JPH034546A - Semiconductor mounting device - Google Patents

Abstract

PURPOSE:To press uniformly a semiconductor element and to enhance the reliability of the connection between electrodes and a wiring by a method wherein a pressurizing body is pressed by pressing bodies through O-rings. CONSTITUTION:An insulative resin 15 is applied on a part, on which a semiconductor element 13 is fixed, of a wiring board 11. Then, bump-shaped electrodes 14 of the element 13 are made to coincide with a wiring 12 on the board 11 and the element 13 is pressed to the board 11 by a pressurizing body 16. O-rings 18 are respectively made to interpose between the body 16 and pressing bodies 17, the inclination of the element 13 is absorbed by the elasticity of the O-rings 18 and the element 13 is pressed by the body 16 in a state that the element 13 is parallel to the board 11. By this pressing, the resin 15 on the wiring 12 is pushed out on the periphery of the element 13, the electrodes 14 are abutted on the wiring 12 and in this state, ultraviolet light 19 is irradiated through the body 16, the resin 15 on the peripheral edge parts of the element 13 is hardened and the element 13 is temporarily fixed on the board 11. Then, by heating the element 13 while being pressed, the electrical connection between the electrodes 14 and the wiring 12 and the mechanical maintenance of the element 13 are completed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor mounting device used in various electronic devices.

Prior Art The conventional technology will be explained with reference to FIG. 2 (IL) (b).

First, as shown in Figure 2 (&), ceramic and glass.

An insulating resin 5 is applied to the surface of a wiring board 1 made of glass epoxy or the like having conductor wiring 2. Conductor wiring 2 is cr
-mu U, mu (1, au, ito, etc.), and the resin 6 is a thermosetting type or an ultraviolet or warehouse curing type epoxy.

Silicone, acrylic, etc. Next, as shown in FIG. 2(b), the cap 4 of the semiconductor element 3 and the conductor wiring 2 are aligned, and the semiconductor element 3 is pressed against the wiring board 1 by applying pressure.

The electrode 4 is made of MuI, Mu, Cu, or the like.

At this time, the R fat 6 on the conductor wiring 2 is pushed out to the surroundings,
The electrode 4 of the semiconductor element 3 and the conductor wiring 2 are in electrical contact. Next, while the semiconductor element 3 is pressed by the pressurizing body 6, the upper part is irradiated with ultraviolet light from the outside to harden the resin 6 around the semiconductor element 3 and temporarily fix it. Furthermore, by heating the semiconductor element 3 while applying pressure), the entire resin 5 is cured, and at this time, the electrode 4 of the semiconductor element 3 and the conductor wiring 2 are cured.
An electrical connection is made by the adhesive force of the resin 6, and at the same time, the semiconductor element 3 can be fixed to the wiring board 1.

Problems to be Solved by the Invention As described above, in the conventional technology, the electrodes 4 of the semiconductor element 3 are brought into direct contact with the conductor wiring 2 of the wiring board 1, so it is difficult to mount the semiconductor element 3 with multiple terminals and a narrow pitch. However, there is a problem in that when the semiconductor element 3 is tilted with respect to the pressurizing body 6, the semiconductor element 3 is pressed unevenly, and the reliability of close reading is reduced due to the distortion. Ta.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention employs a groove structure in which the pressing part is pressed by a pressing body through an O-ring.

Effect: According to the above-mentioned groove structure, the compression strain of the O-ring, which is an elastic body, allows the pressurizing body to uniformly press the semiconductor element, resulting in highly reliable contact and reading.

Embodiment e2 Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1(&) and (b).

First, as shown in FIG. 1 (2L), epoxy or silicon is applied to the portion of the wiring board 11 made of ceramic, glass, epoxy, etc. to which the semiconductor element 13 is fixed.

An insulating resin 15 made of acrylic or the like is applied.

Note that conductor wiring 12 is provided on the wiring board 11. This conductor wiring 12Bcr-M U, Ml.

It consists of Ito et al. Next, as shown in FIG. 1(b), the protruding electrodes 14 made of Mu, Mu, Cu, etc. of the semiconductor element 13 are aligned with the conductor wiring 12, and pressure is applied by the pressurizing body 16. At this time, there is an O between the pressing body 16 and the pressing body 17.
A ring 18 is interposed, and the elasticity of the O-ring 18 absorbs one peak of the semiconductor element 13, and the pressure body 16 presses the semiconductor element 13 in a parallel state. Note that the pressurizing body 16 is formed of a transparent material such as glass or sapphire. Further, the O-ring 18 is made of an elastic material such as silicone, fluororubber, or GR. Due to the pressurization, the resin 15 on the conductor captive 12 is pushed out to the periphery, the electrode 14 and the conductor wiring 12 come into contact with each other, and in this state, ultraviolet rays 19 are irradiated through the pressurizing body 16, thereby exposing the peripheral portion of the semiconductor element 13. The supporting fat 16 is hardened and temporarily fixed. Furthermore, by heating the semiconductor element 13 while pressurizing it, the electrodes 14 of the semiconductor element 13 and the conductor wiring 12 are heated.
The electrical connection and mechanical holding of the semiconductor element 13 are completed.

By providing the ring 20 made of Fe, Mul, Cu, etc. on the pressurizing body 16, the ultraviolet 1 rays 19 reflected by the wiring board 11 deteriorate the O ring 18,
It works hard to prevent the absorption capacity from decreasing.

Effect of the invention The effects of the present invention are shown below.

(1) By uniformly applying pressure to the semiconductor element, it is possible to eliminate strain on the semiconductor element, and
The connection with the conductor arrangement s can be made highly reliable.

+2) Irradiation and pressurization of the external prisoner can be easily achieved with a groove path, making it excellent for mass production.

[Brief explanation of drawings]

FIGS. 1(2L) and (b) are cross-sectional views of a wiring board and a pressurizing body used in a semiconductor device according to an embodiment of the present invention, and FIGS. 21B (a) and (b) are both conventional techniques. FIG. 11... Circuit board, 12... Conductor wiring, 13... Semiconductor element, 14... Electrode of semiconductor element, 16... Insulating resin, 18.
...pressure body, 17...pressure body of pressurization body,
18...0 ring, 19...ultraviolet 1 ray, 20...metal ring. MI diagram

Claims (1)

[Claims] A semiconductor mounting device comprising: a pressure member having one end surface serving as a pressure surface and the other end surface serving as a surface for transmitting ultraviolet rays; and a press member that presses the pressure member against a semiconductor element via an O-ring.