JPH0345U - - Google Patents
Info
- Publication number
- JPH0345U JPH0345U JP5797489U JP5797489U JPH0345U JP H0345 U JPH0345 U JP H0345U JP 5797489 U JP5797489 U JP 5797489U JP 5797489 U JP5797489 U JP 5797489U JP H0345 U JPH0345 U JP H0345U
- Authority
- JP
- Japan
- Prior art keywords
- package
- type
- leads
- disposed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係るＩＣパツケージの側面図
、第２図は平面図、第３図は一部拡大図である。
１…ＩＣパツケージ本体、２…リード部、３…
突起部、Ｐ…プリント基板。
FIG. 1 is a side view of an IC package according to the present invention, FIG. 2 is a plan view, and FIG. 3 is a partially enlarged view. 1...IC package body, 2...lead part, 3...
Projection, P...Printed circuit board.
Claims (1)
いて、ＩＣパツケージのリード間に絶縁性の突起
部をＩＣパツケージと一体成形して配設したこと
を特徴とするＩＣパツケージ。 1. A DIP type or SOP type IC package, characterized in that an insulating protrusion is integrally molded with the IC package and disposed between the leads of the IC package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5797489U JPH0345U (en) | 1989-05-19 | 1989-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5797489U JPH0345U (en) | 1989-05-19 | 1989-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345U true JPH0345U (en) | 1991-01-07 |
Family
ID=31583171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5797489U Pending JPH0345U (en) | 1989-05-19 | 1989-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186614U (en) * | 1987-05-20 | 1988-11-30 |
-
1989
- 1989-05-19 JP JP5797489U patent/JPH0345U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186614U (en) * | 1987-05-20 | 1988-11-30 |