JPH0342700B2 - - Google Patents

Info

Publication number
JPH0342700B2
JPH0342700B2 JP60116408A JP11640885A JPH0342700B2 JP H0342700 B2 JPH0342700 B2 JP H0342700B2 JP 60116408 A JP60116408 A JP 60116408A JP 11640885 A JP11640885 A JP 11640885A JP H0342700 B2 JPH0342700 B2 JP H0342700B2
Authority
JP
Japan
Prior art keywords
lid
base
sealing
container
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60116408A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276237A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60116408A priority Critical patent/JPS61276237A/ja
Priority to DE8686107255T priority patent/DE3683400D1/de
Priority to EP86107255A priority patent/EP0203589B1/en
Priority to US06/868,440 priority patent/US4836434A/en
Publication of JPS61276237A publication Critical patent/JPS61276237A/ja
Publication of JPH0342700B2 publication Critical patent/JPH0342700B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP60116408A 1985-05-31 1985-05-31 半導体パツケ−ジの気密封止方法およびその装置 Granted JPS61276237A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60116408A JPS61276237A (ja) 1985-05-31 1985-05-31 半導体パツケ−ジの気密封止方法およびその装置
DE8686107255T DE3683400D1 (de) 1985-05-31 1986-05-28 Verfahren und apparat zur luftdichten zusammensetzung einer halbleiterpackung.
EP86107255A EP0203589B1 (en) 1985-05-31 1986-05-28 Method and apparatus for airtightly packaging semiconductor package
US06/868,440 US4836434A (en) 1985-05-31 1986-05-30 Method and apparatus for airtightly packaging semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60116408A JPS61276237A (ja) 1985-05-31 1985-05-31 半導体パツケ−ジの気密封止方法およびその装置

Publications (2)

Publication Number Publication Date
JPS61276237A JPS61276237A (ja) 1986-12-06
JPH0342700B2 true JPH0342700B2 (2) 1991-06-28

Family

ID=14686317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60116408A Granted JPS61276237A (ja) 1985-05-31 1985-05-31 半導体パツケ−ジの気密封止方法およびその装置

Country Status (4)

Country Link
US (1) US4836434A (2)
EP (1) EP0203589B1 (2)
JP (1) JPS61276237A (2)
DE (1) DE3683400D1 (2)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633903B2 (ja) * 1988-04-28 1997-07-23 株式会社日立製作所 パッケージの製造方法
DE69028722T2 (de) * 1989-01-09 1997-04-17 Philips Electronics Nv Verfahren zum hermetischen Abschliessen eines Behälters
JP2647194B2 (ja) * 1989-04-17 1997-08-27 住友電気工業株式会社 半導体用パッケージの封止方法
US4895291A (en) * 1989-05-04 1990-01-23 Eastman Kodak Company Method of making a hermetic seal in a solid-state device
US5085362A (en) * 1991-01-16 1992-02-04 Atmel Corporation Gravity-held alignment member for manufacture of a leadless chip carrier
JP2933403B2 (ja) * 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
US5473814A (en) * 1994-01-07 1995-12-12 International Business Machines Corporation Process for surface mounting flip chip carrier modules
US5388755A (en) * 1994-01-28 1995-02-14 Polaroid Corp. Apparatus and method of bonding isolation grooves of a ridge wave-guide laser diode
EP0773435A3 (en) * 1995-07-21 1998-03-11 Texas Instruments Incorporated Method and devices for measuring radiation
FR2780200B1 (fr) 1998-06-22 2003-09-05 Commissariat Energie Atomique Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee
US6196446B1 (en) * 1999-09-13 2001-03-06 Lucent Technologies Inc. Automated fluxless soldering using inert gas
US6193135B1 (en) * 1999-09-13 2001-02-27 Lucent Technologies Inc. System for providing back-lighting of components during fluxless soldering
US6206276B1 (en) * 1999-09-13 2001-03-27 Lucent Technologies Inc. Direct-placement fluxless soldering using inert gas environment
JP2007180447A (ja) * 2005-12-28 2007-07-12 Toyota Industries Corp 半田付け方法、半田付け装置、及び半導体装置の製造方法
CN105097618B (zh) * 2015-07-22 2018-01-26 上海华力微电子有限公司 一种晶圆反应腔室及晶圆反应腔室之晶圆保护方法
US10115605B2 (en) * 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates
US9947560B1 (en) * 2016-11-22 2018-04-17 Xilinx, Inc. Integrated circuit package, and methods and tools for fabricating the same
JP7334053B2 (ja) * 2019-04-23 2023-08-28 三菱電機株式会社 電子部品の製造装置及び電子部品の製造方法
US11804468B2 (en) * 2021-01-15 2023-10-31 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacturing method of semiconductor package using jig
JP7360054B2 (ja) * 2021-04-27 2023-10-12 日亜化学工業株式会社 発光装置の製造方法、接合方法、及び、発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1483574A (2) * 1965-06-24 1967-09-06
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
GB1504666A (en) * 1975-03-22 1978-03-22 Gemvac Kk Vacuum power interrupter and method of making the same
JPS535570A (en) * 1976-07-05 1978-01-19 Hitachi Ltd Airtight sealing method for electronci parts
JPS5320860A (en) * 1976-08-11 1978-02-25 Hitachi Ltd Hermetic sealing method of electronic parts
US4470539A (en) * 1982-09-30 1984-09-11 Somerville Belkin Industries Limited Multi cellular divider

Also Published As

Publication number Publication date
EP0203589B1 (en) 1992-01-15
EP0203589A2 (en) 1986-12-03
EP0203589A3 (en) 1988-08-31
DE3683400D1 (de) 1992-02-27
JPS61276237A (ja) 1986-12-06
US4836434A (en) 1989-06-06

Similar Documents

Publication Publication Date Title
JPH0342700B2 (2)
US7854365B2 (en) Direct die attach utilizing heated bond head
US6265244B1 (en) Method for mounting semiconductor elements
US6068175A (en) System for replacing a first area array component connected to an interconnect board
US5878942A (en) Soldering method and soldering apparatus
JP3207149B2 (ja) 低熱伝導率のキャップを高熱伝導率の基板に固定する方法
US4481708A (en) Reduced internal temperature technique for hermetic sealing of enclosures
CN110085543B (zh) 一种功率半导体用自动固晶机及其固晶工艺
JP2006108589A (ja) 金属ケース付き電子部品の製造方法および製造装置
JPH01225140A (ja) 半導体装置の製造方法
JP2901403B2 (ja) 電子部品収納用パッケージ封止装置及び封止方法
JPH0410458A (ja) 半導体集積回路装置の製造方法および製造装置
JP2004281646A (ja) 電子部品の固着方法および固着装置
JP2000353773A (ja) 冷却部品取付方法及びモジュール封止方法
JPS60160623A (ja) 半導体装置の製造方法および製造装置
JPH1098296A (ja) 半導体パッケージ部品の実装装置
JP3166752B2 (ja) ベアチップ実装システム
JPH06302944A (ja) 電子部品半田付け装置
JPH0483363A (ja) 半導体集積回路装置およびその製造方法
JPH05191037A (ja) はんだ封止構造の開封治具
CN115255538A (zh) 真空式回焊方法及装置
JPH1197831A (ja) はんだ供給方法
JP2001024013A (ja) パッケージ封止装置
JPH0432253A (ja) 半導体集積回路装置の実装構造およびそれに用いる実装基板
JP2001127083A (ja) 半導体実装装置