JPH0347595B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a flexible circuit board, and particularly to a method for manufacturing a flexible circuit board that is thin, highly flexible, and small in shape, and a method for manufacturing a flexible circuit board that is easy to handle. Regarding.

In some types of flexible circuit boards, an adhesive is previously provided on the back surface of necessary parts such as terminal portions, and the flexible circuit board is adhered to and mounted on equipment using this adhesive. Such flexible circuit boards are shipped with appropriate release paper attached to the adhesive part, but if the product is particularly thin, small, and highly flexible, it may be shipped with release paper attached. If the products are individually punched out according to their external shapes, the products will be stuck together, making handling in the punching process, inspection process, etc. complicated, and making it difficult to count the number of products. Furthermore, when mounting such a flexible circuit board, there is a problem in handling that a very small area of release paper must be removed using tweezers or the like, which increases the number of man-hours. And the difficulty of handling such flexible circuit boards,
It can also cause damage to the product, such as wrinkles and bending, during various operations.

The present invention provides a method for manufacturing a flexible circuit board that suitably solves these problems, and is characterized by the fact that a plurality of required flexible circuit boards to be made into a product are mounted on a flexible base material. After cutting off unnecessary parts of the base material between the flexible circuit boards so as to leave both sides of the flexible base material in the direction in which the flexible circuit boards are arranged, the terminal section of each flexible circuit board is removed. A release sheet is attached to the back surface of the base material with an adhesive provided on the back surface portion corresponding to , and then both sides of the flexible base material are cut off and a large number of only the flexible circuit boards are placed on the release sheet. The reason is that they are arranged so that they can be separated into pieces.

The drawings show preferred embodiments thereof.
In the figure, 1 indicates a long flexible base material such as a flexible copper-clad laminate, and on this base material 1, a large number of flexible circuit boards 2 to be made into products are placed on both sides of the flexible base material 1 according to a conventional method. It is formed so as to leave an appropriate margin in the portion 6. Terminal portions 3 of each of these flexible circuit boards 2
are formed in alignment on both sides 6 of the flexible base material 1. Each circuit board 2 has, for example, a required wiring pattern 4 formed between terminal portions 3 as shown in the figure, and the flexible portion 5 may be surface-coated with a film or ink as necessary. can. When manufacturing a particularly thin and highly flexible flexible circuit board 2, both sides 6 of the base material 1 shown with diagonal lines are shown with diagonal lines to ensure ease of handling in each process and to prevent wrinkles or bending. It is also preferable to leave copper foil or the like on unnecessary parts 7 located between each circuit board 2, or to cover these parts 6 and 7 with a reinforcing layer in advance using a material such as resin. . Conventionally, each circuit board 2 is individually punched out along the product outline at this stage, but in the present invention, preferably, the terminal portion of each circuit board 2 is punched out as shown in FIGS. 1 and 2. It is preferable to provide an adhesive 9 on the back side of the base material 1 corresponding to No. 3, and apply a tape-like release sheet 8 on the adhesive 9. Then, as shown in FIG. Only unnecessary portions 7 are cut out by punching or the like, except for both side portions 6. As a result, each circuit board 2 is supported in a continuous manner between both sides 6 of the base material 1, and there is no fear that each circuit board 2 will come apart. Therefore, the tape-like release sheet 8 is peeled off, and a release sheet 10 corresponding to the width of the base material 1 is attached as shown in FIGS. 3 and 4. This release sheet 10 is pasted with the adhesive 9 left on the terminal portion 3 of each circuit board 2 and the back surface of both side portions 6 of the base material 1 by the punching process described above. and,
Both sides 6 of the base material 1 shown with diagonal lines in FIG.
When both sides of the release sheet 10 are cut along the lines, a finished product can be obtained in which only the circuit boards 2 that will become the product are aligned on the release sheet 10A, as shown in FIG.

Since each flexible circuit board 2 is arranged on the release sheet 10A with the adhesive 9 provided only on the back side of the terminal portion 3, each circuit board 2 can be easily removed from the release sheet 10A during mounting. It can be peeled off and quickly assembled into equipment as a product with adhesive, making it much easier to handle than before and allowing for highly efficient mounting processing without causing wrinkles or bends to the product during work. In addition, as a means to further facilitate the peeling off of the circuit board 2, as shown by the imaginary line in FIG.
A suitable through hole 1 partially located in each circuit board 2
1 is preferably provided on the release sheet 10 in advance,
This effectively eliminates the risk of inadvertently causing damage to the product, such as wrinkles, scratches, or bending, during stripping, and also helps increase efficiency.

According to the method of the present invention, a large number of flexible circuit boards that become products can be manufactured in a state where they are lined up on a mold release sheet, so there is no risk of the products being pinched together as in the past, and the products can be manufactured in sheet form. The inspection process can be efficiently processed all at once, and the number of people can be counted extremely easily, resulting in a significant reduction in man-hours. In addition to eliminating the fear of damaging the product during the process, handling at the time of shipment can be facilitated and processed efficiently, and workability during mounting can be significantly improved.

[Brief explanation of drawings]

Figures 1 and 2 show a state in which a large number of flexible circuit boards are formed on a base material according to the present invention, and then an adhesive and a tape-like release sheet are pasted on the back surface corresponding to the terminal portion of each circuit board. A partial perspective view and an enlarged cross-sectional view of the main parts, and FIGS. 3 and 4 conceptually show the process after cutting off unnecessary parts between each circuit board, leaving both sides of the base material, and then peeling off the tape-like release sheet. A perspective view and a cross-sectional view similar to the above, with a release sheet of the same width as the base material attached, and Figure 5 shows a finished product obtained by cutting both sides of the base material in Figure 4. FIG. 1... Flexible base material, 2... Flexible circuit board, 3... Terminal section, 4... Wiring pattern,
5... Flexible portion, 6... Both sides of base material, 7... Unnecessary portion, 8... Tape-like release sheet, 9... Adhesive, 10... Release sheet, 11... Through hole.

Claims (1)

[Scope of Claims] 1. A plurality of required flexible circuit boards to be a product are formed on a long flexible base material made of a flexible copper-clad laminate, leaving margins at both ends of the flexible base material. , the terminal portions of each of these flexible circuit boards are aligned and formed on both ends of the flexible base material, and the terminals of each of the flexible circuit boards are formed so as to leave both ends of the flexible base material in the direction in which the flexible circuit boards are arranged. After cutting out the unnecessary parts of the base material between the circuit boards, with adhesive applied to the back part corresponding to the terminal part of each flexible circuit board, a width corresponding to the width of this base material is placed on the back side of the base material. A method for manufacturing a flexible circuit board, comprising: pasting a release sheet, then cutting off both side ends of the flexible base material, and arranging a large number of the flexible circuit boards on the release sheet in a releasable manner. 2. After affixing a tape-like release sheet to the back surface of the base material including the terminal portions of each flexible circuit board via an adhesive, an unnecessary base material portion between each of the flexible circuit boards is removed. 2. The method of manufacturing a flexible circuit board according to claim 1, further comprising the step of cutting the tape-like release sheet and then adhering the release sheet to the back surface of the base material. 3. The method for manufacturing a flexible circuit board according to claim 1 or 2, which comprises forming a reinforcing layer in advance in a portion of the flexible base material other than the formation area of each flexible circuit board. 4. The method of manufacturing a flexible circuit board according to any one of claims 1 to 3, wherein a through hole located partially in the outer shape of each flexible circuit board is formed in the release sheet.