JPH0345620B2 - - Google Patents

Info

Publication number
JPH0345620B2
JPH0345620B2 JP56198856A JP19885681A JPH0345620B2 JP H0345620 B2 JPH0345620 B2 JP H0345620B2 JP 56198856 A JP56198856 A JP 56198856A JP 19885681 A JP19885681 A JP 19885681A JP H0345620 B2 JPH0345620 B2 JP H0345620B2
Authority
JP
Japan
Prior art keywords
aromatic polyamide
fibers
semiconductive
carbon
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56198856A
Other languages
Japanese (ja)
Other versions
JPS58103856A (en
Inventor
Hisayasu Mitsui
Yoshuki Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56198856A priority Critical patent/JPS58103856A/en
Publication of JPS58103856A publication Critical patent/JPS58103856A/en
Publication of JPH0345620B2 publication Critical patent/JPH0345620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/32Windings characterised by the shape, form or construction of the insulation
    • H02K3/40Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Motors, Generators (AREA)

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明はスロツト放電を効果的に抑制し得る回
転機巻線に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a rotating machine winding that can effectively suppress slot discharge.

(従来の技術) 従来、回転機巻線におけるスロツト放電を抑制
する手段として、巻線のスロツト部絶縁表面にカ
ーボンブラツク等を分散させた半導体塗料を塗布
したり、あるいは該塗料をガラス若しくは不繊布
の基材に塗布して成る半導電性テープ材を巻回す
るような方法が取られている。
(Prior Art) Conventionally, as a means to suppress slot discharge in rotating machine windings, semiconductor paint in which carbon black or the like is dispersed is applied to the insulating surface of the slot portion of the winding, or the paint is coated with glass or nonwoven fabric. A method has been adopted in which a semiconductive tape material coated on a base material is wound.

(発明が解決しようとする課題) しかしながら、上述したような方法において
は、カーボンブラツクが沈殿し易いため、十分攪
拌した状態の塗料を塗り抵抗値のばらつきをなく
して所望のスロツト放電抑制層を得るための作業
が非常に煩雑となる。また、このような半導体塗
料の塗布若しくは半導電性テープ材の巻回による
方法では、巻線絶縁処理方法として一般に採用さ
れている真空加圧含浸処理方式の場合、含浸樹脂
が該塗料若しくはテープ材内部に浸透して硬化す
るため、半導電性が損なわれて所望のスロツト放
電抑制効果が発揮することができなくなる。さら
に、回転機の運転時における熱や放電により、塗
料が消耗して半導電性が損なわれスロツト放電を
効果的に抑制することができなくなるという問題
があつた。また、場合によつては半導電性物質が
含浸樹脂に溶解したものが絶縁層中に浸透し、絶
縁性能を低下させることがあつた。
(Problem to be Solved by the Invention) However, in the method described above, carbon black tends to precipitate, so it is necessary to apply a well-stirred paint to eliminate variations in resistance value and obtain the desired slot discharge suppression layer. The work involved is extremely complicated. In addition, in the method of applying a semiconductor paint or winding a semiconductive tape material, in the case of a vacuum pressure impregnation treatment method, which is generally adopted as a winding insulation treatment method, the impregnated resin is mixed with the paint or tape material. Since it penetrates into the inside and hardens, the semiconductivity is impaired and the desired slot discharge suppressing effect cannot be exerted. Furthermore, there is a problem in that the paint is consumed due to heat and discharge during operation of the rotating machine and the semiconductivity is impaired, making it impossible to effectively suppress slot discharge. Furthermore, in some cases, a semiconductive substance dissolved in the impregnating resin penetrates into the insulating layer, degrading the insulating performance.

本発明は上記のような問題を解決するために成
されたものであり、長期間安定したスロツト放電
抑制効果を保持できる回転機巻線を提供すること
を目的とする。
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a rotating machine winding that can maintain a stable slot discharge suppressing effect for a long period of time.

[発明の構成] (課題を解決するための手段) 上記の目的を達成するために、本発明の回転機
巻線は、導体に熱硬化性接着剤を含有したマイカ
テープを巻回して主絶縁層を形成した絶縁線輪の
鉄心スロツト内収納部及びその近傍に、芳香族ポ
リアミド繊維、芳香族ポリアミドフイブリツドお
よびカーボン繊維を混抄しカレンダ−処理して成
る半導電性テープ材を巻回し加熱硬化した構成と
する。また、半導電性テープ材として、導体に熱
硬化性接着剤を含有したマイカテープを巻回して
主絶縁層を形成した絶縁線輪の鉄心スロツト内収
納部及びその近傍に、芳香族ポリアミド繊維、芳
香族ポリアミドフイブリツドおよびカーボン繊維
を混抄しカレンダ−処理しさらにその表面にグラ
フトカーボン入塗料やシリコーンエラストマー等
の半導体塗料を塗布したものを用いるようにして
も上記と同様に本発明の目的を達成できる。
[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the rotating machine winding of the present invention has main insulation by winding mica tape containing a thermosetting adhesive around the conductor. A semiconductive tape material made of a mixture of aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers and calendered is wound and heated in the core slot storage area of the layered insulated wire ring and its vicinity. It has a hardened configuration. In addition, as a semiconductive tape material, aromatic polyamide fibers, The object of the present invention can also be achieved in the same manner as described above even if a material is used in which aromatic polyamide fibrid and carbon fiber are mixed, calendered, and the surface is coated with a paint containing grafted carbon or a semiconductor paint such as silicone elastomer. It can be achieved.

ここで、上記した「フイブリツド」とは、一般
に非常に細い触手状繊維質の不規則結合粒子のこ
とを言う。
Here, the above-mentioned "fibrids" generally refer to very thin tentacle-like fibrous irregularly bonded particles.

(作用) 本発明は上記のように構成されており、導体に
熱硬化性接着剤を含有したマイカテープを巻回し
て主絶縁層を形成した絶縁線輪の鉄心スロツト内
収納部及びその近傍に、芳香族ポリアミド繊維、
芳香族ポリアミドフイブリツドおよびカーボン繊
維を混抄しカレンダ−処理して成る半導電性テー
プ材を巻回し加熱硬化したことによつて、はじめ
て真空加圧含浸処理方式による含浸樹脂が半導電
性塗料若しくはテープ材内部に浸透して硬化する
のを抑制でき、さらに回転機の運転時における熱
や放電による塗料の消耗を防止できるので半導電
性が損なわれることがなく所望のスロツト放電抑
制効果を得ることができる。また、半導電性物質
が含浸樹脂に溶解して絶縁層中に浸透することも
なくなり、絶縁性能を低下させることもない。
(Function) The present invention is configured as described above, and the main insulation layer is formed by winding a mica tape containing a thermosetting adhesive around a conductor. , aromatic polyamide fiber,
By winding a semiconductive tape material made by mixing aromatic polyamide fibrils and carbon fibers and calendering the material and curing it by heating, the impregnated resin produced by the vacuum pressure impregnation process became semiconductive paint or semiconductive material. It can prevent the tape from penetrating into the inside of the tape material and hardening, and it can also prevent the paint from being consumed by heat and discharge during operation of the rotating machine, thereby achieving the desired slot discharge suppressing effect without impairing semiconductivity. I can do it. Further, the semiconductive substance does not dissolve in the impregnated resin and penetrate into the insulating layer, and the insulating performance does not deteriorate.

ここで、半導電性テープ材として芳香族ポリア
ミド繊維、芳香族ポリアミドフイブリツドおよび
カーボン繊維を混抄しカレンダ−処理したものを
用いたのは次の理由による。
The reason why a calendered mixture of aromatic polyamide fiber, aromatic polyamide fibril and carbon fiber was used as the semiconductive tape material is as follows.

カーボン繊維を用いるのは、テープを導電性
にするためである。しかしながら、カーボン繊
維のみでは導電性が良すぎるために線輪表面に
渦電流が発生し損失が増大する。本発明では導
電性を適当を適当なレベル(10〜500Ωcm)に
低下させ、このような渦電流の発生による損失
の増大を抑制するために、芳香族ポリアミド繊
維、芳香族ポリアミドフイブリツドを加えてい
るのである。
The purpose of using carbon fiber is to make the tape electrically conductive. However, since carbon fiber alone has too good conductivity, eddy currents occur on the surface of the coil, increasing loss. In the present invention, aromatic polyamide fibers and aromatic polyamide fibrils are added in order to reduce the conductivity to an appropriate level (10 to 500 Ωcm) and suppress the increase in loss due to the generation of eddy currents. -ing

絶縁物として芳香族ポリアミド繊維を用いる
のは、耐熱性があり運転中の熱による劣下が起
きず、また、柔軟であり絶縁線輪の外周に巻回
しやすいテープとするためである。しかしなが
ら、芳香族ポリアミド繊維とカーボン繊維だけ
では繊維同士の絡み合いがないためにテープが
形成できない。本発明では、これらにさらに芳
香族ポリアミドフイブリツドを加えたことによ
り、触手状繊維質のフイブリツドがカーボン繊
維および芳香族ポリアミド繊維に絡み付きテー
プにすることができるのである。
The reason why aromatic polyamide fiber is used as the insulator is that the tape is heat resistant and does not deteriorate due to heat during operation, and is flexible and can be easily wound around the outer circumference of the insulating wire. However, a tape cannot be formed using only aromatic polyamide fibers and carbon fibers because the fibers are not entangled with each other. In the present invention, by further adding aromatic polyamide fibrils to these, the tentacle-like fibrous fibrils can be entangled with carbon fibers and aromatic polyamide fibers to form a tape.

以上のような、本発明においては半導電性テー
プ材として芳香族ポリアミド繊維、芳香族ポリア
ミドフイブリツドおよびカーボン繊維を混抄しカ
レンダ−処理したものを用いたことによつて、従
来には見られない所望のスロツト放電抑制効果を
得ることができるのである。
As described above, in the present invention, by using a mixture of aromatic polyamide fibers, aromatic polyamide fibres, and carbon fibers and calendering as the semiconductive tape material, it is possible to achieve an improvement that has not been seen in the past. Therefore, it is possible to obtain the desired slot discharge suppressing effect.

(実施例) 以下、本発明の一実施例について図面を参照し
て説明する。
(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

本発明の回転機巻線は、芳香族ポリアミド繊
維、芳香族ポリアミドフイブリツド及びカーボン
繊維(10〜50重量%)を混抄しカレンダ−処理し
て成る体積抵抗率10〜500Ωcmかつ厚さ0.1〜0.25
mmの半導電性テープ材を、導体にマイカ等の主絶
縁層を形成した絶縁線輪の鉄心スロツト内に収納
される部分の外周に巻回して構成するものであ
る。
The rotating machine winding of the present invention has a volume resistivity of 10 to 500 Ωcm and a thickness of 0.1 to 500 Ωcm and is made by calendering a mixture of aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers (10 to 50% by weight). 0.25
It is constructed by winding a semiconductive tape material of mm in diameter around the outer periphery of the portion housed in the core slot of an insulated wire ring in which a main insulating layer such as mica is formed on the conductor.

ここで、主絶縁層は次のようにして形成され
る。すなわち、特公昭57−18419号公報に記載さ
れているようにガラスクロス,プラスチツクフイ
ルム,不繊布,耐熱紙などを裏打ち(補強とも呼
ぶ)した集成マイカあるいはフレークマイカに接
着剤を含浸させて成るマイカテープを巻回し、さ
らに場合によつては表面保護のためにさらにその
上からガラステープや熱収縮フイルムテープを巻
回した後、熱硬化性樹脂を真空加圧含浸して加熱
硬化する真空加圧含浸方式か、または、予めマイ
カテープの中に十分な量の接着剤を含浸させてお
き加熱加圧硬化するプリプレグ方式(レジンリツ
チ方式とも呼ぶ)で形成される。
Here, the main insulating layer is formed as follows. That is, as described in Japanese Patent Publication No. 18419/1984, mica is made by impregnating adhesive with laminated mica or flake mica lined (also called reinforced) with glass cloth, plastic film, nonwoven fabric, heat-resistant paper, etc. After winding the tape and in some cases wrapping glass tape or heat shrink film tape over it to protect the surface, vacuum pressure impregnation with thermosetting resin and heat curing is performed. It is formed by an impregnation method or a prepreg method (also called a resin rich method) in which mica tape is impregnated with a sufficient amount of adhesive in advance and cured under heat and pressure.

なお、主絶縁層と半導電性テープ材との間の接
着は一般に次の方法で行われている。
Note that bonding between the main insulating layer and the semiconductive tape material is generally performed by the following method.

主絶縁層を形成した後に主絶縁層の表面に接
着剤を塗布し半導電性テープを巻回し接着剤を
硬化する。
After forming the main insulating layer, an adhesive is applied to the surface of the main insulating layer, a semiconductive tape is wound around the adhesive, and the adhesive is cured.

プリプレグ方式の場合、半導電性テープを接
着剤塗布しないで主絶縁層上に巻回した後、加
熱加圧硬化時に半導電性テープから接着剤を滲
み出させ主絶縁層と一体に接着硬化させる。
In the case of the prepreg method, the semiconductive tape is wound on the main insulating layer without applying adhesive, and then the adhesive oozes out from the semiconductive tape during heat and pressure curing, and the adhesive is cured integrally with the main insulating layer. .

主絶縁層上に半導電性テープ接着剤を塗布し
ないで巻回した後、熱硬化性樹脂を真空加圧含
浸し、しかる後に半導電性テープと主絶縁層を
一体的に加熱加圧硬化する。
After winding the semiconductive tape on the main insulating layer without applying adhesive, it is impregnated with a thermosetting resin under vacuum pressure, and then the semiconductive tape and the main insulating layer are cured together under heat and pressure. .

さて、芳香族ポリアミド繊維、芳香族ポリアミ
ドフイブリツドおよびカーボン繊維を混抄しカレ
ンダー処理して成る半導電性テープ材は、カーボ
ン繊維の量を増すにつれ抵抗値を小さくすること
ができる。スロツト放電を抑制するために102
104Ωの表面抵抗となるようカーボン繊維を混抄
する。ここで、カレンダー処理するのは芳香族ポ
リアミド繊維、芳香族ポリアミドフイブリツドお
よびカーボン繊維間の絡み合いを押圧することに
よつて強固に結合させ、後にマイカテープ中の接
着剤や含浸樹脂が半導電性テープ中に浸透しても
カーボン繊維間同士が離問することがないので、
抵抗値が変化することがないためである。
Now, in a semiconductive tape material made by mixing aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers and calendering the same, the resistance value can be decreased as the amount of carbon fibers is increased. 10 2 to suppress slot discharge
Carbon fiber is mixed to give a surface resistance of 10 4 Ω. Here, the calendering process is performed by pressing the entanglements between the aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers to firmly bond them, and then the adhesive and impregnated resin in the mica tape become semiconductive. Even if the carbon fibers penetrate into the tape, the carbon fibers will not separate from each other.
This is because the resistance value does not change.

また、芳香族ポリアミド繊維、芳香族ポリアミ
ドフイブリツドおよびカーボン繊維は回転機巻線
が運転中に受ける熱や機械的振動および部分放電
に対しても安定であり、また、導電性物質である
カーボンが繊維状になつて芳香族ポリアミド繊維
や芳香族ポリアミドフイブリツドに拘束されてい
るため、カーボン紛末を接着剤に混合した従来の
半導電性塗料のように熱劣化や振動劣化、部分放
電劣化を受けて徐々に絶縁表面から脱落、消耗す
ることがなく、長期間安定な部分放電抑制効果を
維持することができる。
In addition, aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers are stable against the heat, mechanical vibrations, and partial discharges that rotating machine windings receive during operation. Because it becomes fibrous and is bound by aromatic polyamide fibers and aromatic polyamide fibrils, it does not suffer from thermal deterioration, vibration deterioration, and partial discharge like conventional semiconductive paints that mix carbon powder with adhesive. It does not gradually fall off or wear out from the insulating surface due to deterioration, and can maintain a stable partial discharge suppressing effect for a long period of time.

ところで、巻線は次の3通りの手段により構成
される。
By the way, the winding is constructed by the following three methods.

(1) エポキシ樹脂、ポリアミド樹脂等の熱硬化性
接着剤を30〜50重量%含有したガラス繊布補強
マイカテープを導体に巻回した絶縁線輪表面の
鉄心スロツト内に収納させる部分の外周および
その両端部の約30mm外側までに、上記半導電性
テープ材を連続的付合わせ巻きにて巻回する。
しかる後、巻線直線部をホツトプレスに納めて
150℃で2時間加熱加圧硬化する。
(1) The outer periphery of the part of the insulated wire ring surface to be housed in the core slot, where glass fiber reinforced mica tape containing 30 to 50% by weight of thermosetting adhesive such as epoxy resin or polyamide resin is wound around the conductor. The above semiconductive tape material is continuously wound around 30 mm outside of both ends.
After that, the straight part of the winding is placed in a hot press.
Heat and pressure cure at 150℃ for 2 hours.

(2) 上記熱硬化性接着剤を10〜20重量%含有した
ガラス繊布補強マイカテープを導体に巻回した
絶縁線輪の表面に、上記第1項と同様に上記半
導電性テープ材を巻回する。しかる後、各線輪
を真空タンク内に納め減圧脱気後、絶縁層にエ
ポキシ樹脂等の熱硬化性樹脂を加圧含浸し、こ
れを真空タンクより取り出し加熱硬化して所望
の巻線を得る。
(2) The above semiconductive tape material is wrapped in the same manner as in item 1 above on the surface of an insulated wire ring made by winding a glass fiber reinforced mica tape containing 10 to 20% by weight of the above thermosetting adhesive around a conductor. Turn. Thereafter, each wire ring is placed in a vacuum tank, degassed under reduced pressure, and then the insulating layer is impregnated with a thermosetting resin such as an epoxy resin under pressure, and this is taken out from the vacuum tank and heated and cured to obtain the desired winding wire.

(3) 第1図に示すように上記(2)項と同一材料構成
のマイカテープ1を導体2に巻回し、かつその
表面に上記同様の半導電性テープ材3を巻回す
る。しかる後、これを鉄心(スロツト)4に収
納し鉄心と一体で絶縁線輪に熱硬化性樹脂5を
真空加圧含浸して加熱硬化する。いわゆる全含
浸処理を行う。
(3) As shown in FIG. 1, a mica tape 1 having the same material composition as in item (2) above is wound around a conductor 2, and a semiconductive tape material 3 similar to the above is wound around the surface of the mica tape 1. Thereafter, this is housed in an iron core (slot) 4, and the insulated wire ring is impregnated with a thermosetting resin 5 under vacuum pressure and cured by heating. A so-called total impregnation process is performed.

かかる3通りの手段において、先ず、(1)の如く
して得られた本発明に係る回転機巻線は、半導電
性テープ材が芳香族ポリアミド繊維、芳香族ポリ
アミドフイブリツドおよびカーボン繊維を混抄し
カレンダ−処理して形成されているため、従来の
カーボンブラツクを分散した塗料を塗布して形成
した半導電層が、155℃の雰囲気で5KV/mmの電
界下で10000時間課電後には熱劣下や部分放電劣
下などにより消耗してスロツト放電抑制効果が消
失していたのに対し、このような熱劣化や部分放
電劣化がほとんどなく初期時と変わらない部分放
電抑制効果を有することが判つた。
In these three methods, first, in the rotating machine winding according to the present invention obtained as in (1), the semiconductive tape material contains aromatic polyamide fibers, aromatic polyamide fibrids, and carbon fibers. Because it is formed by mixing paper and calendering, the semiconductive layer formed by applying a conventional carbon black-dispersed paint will not work after being charged for 10,000 hours under an electric field of 5KV/mm in an atmosphere of 155℃. Whereas the slot discharge suppressing effect was lost due to wear and tear due to thermal deterioration and partial discharge deterioration, this kind of thermal deterioration and partial discharge deterioration is almost absent, and the partial discharge suppressing effect remains unchanged from the initial stage. I found out.

また、(2)の如くして得られた本発明に係る回転
機巻線は、半導電性テープ材が芳香族ポリアミド
繊維、芳香族ポリアミドフイブリツドおよびカー
ボン繊維を混抄しカレンダ−処理して形成されて
いるため、従来のカーボンブラツク入塗料を塗布
したテープを巻回したものが、樹脂の含浸硬化に
より絶縁抵抗が異常に増大してスロツト放電抑制
効果がなかつたのに対し、樹脂の含浸硬化による
半導電層の絶縁抵抗がほとんど変わらず、十分な
放電抑制効果を有することが判つた。
In addition, in the rotating machine winding according to the present invention obtained as in (2), the semiconductive tape material is prepared by mixing aromatic polyamide fiber, aromatic polyamide fibre, and carbon fiber and calendering the semiconductive tape material. As a result, conventional tapes coated with carbon black paint had an abnormally increased insulation resistance due to resin impregnation and hardening, and had no effect on suppressing slot discharge. It was found that the insulation resistance of the semiconductive layer did not change much due to curing, and it had a sufficient discharge suppressing effect.

さらに、(3)の如くして得られた本発明に係る回
転機巻線の電圧−tanσ特性は第2図のBにて示
すようになり、半導電性テープ材をが芳香族ポリ
アミド繊維、芳香族ポリアミドフイブリツドおよ
びカーボン繊維を混抄しカレンダ−処理して形成
したことによつて、同図Aにて示す従来のものに
比べて、著しくスロツト放電抑制効果が向上して
いることが判つた。
Furthermore, the voltage-tanσ characteristic of the rotating machine winding according to the present invention obtained as in (3) is shown in B in FIG. It was found that by forming a paper by mixing aromatic polyamide fibrils and carbon fibers and calendering it, the slot discharge suppressing effect was significantly improved compared to the conventional one shown in Figure A. Ivy.

なお、本発明は上記実施例に限定されるもので
はない。
Note that the present invention is not limited to the above embodiments.

例えば、前記(3)において半導電性テープ材とし
て、前記組成の半導電性テープにグラフトカーボ
ン入り塗料やシリコーンエラストマー、若しくは
シリコーンゴム100部とカーボン25〜100部を混合
したもの等の、含浸樹脂に対して抵抗変化の少な
い半導体塗料を塗布したものを使用すれば、鉄心
と半導電層との接触をより一層改善でき、特に製
造初期における電圧−tanσ特性が第2図のCに
て示すように改善することができる。
For example, in (3) above, as the semiconductive tape material, a semiconductive tape having the above composition is mixed with a paint containing grafted carbon, a silicone elastomer, or a mixture of 100 parts of silicone rubber and 25 to 100 parts of carbon, or an impregnated resin. The contact between the iron core and the semiconducting layer can be further improved by using a semiconductor paint coated with a semiconductor coating with little resistance change.Especially, the voltage-tanσ characteristic at the early stage of manufacturing is as shown in C in Figure 2. can be improved.

その他、本発明はその要旨を変更しない範囲で
種々変形して実施することができる。
In addition, the present invention can be implemented with various modifications without changing the gist thereof.

[発明の効果] 以上説明したように本発明によれば、導体に熱
硬化性接着剤を含有したマイカテープを巻回して
主絶縁層を形成した絶縁線輪の鉄心スロツト内収
納部及びその近傍に、芳香族ポリアミド繊維、芳
香族ポリアミドフイブリツドおよびカーボン繊維
を混抄しカレンダ−処理して成る半導電性テープ
材を巻回し加熱硬化したので、半導電性塗料が含
浸樹脂に溶けて絶縁性能を低下させることがなく
長期間安定してスロツト放電抑制効果のある回転
機巻線を提供することができる。
[Effects of the Invention] As explained above, according to the present invention, the main insulation layer is formed by winding a mica tape containing a thermosetting adhesive around a conductor, and the storage area in the core slot of the insulated coil and the vicinity thereof. Then, a semiconductive tape material made by mixing aromatic polyamide fibers, aromatic polyamide fibrils, and carbon fibers and calendering was wound and heated to harden the semiconductive paint, which melts into the impregnated resin and improves insulation performance. It is possible to provide a rotating machine winding that has a stable slot discharge suppressing effect over a long period of time without reducing the

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の回転機巻線の一実施例を示す
縦断面図、第2図は同巻線の電圧−tanσ特性図
である。 1……マイカテープ、2……導体、3……半導
電性テープ、4……鉄心、5……熱硬化性樹脂。
FIG. 1 is a longitudinal cross-sectional view showing an embodiment of the rotating machine winding of the present invention, and FIG. 2 is a voltage-tanσ characteristic diagram of the same winding. DESCRIPTION OF SYMBOLS 1... Mica tape, 2... Conductor, 3... Semiconductive tape, 4... Iron core, 5... Thermosetting resin.

Claims (1)

【特許請求の範囲】 1 導体に熱硬化性接着剤を含有したマイカテー
プを巻回して主絶縁層を形成した絶縁線輪の鉄心
スロツト内収納部及びその近傍に、芳香族ポリア
ミド繊維、芳香族ポリアミドフイブリツドおよび
カーボン繊維を混抄しカレンダ−処理して成る半
導電性テープ材を巻回し加熱硬化したことを特徴
とする回転機巻線。 2 導体に熱硬化性接着剤を含有したマイカテー
プを巻回して主絶縁層を形成した絶縁線輪の鉄心
スロツト内収納部及びその近傍に、芳香族ポリア
ミド繊維、芳香族ポリアミドフイブリツドおよび
カーボン繊維を混抄しカレンダ−処理しさらにそ
の表面にグラフトカーボン入塗料やシリコーンエ
ラストマー等の半導体塗料を塗布して成る半導電
性テープ材を巻回し加熱硬化したことを特徴とす
る回転機巻線。
[Scope of Claims] 1. Aromatic polyamide fibers, aromatic A rotating machine winding wire characterized in that a semiconductive tape material made of a mixture of polyamide fibrils and carbon fibers and calendered is wound and heat-cured. 2. Aromatic polyamide fibers, aromatic polyamide fibrils, and carbon are placed in the storage area in the core slot of the insulated wire ring, which is formed by winding mica tape containing a thermosetting adhesive around the conductor to form the main insulation layer, and in the vicinity thereof. A rotary machine winding characterized in that a semiconductive tape material made by mixing fibers, calendering the paper, and further applying a graft carbon-containing paint or a semiconductor paint such as a silicone elastomer on the surface thereof is wound and cured by heating.
JP56198856A 1981-12-10 1981-12-10 Winding device for rotary electric machine Granted JPS58103856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56198856A JPS58103856A (en) 1981-12-10 1981-12-10 Winding device for rotary electric machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56198856A JPS58103856A (en) 1981-12-10 1981-12-10 Winding device for rotary electric machine

Publications (2)

Publication Number Publication Date
JPS58103856A JPS58103856A (en) 1983-06-21
JPH0345620B2 true JPH0345620B2 (en) 1991-07-11

Family

ID=16398042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56198856A Granted JPS58103856A (en) 1981-12-10 1981-12-10 Winding device for rotary electric machine

Country Status (1)

Country Link
JP (1) JPS58103856A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5679419A (en) * 1979-12-04 1981-06-30 Hitachi Ltd Manufacture of electrically insulated winding

Also Published As

Publication number Publication date
JPS58103856A (en) 1983-06-21

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