JPH0343737U - - Google Patents
Info
- Publication number
- JPH0343737U JPH0343737U JP10512289U JP10512289U JPH0343737U JP H0343737 U JPH0343737 U JP H0343737U JP 10512289 U JP10512289 U JP 10512289U JP 10512289 U JP10512289 U JP 10512289U JP H0343737 U JPH0343737 U JP H0343737U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- lid
- gas vent
- resin
- mold frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図、第２図はこの考案の一実施例によるガ
ス抜穴の封止状態を示す工程図で、第１図はセン
ターが一致した場合の工程断面図、第２図は不一
致の場合の工程断面図、第３図は従来およびこの
考案共通のハイブリツドＩＣの構成斜視図、第４
図は第３図のガス抜穴を封止する時の加熱された
こて先との関連を示した断面図、第５図、第６図
は従来のガス抜穴の封止状態を示す工程図で、第
５図はこて先と蓋のセンターが一致した場合の工
程断面図、第６図はセンターが不一致の場合の工
程断面図である。
図において、３……蓋、４……ガス抜穴、５ａ
……凸部、６……こて先、７……こて先の凹部、
８……溶融スタート点、９……溶融層を示す。な
お、図中、同一符号は同一、または相当部分を示
す。
Figures 1 and 2 are process diagrams showing the sealing state of the gas vent hole according to an embodiment of this invention. Fig. 3 is a cross-sectional view of the process, and Fig. 4 is a perspective view of the configuration of a hybrid IC common to the conventional and this invention.
The figure is a sectional view showing the relationship with the heated iron tip when sealing the gas vent hole in Figure 3, and Figures 5 and 6 are process diagrams showing the conventional sealing state of the gas vent hole. FIG. 5 is a cross-sectional view of the process when the centers of the iron tip and lid match, and FIG. 6 is a cross-sectional view of the process when the centers do not match. In the figure, 3...lid, 4...gas vent hole, 5a
... Convex part, 6... Soldering tip, 7... Concave part of iron tip,
8... Melting start point, 9... Melting layer. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
補正 平１．１２．２０
実用新案登録請求の範囲を次のように補正する
。Amendment 1.12.20 Hei 1. The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
ハイブリツドＩＣの製造工程において、ハイブ
リツドＩＣを構成する樹脂により成形されたモー
ルドフレームの上部に、前記モールドフレームと
同一材料の成形された蓋をモールドフレームの上
部に塗布された樹脂にて両者を高温の条件のもと
で接着する際に、塗布された樹脂より発生するガ
スの抜穴用として蓋に設けられたガス抜穴をキユ
ア後に封止する方法として、先端部がある曲率半
径を有する凹状であり、且つ、加熱或いは瞬時加
熱こて先にて樹脂を溶融して封止する場合に、ガ
ス抜穴部の先端部形状をこて先の凹部より小さい
曲率半径の凸状にすることにより、モールドフレ
ームと蓋の接着貼合位置精度の若干のずれにおい
ても確実にこて先がガス抜穴部の先端部より最初
に接触し、穴部若しくは近傍より樹脂を溶融し、
ガス抜穴の封止を確実にすることを特徴とするハ
イブリツドＩＣ。[Claims for Utility Model Registration] In the manufacturing process of a hybrid IC, a lid made of the same material as the mold frame is applied to the top of a mold frame made of resin constituting the hybrid IC. When bonding the two with a resin under high temperature conditions, the tip part is used as a method to seal the gas vent hole provided in the lid after curing to vent the gas generated from the applied resin. It has a concave shape with a certain radius of curvature , and when the resin is melted and sealed with a heating or instantaneous heating tip, the shape of the tip of the gas vent hole is smaller than the concave part of the tip.
By making the radius of curvature convex , even if there is a slight deviation in the adhesive bonding position accuracy between the mold frame and the lid, the soldering tip will surely come into contact with the gas vent hole first from the tip, and from the hole or the vicinity. Melt the resin,
A hybrid IC characterized by ensuring gas vent holes are sealed.
Claims (1)
リツドＩＣを構成する樹脂により成形されたモー
ルドフレームの上部に、前記モールドフレームと
同一材料の成形された蓋をモールドフレームの上
部に塗布された樹脂にて両者を高温の条件のもと
で接着する際に、塗布された樹脂より発生するガ
スの抜穴用として蓋に設けられたガス抜穴をキユ
ア後に封止する方法として、先端部がある曲率半
経を有する凹状であり、且つ、加熱或いは瞬時加
熱こて先にて樹脂を溶融して封止する場合に、ガ
ス抜穴部の先端部形状をこて先の凹部より小さい
曲率半経の凸状にすることにより、モールドフレ
ームと蓋の接着貼合位置精度の若干のずれにおい
ても確実にこて先がガス抜穴部の先端部より最初
に接触し、穴部若しくは近傍より樹脂を溶融し、
ガス抜穴の封止を確実にすることを特徴とするハ
イブリツドＩＣ。 In the manufacturing process of a hybrid IC, a lid made of the same material as the mold frame is placed on top of a mold frame made of resin that makes up the hybrid IC, and a lid coated on the top of the mold frame is heated to a high temperature. As a method of sealing the gas vent hole provided in the lid after curing to vent the gas generated from the applied resin when bonding under certain conditions, a concave shape with a semicircular curvature at the tip is used. In addition, when the resin is melted and sealed with heating or an instantaneous heating iron tip, the tip of the gas vent hole should be shaped into a convex shape with a half radius of curvature smaller than the concave part of the iron tip. This ensures that even if there is a slight deviation in the precision of the adhesive bonding position between the mold frame and the lid, the tip of the soldering iron contacts the gas vent hole first, melting the resin from the hole or the vicinity.
A hybrid IC characterized by ensuring gas vent holes are sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10512289U JPH0343737U (en) | 1989-09-06 | 1989-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10512289U JPH0343737U (en) | 1989-09-06 | 1989-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343737U true JPH0343737U (en) | 1991-04-24 |
Family
ID=31653895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10512289U Pending JPH0343737U (en) | 1989-09-06 | 1989-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013084642A (en) * | 2011-10-06 | 2013-05-09 | Hitachi Automotive Systems Ltd | Resin case, manufacturing method thereof, and electronic control device using resin case |
-
1989
- 1989-09-06 JP JP10512289U patent/JPH0343737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013084642A (en) * | 2011-10-06 | 2013-05-09 | Hitachi Automotive Systems Ltd | Resin case, manufacturing method thereof, and electronic control device using resin case |
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