JPH0348218U - - Google Patents
Info
- Publication number
- JPH0348218U JPH0348218U JP10850589U JP10850589U JPH0348218U JP H0348218 U JPH0348218 U JP H0348218U JP 10850589 U JP10850589 U JP 10850589U JP 10850589 U JP10850589 U JP 10850589U JP H0348218 U JPH0348218 U JP H0348218U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- cylindrical
- component body
- shaped electronic
- cylindrical chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に実施例による筒形チツプ状
電子部品の半田付前の断面図である。第２図はそ
の半田付後の一部断面図である。第３図は従来の
筒形チツプ状電子部品の半田付前の断面図である
。第４図は半田付後の一部断面図であり、電極ラ
ウンド上で筒形チツプ状電子部品が立ち上がる現
象、いわゆるマンハツタン現象が起こつた状態を
示す。第５図は基板上のパターンに筒形チツプ状
電子部品を搭載した状態の斜視図である。
なお図面に用いられている符号について、１７
……金属キヤツプ、２０……クリーム半田、２１
……電極パターンラウンド、１９……樹脂被覆膜
である。
FIG. 1 is a sectional view of a cylindrical chip-shaped electronic component according to an embodiment of this invention before soldering. FIG. 2 is a partial sectional view after soldering. FIG. 3 is a sectional view of a conventional cylindrical chip-shaped electronic component before soldering. FIG. 4 is a partial cross-sectional view after soldering, showing a phenomenon in which a cylindrical chip-shaped electronic component stands up on an electrode round, a so-called Manhattan phenomenon. FIG. 5 is a perspective view of a cylindrical chip-shaped electronic component mounted on a pattern on a substrate. Regarding the symbols used in the drawings, 17
...Metal cap, 20...Cream solder, 21
... Electrode pattern round, 19 ... Resin coating film.
Claims (1)
ヤツプを嵌着し、前記電子部品素体の露出部分に
絶縁被膜層を設けた筒形電子部品に於て、金属キ
ヤツプの外周面に突出部を設けたことを特徴とす
る筒形チツプ状電子部品。 In a cylindrical electronic component in which metal caps serving as connection terminals are fitted on both end faces of an electronic component body and an insulating coating layer is provided on the exposed portion of the electronic component body, a protruding portion is formed on the outer peripheral surface of the metal cap. A cylindrical chip-shaped electronic component characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10850589U JPH0512999Y2 (en) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10850589U JPH0512999Y2 (en) | 1989-09-16 | 1989-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0348218U true JPH0348218U (en) | 1991-05-08 |
| JPH0512999Y2 JPH0512999Y2 (en) | 1993-04-06 |
Family
ID=31657144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10850589U Expired - Lifetime JPH0512999Y2 (en) | 1989-09-16 | 1989-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0512999Y2 (en) |
-
1989
- 1989-09-16 JP JP10850589U patent/JPH0512999Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0512999Y2 (en) | 1993-04-06 |