JPH0345646U - - Google Patents
Info
- Publication number
- JPH0345646U JPH0345646U JP10706089U JP10706089U JPH0345646U JP H0345646 U JPH0345646 U JP H0345646U JP 10706089 U JP10706089 U JP 10706089U JP 10706089 U JP10706089 U JP 10706089U JP H0345646 U JPH0345646 U JP H0345646U
- Authority
- JP
- Japan
- Prior art keywords
- mini
- embossed tape
- mold transistor
- mold
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の実施例１を示す構成図、第２
図は特性測定部を示す断面図、第３図は実施例２
の測定ユニツトを示す構成図、第４図は従来の半
導体用テーピング装置に係る測定部を示す断面図
、第５図はエンボステープへ挿入されたミニモー
ルドトランジスタを示す平面図である。
１……ミニモールドトランジスタ、２……モー
ルド、３……吸着ノズル、４……測定ベース、５
……プローブ、６……リード、７……エンボステ
ープ、８……プローブホルダ、９……エアシリン
ダ、１０……ヘツド、１１……測定ユニツト、１
２……良品入ステイツク、１３……不良品排出チ
ユーブ、１４……良品供給ノズル、１５……不良
品排出ノズル。
Fig. 1 is a configuration diagram showing the first embodiment of the present invention;
The figure is a sectional view showing the characteristic measurement part, and Figure 3 is Example 2.
FIG. 4 is a cross-sectional view showing a measuring section of a conventional semiconductor taping device, and FIG. 5 is a plan view showing a mini-molded transistor inserted into an embossed tape. 1... Mini mold transistor, 2... Mold, 3... Adsorption nozzle, 4... Measurement base, 5
... Probe, 6 ... Lead, 7 ... Embossed tape, 8 ... Probe holder, 9 ... Air cylinder, 10 ... Head, 11 ... Measurement unit, 1
2... Good product receiving station, 13... Defective product discharge tube, 14... Good product supply nozzle, 15... Defective product discharge nozzle.
Claims (1)
おいて、ミニモールドトランジスタのエンボステ
ープへの挿入後、エンボステープ上でミニモール
ドトランジスタの電気的特性の測定を行う機構と
、特性不良品をエンボステープ上から抜き取り、
その特性不良品に代えて特性良品を補給する機構
とを有することを特徴とする半導体用テーピング
装置。 The mini-mold transistor taping device includes a mechanism that measures the electrical characteristics of the mini-mold transistor on the embossed tape after inserting the mini-mold transistor into the embossed tape, and a mechanism that measures the electrical characteristics of the mini-mold transistor on the embossed tape, and extracts products with defective characteristics from the embossed tape.
1. A semiconductor taping device characterized by having a mechanism for supplying a product with good characteristics in place of the product with defective characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10706089U JPH0345646U (en) | 1989-09-12 | 1989-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10706089U JPH0345646U (en) | 1989-09-12 | 1989-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345646U true JPH0345646U (en) | 1991-04-26 |
Family
ID=31655778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10706089U Pending JPH0345646U (en) | 1989-09-12 | 1989-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345646U (en) |
-
1989
- 1989-09-12 JP JP10706089U patent/JPH0345646U/ja active Pending
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