JPH0345703B2 - - Google Patents

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Publication number
JPH0345703B2
JPH0345703B2 JP5725184A JP5725184A JPH0345703B2 JP H0345703 B2 JPH0345703 B2 JP H0345703B2 JP 5725184 A JP5725184 A JP 5725184A JP 5725184 A JP5725184 A JP 5725184A JP H0345703 B2 JPH0345703 B2 JP H0345703B2
Authority
JP
Japan
Prior art keywords
core wire
surface layer
metal base
base material
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5725184A
Other languages
Japanese (ja)
Other versions
JPS60201942A (en
Inventor
Hironobu Hasegawa
Kazuma Miki
Hideki Tamaya
Takemitsu Kosuge
Jun Fujimoto
Masao Nakazato
Itsuo Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishifuku Metal Industry Co Ltd
Original Assignee
Ishifuku Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishifuku Metal Industry Co Ltd filed Critical Ishifuku Metal Industry Co Ltd
Priority to JP5725184A priority Critical patent/JPS60201942A/en
Publication of JPS60201942A publication Critical patent/JPS60201942A/en
Publication of JPH0345703B2 publication Critical patent/JPH0345703B2/ja
Granted legal-status Critical Current

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  • Other Surface Treatments For Metallic Materials (AREA)
  • Eyeglasses (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】 <産業上の利用分野> 開示技術は、時計バンド、メガネフレーム等の
金属加工装飾材料の構造の技術分野に属する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The disclosed technology belongs to the technical field of the structure of metalwork decorative materials such as watch bands and eyeglass frames.

<要旨の概要> 而して、この出願の発明は、時計バンドやメガ
ネフレーム等の装飾金属材料に用いる基材材料
で、軽量化を図るTi金属基材に対してNi金属や
Pd金属等の中間材、表層材を添設して一体結合
したTi芯線材に関する発明であり、特に、Ti金
属基材の全表面の少くとも一部、或は、全体に於
いてその添設面にラビリンス状の係合溝が周方向
所定ピツチで穿設され、これに対し表層材がその
内面に該係合溝に対応的に突出部を形成するか、
又は、溝材を介し該Ti金属基材に機械的、及び、
金属的に緊結され、その結合状態を強固にされて
おり、更に、該係合溝と上記表層材、又は、溝材
との間にAg等の金属メツキ層を介して結合され、
或は、更に又、該表層材の表面に金等の貴金属合
金がクラツドされたり、金属メツキが施されたり
しているTi芯線材に係る発明である。
<Summary of the Summary> The invention of this application is a base material used for decorative metal materials such as watch bands and eyeglass frames, and is a material that uses Ni metal or Ni metal to reduce weight.
This invention relates to a Ti core wire that is integrally bonded with an intermediate material such as Pd metal and a surface layer material, and in particular, the invention relates to a Ti core wire that is integrally bonded with an intermediate material such as Pd metal and a surface layer material, and in particular, the addition of the material on at least a part of the entire surface of a Ti metal base material or the entire surface. Labyrinth-like engagement grooves are bored in the surface at a predetermined pitch in the circumferential direction, and the surface material forms protrusions corresponding to the engagement grooves on the inner surface, or
Alternatively, the Ti metal base material is mechanically and
are metallically connected to strengthen the bonded state, and are further bonded via a metal plating layer such as Ag between the engaging groove and the surface material or groove material,
Alternatively, the invention relates to a Ti core wire material in which the surface of the surface layer material is clad with a noble metal alloy such as gold or plated with metal.

<従来の技術> 周知の如く、時計バンドやメガネフレーム等に
は装飾機能が求められるようになり、かかる需要
に対しそれらの意匠性を高めるようにされ、これ
らに応え得る金属材料の芯線材が用いられるよう
になつてきている。
<Prior art> As is well known, decorative functions are now required for watch bands, eyeglass frames, etc., and in response to this demand, efforts have been made to improve their design, and core wire materials made of metal materials that can meet these demands have been developed. It is starting to be used.

又、軽量化を要求される一般工業材料、特に、
ろう付けを必要とする材料においては、Tiやそ
の合金等のTi金属が広く用いられており、具体
的な態様としては基材に表層材を強度を高くして
接合されたクラツド材料として用いられているこ
とは、例えば、実開昭56−50629号公報考案、特
開昭57−91891号公報発明等に示されている様に
周知の技術である。
In addition, general industrial materials that require weight reduction, especially
For materials that require brazing, Ti metals such as Ti and its alloys are widely used, and in a specific embodiment, they are used as cladding materials in which a surface material is bonded to a base material with high strength. This is a well-known technique as disclosed in, for example, the invention disclosed in Japanese Utility Model Application Publication No. 56-50629 and the invention disclosed in Japanese Patent Application Publication No. 57-91891.

即ち、Tiの比重は、従来のこの種金属の洋白、
モネル、Ni基系の合金に比して約半分程度であ
つて、極めて軽量であり、特に、メガネフレーム
や時計バンド等身体に携行する場合の装着性の良
さ、或は、馴染み性の良さがあり、又、強度も充
分にあつて実用性に耐えられるものであり、一
方、自動車部品や電気材料等その軽量性と強度性
の優れている等から各方面のニーズにかなつて広
く採用されている。
In other words, the specific gravity of Ti is the same as that of conventional nickel silver of this type of metal.
It is extremely lightweight, about half the weight of Monel or Ni-based alloys, and is particularly easy to wear when carried on the body, such as in eyeglass frames or watch bands, and has good fit. Moreover, it is strong enough to withstand practical use, and on the other hand, it is widely adopted to meet the needs of various fields such as automobile parts and electrical materials due to its light weight and excellent strength. There is.

<発明が解決しようとする課題> 而して、該種従来態様のTi芯線材においては、
基本的にTi基材に対してNi等の表層材を単なる
クラツド加工による一体結合の態様が一般技術と
して採用されていることから、第1図に示す様
に、軽量Ti金属材料1においてはTi基材2と表
層材3との間の界面4に剥離現象が生ずることが
しばしばあり、そのため歩留りの点等から見ても
コスト的に合わず、日常使用に耐え得ず、実用に
は向かないという不具合があつた。
<Problem to be solved by the invention> Therefore, in the Ti core wire of the conventional embodiment,
Basically, a method of integrally bonding a surface layer material such as Ni to a Ti base material by simply cladding is adopted as a general technology, so as shown in Fig. 1, lightweight Ti metal material 1 uses Ti. Peeling phenomenon often occurs at the interface 4 between the base material 2 and the surface layer material 3, and as a result, it is not cost-effective in terms of yield, etc., and cannot withstand daily use, making it unsuitable for practical use. There was a problem.

このことは芯線材についても同様であつた。 The same was true for the core wire.

蓋し、Ti金属が本来的に活性化金属であるこ
とから他の金属との冶金的反応が極めて顕著であ
り、場合によると共晶反応等によつて展延性に乏
しくなり、脆い金属間化合物層が接合境界に形成
されることによつて高い強度が得難く、特に、ろ
う付け時の高温にさらされると、このような不具
合が生じ易い虞があるからである。
However, since Ti metal is inherently an active metal, metallurgical reactions with other metals are extremely pronounced, and in some cases, eutectic reactions may cause poor malleability and brittle intermetallic compounds. This is because it is difficult to obtain high strength due to the formation of the layer at the bonding boundary, and there is a possibility that such problems are likely to occur particularly when exposed to high temperatures during brazing.

このため、装飾金属を必要とする工芸品や小型
の軽量精密機械、電子部品等を用いる業界におい
てはTi金属材による芯線材を用いてもTi金属本
来のメリツトが充分に生かされず、その良さが確
実に利用されないという不利点があつた。
For this reason, in industries that use decorative metals such as crafts, small lightweight precision machines, and electronic parts, even if core wires made of Ti metal are used, the inherent merits of Ti metal cannot be fully utilized. The disadvantage was that it would not be used reliably.

又、Ti金属の基材に対して間に所定の中間層
を介在させてその外側に表層材をクラツドするよ
うな技術も採用されないことはないが、それらの
金属の組合せには限度があり、自由度が少ないと
いう不具合があるうえに、コスト的に高くついて
採算に合わないというデメリツトがあつた。
In addition, it is possible to adopt a technique in which a predetermined intermediate layer is interposed between a Ti metal base material and a surface layer material is clad on the outside, but there are limits to the combinations of these metals. In addition to the disadvantage of having little flexibility, it also had the disadvantage of being expensive and unprofitable.

<発明の目的> この出願の発明の目的は上述従来技術に基づく
Ti金属芯線材のTi金属基材に対し表層材を直接
に、或いは、中間層を介して添設一体結合するに
際してのTi金属本来の軽量性の良さを削減する
Ti芯線材の問題点を解決すべき技術的課題とし、
簡易ではあるが、合理的な設計によりTi金属基
材に対して表層材の接合強度を高くし、Ti金属
本来の軽量性の良さを充分に発揮させ、而も、量
産性において確実に実用化が出来、その加工性も
何等阻害することがないようにし、最終製品の意
匠性も高められるようにして金属製品製造産業に
おける複合層金属加工技術利用分野に益する優れ
たTi芯線材を提供せんとするものである。
<Object of the invention> The object of the invention of this application is based on the above-mentioned prior art.
To reduce the inherent lightness of Ti metal when attaching and integrally bonding the surface layer material to the Ti metal base material of the Ti metal core wire directly or via an intermediate layer.
We consider the problems of Ti-core wire as a technical issue to be solved,
Although it is simple, it has a rational design that increases the bonding strength of the surface layer material to the Ti metal base material, fully demonstrates the inherent lightness of Ti metal, and also ensures practical use in mass production. We aim to provide an excellent Ti-core wire material that can be used in the field of composite layer metal processing technology in the metal product manufacturing industry by making it possible to do so without impeding its workability in any way and enhancing the design of the final product. That is.

<課題を解決するための手段・作用> 上述目的に沿い先述特許請求の範囲を要旨とす
るこの出願の発明の構成は、前述課題を解決する
ためにTi、或は、Ti合金のTi金属基材をその全
表面の表層材添設表面の周方向に所定ピツチラビ
リンス状等の係合溝の複数を所定サイズに穿設
し、一方、閉断面の表層材においてはその内側に
該係合溝に対応する係合突出部を予め形成させて
おき、該係合溝と突出部の係合結合により両者を
一体添設するか、又は、突出部を形成することな
く、所定の溝材を該係合溝に締結させ、これを介
して表層材を一体添設し、或は、該係合溝に金属
メツキ層を介装させた後に表層材を該係合溝に突
出部を直接、又は、溝材を介しての結合により一
体結合させ、更には、このようにしてTi金属基
材に対して表層材を一体結合した後該表層材の外
側面に貴金属合金をクラツドしたり、又は、貴金
属メツキを施すようにしたりする技術的手段を講
じたものである。
<Means and effects for solving the problem> In accordance with the above-mentioned object, the structure of the invention of this application, which is summarized in the above-mentioned claims, is to solve the above-mentioned problem by using a Ti metal base of Ti or a Ti alloy. A plurality of engagement grooves such as a predetermined tight labyrinth shape are bored in the circumferential direction of the entire surface of the material to a predetermined size, and on the other hand, in the surface material with a closed cross section, the engagement grooves are formed inside the surface material. Either a corresponding engagement protrusion is formed in advance and the engagement groove and the protrusion are coupled together to attach them together, or a predetermined groove material is attached to the engagement groove without forming the protrusion. The surface material is fastened to the engagement groove and the surface material is integrally attached thereto, or the protrusion is directly attached to the surface material after the metal plating layer is interposed in the engagement groove, or , after integrally bonding the surface layer material to the Ti metal base material in this way by bonding via the groove material, cladding the outer surface of the surface layer material with a noble metal alloy, or Technical measures such as precious metal plating were taken.

<実施例> 次に、この出願の発明の実施例を第2図以下の
図面に基づいて説明すれば以下の通りである。
<Example> Next, an example of the invention of this application will be described below based on the drawings from FIG. 2 onwards.

先ず、基本態様としてTi金属基材2′の表層材
添設面に、第2,3,4図に示す様に、角ノツチ
型、ラウンド型、アンダハング型等の所定断面形
状の係合溝5,5′,5″を押出し加工、圧延加
工、切削加工、放電加工等の所定の適宜加工手段
を介して穿設する。
First, as a basic embodiment, an engagement groove 5 having a predetermined cross-sectional shape such as a square notch type, a round type, an underhang type, etc. is formed on the surface material attachment surface of the Ti metal base material 2', as shown in FIGS. 2, 3, and 4. , 5', 5'' are bored through a predetermined appropriate processing means such as extrusion, rolling, cutting, electrical discharge machining, etc.

而して、該係合溝5,5′,5″についてそれら
の形状、サイズピツチ等は設計に従つて適宜に形
成する。
The shape, size pitch, etc. of the engaging grooves 5, 5', 5'' are appropriately formed according to the design.

そして、Ti金属基材2′について表層材添設面
を弗化物を主成分とする水溶液中に所定時間浸漬
させて表面活性状態維持のために表面に覆れてい
る酸化被膜を溶解除去する。
Then, the surface of the Ti metal base material 2' to which the surface layer material is applied is immersed in an aqueous solution containing fluoride as a main component for a predetermined period of time to dissolve and remove the oxide film covering the surface in order to maintain the surface active state.

尚、設計によつては酸化皮膜除去処理後、新し
い酸化皮膜の実質的形成前に直ちにAg、Ni、
Cu、Pd、Cr、Sn、又はそれらの合金のメツキ溶
中に所定に浸漬させて化学メツキ、或は、通電し
て電気メツキを行い金属メツキ層を所定厚さに薄
く形成させる。
Depending on the design, Ag, Ni,
A thin metal plating layer is formed to a predetermined thickness by immersing it in a plating solution of Cu, Pd, Cr, Sn, or an alloy thereof for chemical plating, or by applying electricity to perform electroplating.

而して、一方では表層材としての所定の金属を
Ti金属基材2′の係合溝5,5′,5″に係合させ
る突出部を押出し加工、圧延、切削加工、放電加
工等の所定の加工手段により形成させておき、そ
こで表層材をしてTi金属基材に係合溝5,5′,
5″と突出部を係合させることにより両者を緊結
させる。
On the other hand, if a certain metal is used as the surface material,
The protrusions to be engaged with the engagement grooves 5, 5', 5'' of the Ti metal base material 2' are formed by a predetermined processing method such as extrusion, rolling, cutting, electrical discharge machining, etc., and then the surface material is Then, the engagement grooves 5, 5',
5'' and the protrusion, the two are tightly connected.

そして、上記突出部の形状加工を施すことな
く、係合溝5,5′,5″に溝材を係合させて表層
材を添設させ、次いでダイス、圧延、鍛造等の手
段を介して密着緊結させる。
Then, without processing the shape of the protrusion, the groove material is engaged with the engagement grooves 5, 5', 5'' to attach the surface material, and then the surface material is attached by means of dies, rolling, forging, etc. Make a close connection.

更に、必要に応じてArガス、若しくは、真空
等の雰囲気中で600℃〜900℃間の所定温度で所定
時間熱拡散処理させることにより、両者の緊密結
合を促進させることも設計的に可能である。
Furthermore, if necessary, it is possible by design to promote tight bonding between the two by performing thermal diffusion treatment at a predetermined temperature between 600°C and 900°C for a predetermined time in an atmosphere such as Ar gas or vacuum. be.

この場合、600℃以下では拡散が充分に行われ
ず、900℃以上では拡散層の増量が進み過ぎて後
工程における加工が好ましくないからである。
In this case, if the temperature is below 600°C, diffusion will not be sufficient, and if it is above 900°C, the amount of the diffusion layer will increase too much, making processing in subsequent steps undesirable.

而して、第5図に示す実施例は、代表的な芯線
材の態様であり、Ti金属基材2′を断面円形状に
し、その外側面に所定ピツチで多数のラビリンス
状の係合溝5,5…を穿設し、一方、断面リング
状の表層材6の内面には該係合溝5,5…に対応
する突出部7,7…を突出形成させて、前述の如
き適宜手段により両者を緊結させたTi芯線材8
とした態様であり、第6,7図に示す実施例は上
述実施例を二次的に異形加工した態様であり、相
互には目的に応じた設計例である。
The embodiment shown in FIG. 5 is a typical embodiment of the core wire material, in which the Ti metal base material 2' has a circular cross section, and a large number of labyrinth-like engagement grooves are formed at a predetermined pitch on the outer surface of the Ti metal base material 2'. 5, 5... are bored, and on the other hand, protrusions 7, 7... corresponding to the engagement grooves 5, 5... are formed projecting from the inner surface of the surface material 6 having a ring-shaped cross section. Ti core wire rod 8 with which both are bonded together.
The embodiment shown in FIGS. 6 and 7 is a second modified form of the above-mentioned embodiment, and both are design examples depending on the purpose.

又、第8図に示す実施例は、断面円形のTi金
属基材2′の外周面に、前述の如く、係合溝5,
5…を穿設形成し、その後に所定金属メツキ層9
を形成させた後に該係合溝5,5に対応する突出
部7,7…を有する断面リング状の表層材6を該
係合溝5,5…、突出部7,7の相互の緊結係合
を介して一体添設させた芯線材の態様であり、
又、第9図に示す実施例は、上述第6図に示した
Ti芯線材81の表層材6の表面に、更に、貴金
属合金10をクラツドさせた異形材81′の線材
の態様例であり、第10図に示す実施例は、同じ
く前述第7図に示した実施例のTi金属基材8
1′の表層材6の表面に貴金属メツキ層11を施
してクラツドした線材81の態様である。
In addition, in the embodiment shown in FIG. 8, the engagement grooves 5,
5... is formed by drilling, and then a predetermined metal plating layer 9 is formed.
After forming the surface material 6 having a ring-shaped cross section having protrusions 7, 7 corresponding to the engagement grooves 5, 5, the engagement grooves 5, 5... and the protrusions 7, 7 are tightly engaged with each other. This is an embodiment of a core wire material that is attached integrally through a joint,
Further, the embodiment shown in FIG. 9 is similar to that shown in FIG. 6 above.
This is an embodiment of a wire of a deformed material 81' in which the surface of the surface material 6 of the Ti core wire 81 is further clad with a noble metal alloy 10, and the embodiment shown in FIG. 10 is similar to that shown in FIG. Example Ti metal base material 8
This is an embodiment of a wire rod 81 which is clad by applying a noble metal plating layer 11 to the surface of the surface layer material 6 of 1'.

又、第11図に示す実施例に於いてはTi金属
基材2′に対して、前述第5図に示す実施例同様
に、ラビリンス状の係合溝5,5…を形成し、表
層材6に於けるその内面に突出部を形成させず、
該係合溝5,5…に溝材7′,7″…を対応させて
適宜手段により圧入嵌合させ、両者の表面に表層
材6を緊結させたTi芯線材8″の態様である。
In addition, in the embodiment shown in FIG. 11, labyrinth-shaped engagement grooves 5, 5, . . . are formed on the Ti metal base material 2', as in the embodiment shown in FIG. No protrusion is formed on the inner surface of 6,
This is an embodiment of a Ti core wire 8'' in which groove members 7', 7'', . . . are made to correspond to the engagement grooves 5, 5, .

そして、第12図に示す実施例は上記係合溝
5,5…と溝材7′,7′…との間、及び、表層材
6との間に所定金属メツキ層9を介在させて表層
材6を緊結させたTi芯線材8の態様である。
In the embodiment shown in FIG. 12, a predetermined metal plating layer 9 is interposed between the engaging grooves 5, 5... and the groove members 7', 7'... and between the surface layer material 6. This is an embodiment of a Ti core wire 8 in which a material 6 is tightly bound.

而して、該溝材7′の材質は表層材6と同材質、
異材質等さまざまなものが採用可能である。
Therefore, the material of the groove material 7' is the same as that of the surface material 6,
Various materials such as different materials can be used.

而して、上述各実施例は基本的態様であるが、
具体的な実施例として表層材、又は、溝材にPd、
及び、PdにNiを20重量%以下含有する合金を使
用する態様があり、当該態様においてNiを20重
量%以下にするのは、20%以上では合金の展延性
が減少し、中間加工においてTi基材との結合力
を低下させ、接合部の剥離を生じせしめるためで
ある。
Therefore, each of the above-mentioned embodiments is a basic aspect, but
As a specific example, the surface layer material or the groove material is Pd,
There is also an embodiment in which an alloy containing 20% by weight or less of Ni in Pd is used. This is because it lowers the bonding force with the base material and causes peeling of the joint.

又、NiにPdを20重量%以下含有する合金を設
けることが出来、この場合も20%を越えると同様
に剥離を生ずるものである。
It is also possible to provide an alloy containing 20% by weight or less of Pd in Ni, and in this case too, peeling occurs if the content exceeds 20%.

更に又、NiにCuを30重量%以下含有する合金
を表層材、又は、溝材として用いることが出来る
が、この場合、30%を越えるとTi界面において
Cu、Niが共存拡散し、CuTiのもろい金属間化合
物が形成され、展延性に劣るからである 又、上述Ti金属基材2′に対しその係合溝5,
5′,5″を穿設形成させた後、金属メツキ層を形
成させる場合にはAg、Ni、Cu、Pd、Cr、Snの
少くとも一種類以上のメツキ処理を施すことが出
来る。
Furthermore, an alloy containing 30% by weight or less of Cu in Ni can be used as the surface layer material or groove material, but in this case, if the content exceeds 30%, it will cause damage at the Ti interface.
This is because Cu and Ni co-diffuse, forming a brittle intermetallic compound of CuTi, resulting in poor malleability.
When a metal plating layer is formed after forming the holes 5' and 5'', plating with at least one of Ag, Ni, Cu, Pd, Cr, and Sn can be performed.

而して、上述の如く、Ti金属基材2′に対し表
層材、又は、溝材を基材の係合溝5,5′,5″を
介して緊結されたTi芯線材の該表層材の外側に、
更に、貴金属合金をクラツドさせた軽量Ti金属
基材を実施例とすることが出来、この場合の貴金
属合金としてはAu、Ag、Pt、Pd、Rh、Ir、Ru
の内少くとも1種以上の貴金属を含む合金が採用
出来る。
As mentioned above, the surface layer material or the groove material of the Ti core wire material is tightly connected to the Ti metal base material 2' through the engagement grooves 5, 5', 5'' of the base material. outside of
Furthermore, a lightweight Ti metal base material clad with a noble metal alloy can be used as an example, and in this case, the noble metal alloy includes Au, Ag, Pt, Pd, Rh, Ir, and Ru.
An alloy containing at least one kind of noble metal can be used.

更に、別の実施例としては該貴金属材料のクラ
ツドに替えて表層材の表面に貴金属メツキを施し
たTi芯線材とすることが出来る。
Furthermore, as another embodiment, instead of the cladding made of the noble metal material, a Ti core wire material whose surface layer material is plated with a noble metal can be used.

したがつて、上述2実施例の表層材の外面にク
ラツドする貴金属合金は外層材とされ、表層材は
中間材となり、又、貴金属メツキ層も外層材とさ
れるものである。
Therefore, the noble metal alloy clad on the outer surface of the surface layer material in the above two embodiments is used as the outer layer material, the surface layer material is used as the intermediate material, and the noble metal plating layer is also used as the outer layer material.

而して、上述各実施例におけるTi芯線材にお
けるTi金属の体積比率は70%以上であるように
されるが、この場合、70%以下では重量が増加
し、初期目的の軽量材料の意味を失う。
Therefore, the volume ratio of Ti metal in the Ti core wire in each of the above-mentioned examples is set to be 70% or more, but in this case, if it is less than 70%, the weight increases and the initial purpose of the lightweight material is lost. lose.

又、Ti金属基材表面に加工して形成する係合
溝の占有面積比率は全体で基材表面積の90%以下
であるようにする。
Furthermore, the total area occupied by the engaging grooves formed on the surface of the Ti metal base material is set to be 90% or less of the surface area of the base material.

蓋し、90%以上では、Ti金属基材の係合溝の
ラビリンス形状が表層材の突出部、又は、溝材に
対してその緊結結合度を充分にすることが出来な
いからである。
This is because if the ratio is 90% or more, the labyrinth shape of the engagement groove of the Ti metal base material cannot provide a sufficient degree of tight bonding to the protrusion of the surface layer material or the groove material.

次に、又、そのラビリンス形状を複雑にしてそ
の面積を大にすることにより、例えば、線材等を
捩回して引き延ばしするような二次加工を行う場
合においても、Ti金属基材と表層材との機械的
剥離が容易には起らないように緊結度合を充分に
することが出来る。
Next, by complicating the shape of the labyrinth and increasing its area, even when performing secondary processing such as twisting and stretching wire rods, the Ti metal base material and surface layer material can be separated. The degree of tightness can be made sufficient so that mechanical peeling of the material does not occur easily.

尚、この出願の発明の実施態様は上述各実施例
に限るものではないことは勿論であり種々の態様
が採用可能である。
It goes without saying that the embodiments of the invention of this application are not limited to the above-mentioned embodiments, and various embodiments can be adopted.

<発明の効果> 以上、この出願の発明によれば、基本的に本来
的にはその軽量性等極めて優れているTi芯線材
において、Ti金属が活性化金属であることから、
クラツド材とした場合、基材と表層材の間のクラ
ツド境界面に剥離現象が容易に生じ易く、実使用
に耐えられなかつたものがTi金属基材とその表
層材との間に係合溝とこれに対向する突出部のラ
ビリンス状の係合がなされることにより機械的に
も強固な係合状態が現出されることから剥離がほ
とんど生ずることがなくなり、芯線材でありなが
ら接合状態が半永久的に維持出来るという優れた
効果が奏されるのみならず、結果的に剥離が生じ
ないために材料として初期の目的を達することが
出来、又、閉断面の表層材が中実断面の基材の全
表面に皮覆くされているため、意匠性の上でも審
美的からもその装飾的機能が低下しないという優
れた効果が奏され、又、電気部品や他の精密機械
加工部分の初期の機能が果されるという優れた効
果が奏される。
<Effects of the Invention> As described above, according to the invention of this application, since the Ti metal is an activated metal in the Ti core wire material, which is originally extremely excellent in terms of lightness, etc.
When used as a clad material, peeling easily occurs at the clad interface between the base material and the surface layer material, and if it cannot withstand actual use, an engagement groove is formed between the Ti metal base material and its surface layer material. The labyrinth-like engagement between the protrusion and the opposing protrusion creates a mechanically strong engagement state, so there is almost no peeling, and the bonded state is maintained even though it is a core wire material. Not only does it have an excellent effect of being able to be maintained semi-permanently, but as a result, no peeling occurs, so the initial purpose of the material can be achieved. Because the entire surface of the material is coated with leather, it has an excellent effect in terms of design and aesthetics without deteriorating its decorative function. The excellent effect of fulfilling the function of

而して、ろう付け加工を行つてクラツド材とす
る場合にも該ろう付けが初期の接合状態を維持す
るために結合状態が確実に保持出来るという優れ
た効果が奏される。
Therefore, even when brazing is performed to form a clad material, the brazing maintains the initial bonded state, so an excellent effect is achieved in that the bonded state can be reliably maintained.

このように、強固な結合性を保持出来るために
材料に対する信頼性が高く、張り素材、メツキ用
素材としても優れ、本来の軽量の性質を保持する
Ti金属基材の機能を充分に満足することが出来
る。
In this way, it maintains strong bonding properties, making it highly reliable as a material, making it excellent as a material for upholstery and plating, and retaining its original lightweight properties.
The functions of the Ti metal base material can be fully satisfied.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来技術に基づくTi金属クラツド材
料の剥離現象態様の断面図、第2図以下はこの出
願の発明の実施例の説明図であり、第2,3,4
図は基本的実施例のTi金属基材の係合溝形成断
面図、第5図は同基本的材料の断面図、第6,7
図は基本的異形材の断面図、第8,9,10図は
他の実施例の第5,6,7図相当断面図であり、
第11,12図は別の実施例の断面図である。 2′……Ti金属基材、6……表層材、8,8
1,81′,8′,8″,8,81″,81……
Ti芯線材、5……係合溝、7……突出部、7′…
…溝材、9……金属メツキ層、10……貴金属合
金クラツド層、11……貴金属メツキ。
FIG. 1 is a cross-sectional view of the exfoliation phenomenon of Ti metal clad material based on the prior art, and FIG. 2 and the following are explanatory views of embodiments of the invention of this application.
The figure is a cross-sectional view of the engagement groove formed in the Ti metal base material of the basic embodiment, Figure 5 is a cross-sectional view of the same basic material, and Figures 6 and 7 are
The figure is a sectional view of a basic deformed member, and Figures 8, 9, and 10 are sectional views corresponding to Figures 5, 6, and 7 of other embodiments,
11 and 12 are cross-sectional views of another embodiment. 2'...Ti metal base material, 6...surface layer material, 8,8
1,81',8',8'',8,81'',81...
Ti core wire, 5...engaging groove, 7...protrusion, 7'...
...Groove material, 9...Metal plating layer, 10...Precious metal alloy cladding layer, 11...Precious metal plating.

Claims (1)

【特許請求の範囲】 1 Ti金属基材に対し表層材を添設結合したTi
芯線材において、該Ti金属基材が中実断面に形
成され、その全表面の添設面の周方向に所定ピツ
チの係合溝が複数穿設され、而して閉断面の表層
材がその内側に形成され、該各係合溝に対応する
各突出部を係合溝に締結されてTi金属基材に添
設されていることを特徴とするTi芯線材。 2 上記表層材がNiであることを特徴とする特
許請求の範囲第1項記載のTi芯線材。 3 上記表層材がNi−Cr合金であることを特徴
とする特許請求の範囲第1項記載のTi芯線材。 4 上記表層材がPdであることを特徴とする特
許請求の範囲第1項記載のTi芯線材。 5 上記表層材がPdにNiを20重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
1項記載のTi芯線材。 6 上記表層材がNiにPdを20重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
1項記載のTi芯線材。 7 上記表層材がNiにCuを30重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
1項記載のTi芯線材。 8 Ti金属基材に対し表層材を添設結合したTi
芯線材において、該Ti金属基材が中実断面に形
成され、その全表面の添設面の周方向に所定ピツ
チの係合溝が複数穿設され、而して該各係合溝に
対して金属メツキ層を介して閉断面の表層材がそ
の内側に形成され該各係合溝に対応する突出部を
該係合溝に締結されてTi金属基材に添設されて
いることを特徴とするTi芯線材。 9 上記金属メツキ層がAg、Ni、Cu、Pd、Cr、
Snの少くとも一種のメツキ層であることを特徴
とする特許請求の範囲第8項記載のTi芯線材。 10 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して閉断面の表
層材がその内側に形成され、該各係合溝に対応す
る突出部を該係合溝に締結されてTi金属基材に
添設され、更に該表層材の外側に貴金属合金が外
装材としてクラツドされていることを特徴とする
Ti芯線材。 11 上記貴金属合金がAu、Ag、Pt、Pc、Pd、
Rh、Ir、Ruの内少くとも1種以上の貴金属を含
む合金であることを特徴とする特許請求の範囲第
10項記載のTi芯線材。 12 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して閉断面の表
層材がその内側に形成され、該各係合溝に対応す
る突出部を該係合溝に締結されてTi金属基材に
添設され、更に該表層材の表面に外装材として貴
金属メツキが施されていることを特徴とするTi
芯線材。 13 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して上記表層材
が係合溝に対する溝材の締結を介してTi金属基
材に添設されていることを特徴とするTi芯線材。 14 上記溝材がNiであることを特徴とする特
許請求の範囲第13項記載のTi芯線材。 15 上記溝材がNi−Cr合金であることを特徴
とする特許請求の範囲第13項記載のTi芯線材。 16 上記溝材がPdであることを特徴とする特
許請求の範囲第13項記載のTi芯線材。 17 上記溝材がPdにNiを20重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
13項記載のTi芯線材。 18 上記溝材がNiにPdを20重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
13項記載のTi芯線材。 19 上記溝材がNiにCuを30重量%以下含有す
る合金であることを特徴とする特許請求の範囲第
13項記載のTi芯線材。 20 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して該係合溝に
対して金属メツキ層を間にして閉断面の表層材が
該係合溝に対する溝材締結を介してTi金属基材
に添設されていることを特徴とするTi芯線材。 21 上記金属メツキ層がAg、Ni、Cu、Pd、
Cr、Snの内少くとも一種のメツキ層であること
を特徴とする特許請求の範囲第20項記載のTi
芯線材。 22 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して閉断面の表
層材が該係合溝に対する溝材締結を介してTi金
属基材に添設され、更に該表層材の外側に貴金属
合金が外装材としてクラツドされていることを特
徴とするTi芯線材。 23 上記貴金属合金はAu、Ag、Pt、Pd、Rh、
Ir、Ruの内少くとも1種以上の貴金属を含む合
金であることを特徴とする特許請求の範囲第22
項記載のTi芯線材。 24 Ti金属基材に対し表層材を添設結合した
Ti芯線材において、該Ti金属基材が中実断面に
形成され、その全表面の添設面の周方向に所定ピ
ツチの係合溝が複数穿設され、而して閉断面の表
層材が該係合溝に対する溝材締結を介してTi金
属基材に添設され、更に表層材表面に外装材とし
て貴金属メツキが施されていることを特徴とする
Ti芯線材。
[Claims] 1 Ti in which a surface layer material is attached and bonded to a Ti metal base material
In the core wire, the Ti metal base material is formed to have a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface, and the surface layer material of the closed cross section is 1. A Ti core wire material, which is attached to a Ti metal base material by being formed on the inner side and having respective protrusions corresponding to the respective engaging grooves fastened to the engaging grooves. 2. The Ti core wire according to claim 1, wherein the surface layer material is Ni. 3. The Ti core wire according to claim 1, wherein the surface layer material is a Ni-Cr alloy. 4. The Ti core wire according to claim 1, wherein the surface layer material is Pd. 5. The Ti core wire material according to claim 1, wherein the surface layer material is an alloy containing Pd and Ni in an amount of 20% by weight or less. 6. The Ti core wire material according to claim 1, wherein the surface layer material is an alloy containing Ni and Pd in an amount of 20% by weight or less. 7. The Ti core wire material according to claim 1, wherein the surface layer material is an alloy containing Ni and Cu in an amount of 30% by weight or less. 8 Ti with surface layer material attached to Ti metal base material
In the core wire, the Ti metal base material is formed to have a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface thereof, and a groove is formed for each engagement groove. A surface layer material with a closed cross section is formed on the inside thereof through a metal plating layer, and protrusions corresponding to each of the engagement grooves are fastened to the engagement grooves and attached to the Ti metal base material. Ti core wire material. 9 The metal plating layer is Ag, Ni, Cu, Pd, Cr,
The Ti core wire material according to claim 8, characterized in that it is at least one plating layer of Sn. 10 Surface layer material was added and bonded to Ti metal base material.
In the Ti core wire, the Ti metal base material is formed with a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface, and the surface layer material with a closed cross section is formed. A protrusion formed on the inside thereof, corresponding to each of the engagement grooves, is fastened to the engagement groove and attached to the Ti metal base material, and a noble metal alloy is further clad as an exterior material on the outside of the surface layer material. characterized by having
Ti core wire material. 11 The above noble metal alloy is Au, Ag, Pt, Pc, Pd,
11. The Ti core wire according to claim 10, which is an alloy containing at least one noble metal among Rh, Ir, and Ru. 12 A surface layer material was added and bonded to a Ti metal base material.
In the Ti core wire, the Ti metal base material is formed with a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface, and the surface layer material with a closed cross section is formed. The protrusion portions formed on the inside thereof and corresponding to the respective engagement grooves are fastened to the engagement grooves and attached to the Ti metal base material, and furthermore, the surface of the surface layer material is plated with precious metal as an exterior material. Ti characterized by
Core wire material. 13 Surface layer material was added and bonded to Ti metal base material
In the Ti core wire, the Ti metal base material is formed into a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attachment surface on the entire surface, so that the surface layer material is engaged with the Ti metal base material. A Ti core wire material, characterized in that the Ti core wire material is attached to a Ti metal base material through fastening of a groove material to the groove. 14. The Ti core wire according to claim 13, wherein the groove material is made of Ni. 15. The Ti core wire according to claim 13, wherein the groove material is a Ni-Cr alloy. 16. The Ti core wire according to claim 13, wherein the groove material is made of Pd. 17. The Ti-core wire material according to claim 13, wherein the groove material is an alloy containing Pd and Ni in an amount of 20% by weight or less. 18. The Ti-core wire material according to claim 13, wherein the groove material is an alloy containing Ni and Pd in an amount of 20% by weight or less. 19. The Ti core wire material according to claim 13, wherein the groove material is an alloy containing Ni and Cu in an amount of 30% by weight or less. 20 The surface layer material was added and bonded to the Ti metal base material.
In the Ti core wire, the Ti metal base material is formed into a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface thereof, and the engagement grooves are A Ti core wire material characterized in that a surface layer material having a closed cross section is attached to a Ti metal base material through a groove material fastened to the engagement groove with a metal plating layer in between. 21 The metal plating layer is Ag, Ni, Cu, Pd,
Ti according to claim 20, which is a plating layer of at least one of Cr and Sn.
Core wire material. 22 A surface layer material was added and bonded to a Ti metal base material.
In the Ti core wire, the Ti metal base material is formed with a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface, and the surface layer material with a closed cross section is formed. A Ti core wire material attached to a Ti metal base material through a groove material fastened to the engagement groove, and further comprising a noble metal alloy clad as an exterior material on the outside of the surface layer material. 23 The above noble metal alloys include Au, Ag, Pt, Pd, Rh,
Claim 22, characterized in that it is an alloy containing at least one kind of noble metal among Ir and Ru.
Ti core wire material as described in section. 24 Surface layer material was attached and bonded to Ti metal base material.
In the Ti core wire, the Ti metal base material is formed with a solid cross section, and a plurality of engagement grooves of a predetermined pitch are bored in the circumferential direction of the attached surface on the entire surface, and the surface layer material with a closed cross section is formed. It is attached to the Ti metal base material through the groove material fastened to the engagement groove, and further, the surface layer material is plated with precious metal as an exterior material.
Ti core wire material.
JP5725184A 1984-03-27 1984-03-27 Light-weight ti metallic material Granted JPS60201942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5725184A JPS60201942A (en) 1984-03-27 1984-03-27 Light-weight ti metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5725184A JPS60201942A (en) 1984-03-27 1984-03-27 Light-weight ti metallic material

Publications (2)

Publication Number Publication Date
JPS60201942A JPS60201942A (en) 1985-10-12
JPH0345703B2 true JPH0345703B2 (en) 1991-07-11

Family

ID=13050306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5725184A Granted JPS60201942A (en) 1984-03-27 1984-03-27 Light-weight ti metallic material

Country Status (1)

Country Link
JP (1) JPS60201942A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225724A (en) * 1985-07-26 1987-02-03 Tanaka Kikinzoku Kogyo Kk Composite material for spectacle frame
IT1282182B1 (en) * 1995-01-20 1998-03-16 Ronda Europa Spa METALLIC BACK WITH VARIABLE THICKNESS ESPECIALLY FOR PANS OR SIMILAR

Also Published As

Publication number Publication date
JPS60201942A (en) 1985-10-12

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