JPH0348742U - - Google Patents
Info
- Publication number
- JPH0348742U JPH0348742U JP1989110033U JP11003389U JPH0348742U JP H0348742 U JPH0348742 U JP H0348742U JP 1989110033 U JP1989110033 U JP 1989110033U JP 11003389 U JP11003389 U JP 11003389U JP H0348742 U JPH0348742 U JP H0348742U
- Authority
- JP
- Japan
- Prior art keywords
- base
- pressure
- sensor
- groove
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案による半導体圧力センサの１実
施例を示す断面図、第２図は第１図の寸法関係を
示す一部断面図、第３図及び第４図はそれぞれ従
来例の断面図である。 １……センサペレツト、４……パツケージ基体
、５……大気圧導入口、１１……溝、１３……接
着剤。
施例を示す断面図、第２図は第１図の寸法関係を
示す一部断面図、第３図及び第４図はそれぞれ従
来例の断面図である。 １……センサペレツト、４……パツケージ基体
、５……大気圧導入口、１１……溝、１３……接
着剤。
Claims (1)
- 【実用新案登録請求の範囲】 圧力導入口を有するパツケージ基体の上面に感
圧用ダイヤフラム部を持つセンサペレツトを前記
圧力導入口を覆うように装着してなる半導体圧力
センサにおいて、 前記基体の上面の前記圧力導入口の外側に環状
に凹設された溝と、該溝に充填された接着剤とを
備え、前記センサペレツトの環状底面の外側又は
内側を前記溝の側縁の前記基体の上面に当接する
と共に、前記環状底面の内側又は外側を前記接着
剤に接着し、前記センサペレツトを前記基体に固
着した半導体圧力センサ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989110033U JPH0348742U (ja) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989110033U JPH0348742U (ja) | 1989-09-20 | 1989-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348742U true JPH0348742U (ja) | 1991-05-10 |
Family
ID=31658590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989110033U Pending JPH0348742U (ja) | 1989-09-20 | 1989-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348742U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012073233A (ja) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | センサ装置及び半導体センサ素子の実装方法 |
| KR200471279Y1 (ko) * | 2012-06-29 | 2014-02-12 | 허창인 | 쉬트의 길이 측정 및 재단이 가능한 권취기 |
-
1989
- 1989-09-20 JP JP1989110033U patent/JPH0348742U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012073233A (ja) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | センサ装置及び半導体センサ素子の実装方法 |
| KR200471279Y1 (ko) * | 2012-06-29 | 2014-02-12 | 허창인 | 쉬트의 길이 측정 및 재단이 가능한 권취기 |