amount of solder 5 attached to the surface of lead 2.
The amount of solder 5C attached to the surface of C is even smaller.

When the board 3 is stacked and soldered to the board 1 configured in this way as shown in Fig. 1, each solder is crushed and tries to spread laterally, but at this time, it is difficult to short-circuit the solders 5 together. If the amount is small enough, the solder 5C and the adjacent solder 5 will not short-circuit each other even if they spread laterally. In other words, with this, short circuits between leads can be reliably prevented no matter how wide the leads are located next to each other.

In the illustrated example, the lead 2C is separated from the lead 2B, but instead, the base end side (the upper end in the figure) of the lead 2C may be connected to the lead 2A. In addition, lead 2B is made to have almost the same width as lead 2, but if lead 2A is at the end of the parallel leads and there is no other lead next to it (on the left in the example in the figure), lead 2 The width may be wider than that. Lead 2B when soldering board 3
and lead 2C will likely be short-circuited by solder. Therefore, lead 2B and lead 2
Even if C and C are far apart, after soldering,
This is equivalent to using a wider lead.

As detailed above, according to this invention, when a board having at least one wide lead is soldered to another board, the wide lead and the adjacent lead are short-circuited by the solder. This has the effect of reliably preventing such things.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the conventional example, FIG. 2 is a plan view of the board, FIG. 3 is a sectional view of the board before soldering, and FIG. 4 is a plan view of the board according to the embodiment of this invention. Similarly, FIG. 5 is a cross-sectional view of the substrate. 1, 3... Board, 2, 2A, 4... Lead, 2
C, 2B...Split lead, 5, 5A, 5B, 5C
...Solder.

Claims (1)

[Scope of utility model registration request] By overlapping leads that are arranged in parallel on the surface of a substrate, at least one of which is wider than the others, and the leads that are arranged in parallel on the surface of another substrate and heated under pressure, the lead surface can also be heated. In the lead connecting device, the wide lead is divided into two parts, and one of the divided leads is adjacent to another narrow lead which is adjacent to this lead. The width of the lead is narrower than the narrow lead, and the remaining split leads are set to have the same width as the narrow lead, and the intervals between the two split leads are set by soldering the leads of each board. A lead connection device with a spacing that is short-circuited by solder.