JPH0346558B2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a rotary electrolytic plating device.

[Conventional technology and issues to be solved]

Conventionally, when plating minute parts, as shown in the first diagram, a mesh basket 2 is suspended in the electrolytic plating solution 1 in a plating tank, and the material to be plated is placed in this basket, or as shown in the second diagram. As shown, the barrel 4 is rotated in the electrolytic plating solution 3 in the plating tank, and the material to be plated is placed inside the barrel 4. In these conventional examples, in the first example, parts smaller than the mesh cannot be plated, and in the second example, parts smaller than the hole drilled in the barrel cannot be plated. Ta. At times, plating of micron and submicron powders and particles has been completely impossible. On the other hand, an electrolytic solution, carbon grains, and a workpiece are stored in a tumbler equipped with a pair of current-carrying electrodes, and electricity is applied to the stored items while stirring and mixing by applying rotation or vibration, and the workpiece is tumbled. An electric field tumbling device (for example, the electric field tumbling device (for example, the
46-9914) is known. However, this known electrolytic tumbling device
Since the current-carrying electrodes are provided on both sides of the cylindrical tumbler, it is not possible to allow the internal workpiece to touch only the electrodes, especially the cathode electrodes, so this method cannot be directly applied to electrolytic plating equipment. However, it was virtually impossible to plate the workpiece.

[Purpose of the invention]

SUMMARY OF THE INVENTION In view of the above-mentioned state of the known technology, it is an object of the present invention to provide an electrolytic plating device that can efficiently plate even fine objects such as powder and particles.

[Means for Achieving the Object] In order to achieve the above object, the electrolytic plating device according to the present invention has a hollow cylindrical shape that encloses an electrolytic plating solution and a large number of materials to be plated, and is rotatably driven in a horizontal position. A rotating tank, a cathode electrode which is provided on the inner peripheral surface of the rotating tank and comes into contact with the material to be plated one after another as the rotating tank rotates, and a cathode electrode which is provided in the hollow of the rotating tank and is constantly exposed to the electrolytic plating solution when the rotating tank rotates. It consists of an anode electrode provided at a position to be immersed. The rotating tank is preferably formed in a polygonal shape. Furthermore, the cathode electrode on the inner circumferential surface of the rotary tank is more preferably provided with irregularities to encourage rolling movement of the material to be plated when the rotary tank is rotated.

【Example】

The present invention will now be described in detail with reference to the preferred embodiments illustrated in the accompanying drawings. In FIG. 3, a hollow hexagonal cylinder-shaped rotary tank 7 is rotatably supported by support plates 5 and 6. The rotating tank 7 is rotatably driven in one direction via gears 8 and 9 by the operation of a drive motor (not shown). A cable 10 is provided on the side surface of the support plate 6 for energizing internal electrodes, which will be described later. Inside the rotating tank 7, as shown in the fourth figure, an anode electrode 11 and cathode electrodes 12 to 17 are provided. That is, the cathode electrodes 12 to 17 are provided on the inner circumferential surface of the rotating tank 7, and are configured so that as the rotating tank 7 rotates, the material to be plated 18 in the rotating tank 7 undergoes rolling motion and comes into contact with them one after another. ing. On the other hand, the anode electrode 11 is provided in the hollow of the rotating tank 7 in order to maintain a non-contact state with the rotating tank 7.
It is provided so that it is always immersed in the electrolytic plating solution 19 during rotation. In addition, to remove the gas generated during plating,
A hole 21 is provided in the side wall 20 of the rotary tank 7 as shown in the fifth figure, and a hole 21 is provided in the plate 22 fixed to the support plate 5 shown in the third figure and in close contact with the side wall 20 as shown in the fifth and sixth figures. 23 is formed. Hole 22 is configured to face hole 23 when it is at top dead center. Therefore, the holes 22 and 23 face each other and communicate with each other every time the rotating tank 7 rotates once. The operation of the electrolytic plating apparatus according to the present invention configured as above will be explained. A predetermined amount of the electrolytic plating liquid 19 and the material to be plated 18 are sealed in the rotating tank 7, and the rotating tank 7 is operated by a drive motor while supplying electricity to the anode electrode 11 and the cathode electrodes 12 to 17 via the cable 10, for example. Rotate in the direction of the arrow in Figure 4. As the rotary tank 7 rotates, the material to be plated 18 inside performs a rolling motion while being biased toward the lower right corner, and comes into contact with the electrode located at the lower right among the cathode electrodes 12 to 17. By repeating this rolling motion of the material to be plated 18, the entire material to be plated 18 repeatedly comes into contact with the cathode electrodes 12 to 17 almost uniformly, and plating is formed on the surface when it comes into contact with the cathode electrodes 12 to 17. Every time the rotary tank 7 rotates once, the gas generated when plating is removed from the holes 22 and 22 as shown in FIG.
When they face each other and communicate, they will escape from this hole. Although all of the cathode electrodes 12 to 17 may be energized, it is also possible to selectively energize only the electrodes located below, taking into account the above-mentioned behavior of the material 18 to be plated. A known brush device or slide mechanism can be applied to such selective energization. The rotary tank 7 is not limited to the hexagonal shape of this embodiment, but is
It is also possible to have a cylindrical shape like the illustrated rotating tank 24. In this case, stirring or rolling movement of the material 25 to be plated inside becomes difficult to occur, so as a countermeasure for this, if unevenness 32 is provided on the surface of the cathode electrodes 26 to 31 shown in FIG. It is possible to efficiently stir or roll the material 25. Of course, this unevenness 32
Needless to say, these may be provided on the cathode electrodes 12 to 17 in the embodiment shown in FIG.
It is possible to further promote stirring or rolling motion of the mixture.

【Effect of the invention】

According to the electrolytic plating apparatus according to the present invention, the cathode electrode is provided on the inner circumferential surface of the rotating tank so that the material to be plated comes into contact with the inner peripheral surface of the rotating tank sequentially as the rotating tank rotates, and the anode electrode is provided in the hollow part of the rotating tank. Since it is provided at a position where it is always immersed in the electrolytic plating solution when the rotary bath is rotated, it is possible to uniformly plate a large number of minute parts.

[Brief explanation of drawings]

1 and 2 are explanatory diagrams of the conventional example, FIG. 3 is a perspective view of the first embodiment of the present invention, FIG. 4 is a cross-sectional view of the rotating tank in the above embodiment, and FIG. 5 is the same rotating tank as above. FIG. 6 is a side view of the rotary tank, and FIG. 7 is a cross-sectional view showing another embodiment of the rotary tank. 7...Rotating tank, 11...Anode electrode, 12-17
... Cathode electrode, 18 ... Material to be plated, 19 ... Electrolytic plating liquid, 24 ... Rotating tank, 25 ... Material to be plated, 26 to 31 ... Cathode electrode, 32 ... Irregularities.

Claims (1)

[Scope of Claims] 1. A hollow cylindrical rotary tank that encloses an electrolytic plating solution and a large number of materials to be plated and is driven to rotate in a horizontal position; A cathode electrode with which the material to be plated contacts successively as the tank rotates, and an anode electrode provided in the hollow of the rotating tank and at a position where it is always immersed in the electrolytic plating solution when the rotating tank rotates. Electrolytic plating equipment. 2. The electrolytic plating apparatus according to claim 1, wherein the rotating bath is polygonal. 3. The electrolytic plating apparatus according to claim 1 or 2, wherein irregularities are formed on the cathode electrode to encourage rolling movement of the material to be plated during rotation of the rotating bath.